Congatec conga-TCR8 AMD Ryzen Embedded 8000 COM Express computer-on-module series delivers up to 39 TOPS of AI performance

Congatec has released a new line of Ryzen Embedded 8000-powered COM Express Type 6 Compact computer-on-modules with the conga-TCR8 module series offering up to 39 tera operations per second (TOPS) for AI inference and 128GB of DDR5-5600 memory with error correction code (ECC) for data-sensitive and data-critical applications.

The Ryzen Embedded 8000 processor series comes with either six or eight ‘Zen 4’ cores, an integrated XDNA neural processing unit (16 TOPS), and the AMD Radeon RDNA 3 graphics unit which can be used as a general-purpose graphics processing unit with up to 12 compute units (adding up to 39 TOPS for the SoC).

Graphics output is supported by four displays with up to 8K resolution, and peripheral options include six PCIe Gen 4 slots, four USB 3.2 Gen 2 ports, four USB 2.0 ports, and three DisplayPort interfaces.

The conga-TCR8 Type 6 modules are intended for high-volume applications that require a “combination of advanced AI, graphics, and computing power.” These include medical imaging, test, and measurement equipment, AI-integrated point-of-sale/point-of-interaction (POS/POI) systems, and professional gaming hardware.

The modules have a broad TDP range of 15 to 54W and can be used in upgrading existing designs. Congatec’s previous COM offerings include the conga-TC675r, conga-TR4, conga-TCA7, and the conga-TS570 modules. We have covered other Ryzen Embedded 8000-based boards such as the Solid Bedrock R8000 and the ASRock IMB-A8000.

Congatec conga-TCR8 specifications:

• AMD Ryzen Embedded 8000 Series; TDP: 15 – 54W
  • AMD Ryzen Embedded 8640U (6 cores, 3.2GHz up to 4.9GHz, 22MB cache)
  • AMD Ryzen Embedded 8645HS (6 cores, 4.3GHz up to 5GHz, 22MB cache)
  • AMD Ryzen Embedded 8840U (8 cores, 3.3GHz up to 5.1GHz, 24MB cache)
  • AMD Ryzen Embedded 8845HS (8 cores, 3.8GHz up to 5.1GHz, 24MB cache)
• Graphics – Integrated AMD Radeon RDNA 3 Graphics with up to 12 CUs
• NPU – Integrated XDNA NPU with up to 16 TOPS (Up to 39 TOPS total SoC performance)
• System Memory – Up to 64GB DDR5 via 2x SO-DIMM sockets, up to 5600 MT/s, with ECC option
• Storage – 2x SATA 6GB/s, onboard NVME SSD up to 1TB capacity
• Video Output
  • 3x DDI up to 3840 x 2160
  • LVDS/eDP
  • Up to 4x independent displays
• Audio – High-Definition Audio Interface
• Networking – 2.5 Gbps Gigabit Ethernet via Intel I226 controller
• USB – 4x USB 2.0, 4x USB 3.2 Gen 2
• Serial Port – 2x 2-Wire UART (Tx/Rx)
• Security – TPM 2.0
• Expansion
  • 6x PCIe Gen 4 (8 lanes), PEG x8 Gen 4
  • 8-bit GPIO, 1x GPSPI
  • 1x I2C, 1x SM-Bus, 1x LPC
• Misc – AMI UEFI BIOS with Wake on LAN, 32 Mbyte serial SPI, multi-stage watchdog timer
• Power Management – ACPI 6.0 with battery support
• Dimensions – 95 x 95mm (COM Express Type 6 Compact form factor)
• Weight – TBD
• Temperature Range
  • Operating – 0°C to 60°C
  • Storage – -20°C to 80°C
• Humidity
  • Operating – 10% ~ 85% relative humidity, non-condensing
  • Storage – 5% ~ 85% relative humidity, non-condensing

Congatec offers the new COM Express Type 6 modules as application-ready aReady.COMs, with pre-installed and validated operating systems like Windows 11, Windows 11 IoT Enterprise, Windows 10, Windows 10 IoT Enterprise, ctrlX OS, Ubuntu, and RTLinux, and optional hardware partitioning via aReady.VT and IoT building blocks via aReady.IOT. RTS Real-Time Hypervisor is also supported.

You can find other information about congatec’s Ryzen Embedded 8000 COM Express Compact computer-on-modules and associated products on the product page. Pricing for the Congatec conga-TCR8 series and value-added offerings is available on request.

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