conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others.

The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers.

Congatec conga-HPC/cBLS specifications:

• Bartlett Lake-S SoC
  • Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W
  • Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / 3.7 GHz (Turbo), 20MB cache, 24 EU Intel UHD Graphics 770; PBP: 65W
  • Intel Core 7 251E 24-core processor with 8x P-cores @ 2.1 GHz / 5.6 GHz (Turbo), 16x E-cores @ 1.6 GHz / 4.4 GHz (Turbo), 36MB cache, 32 EU Intel UHD Graphics 770; PBP: 65W
• System Memory – 4x SO-DIMM sockets for DDR5 memory modules up to 32 GB each, or 128 GB RAM in total (ECC Support on selected product variants)
• Storage – 32Mbit SPI flash for AMI BIOS
• Networking – 2x 2.5 GbE with TSN support via Intel i226 Ethernet controller series
• 2x 400-pin connectors as per COM-HPC standard with
  • Storage – 2x SATA (and PCIe see below)
  • Video Interfaces – 3x DDI | eDP
  • USB
    • 4x USB 3.2 Gen2x2
    • 8x USB 2.0
  •  PCIe
    • PCIe Gen 5 x16  (PEG port)
    • 3x PCIe Gen 4 x4
    • Up to 3x PCIe Gen 3 x4
    • PCIe Gen3 x1
  • Low Speed I/Os – 2 x UART, 12x GPIOs
• congatec Board Controller
  • Multi-stage watchdog
  • non-volatile user data storage
  • Manufacturing and board information
  • Board Statistics
  • I²C bus (fast mode, 400 kHz, multi-master)
  • Power Loss Control
  • Hardware health monitoring
  • POST code redirection
• Security – Trusted Platform Module (TPM 2.0)
• BIOS features – LCD Control, Display Auto Detection, Backlight Control, Flash Update
• Power Management – ACPI 5.0a with battery support
• Dimensions – 160 x 120 mm (COM-HPC Client Size C)
• Temperature Range – Operating: 0°C to 60°C; storage: -20°C to 80°C
• Humidity – Operating: 10 to 85% r. H. non-cond.; storage 5 to 85% r. H. non-cond.

The company mentions support for Microsoft Windows 11, Windows 11 IoT Enterprise, Windows 10, Windows 10 IoT Enterprise, Linux, Yocto, and the RTS Real-Time Hypervisor. Since Intel announced so many new processors at CES 2025, I initially thought the Intel Core 7 251E, Core 5 211E, and Core 3 201E “Bartlett Lake-S” processors would be part of it, but they aren’t on Intel Ark just yet. Having said that, I can find the Intel 7 251E mentioned in the Intel Core Processors (Series 2) Edge product brief, where Intel explains it delivers 1.06x better single-core performance and 1.08x better multi-threaded performance compared to an Intel Core i7-14700.

Congatec also provides the conga-HPC/uATX-Client application carrier board for COM-HPC Client Type modules (Sizes A, B, C) for evaluation and early software development.

Congatec did not provide availability and pricing information. You’ll find additional information on the product pages for the module and the micro-ATX carrier board. The company will also showcase its new solutions at Embedded World 2025 in Hall 3 at Stand 241 on March 11-13.

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