xMEMS XMC-2400 is a 1mm-thin solid-state micro cooling fan-on-a-chip for ultrathin devices and SSDs

xMEMS Labs XMC-2400 is a vibration-free, solid-state micro cooling fan-on-a-chip that’s just 1mm thin and designed to cool the processor, other chips, and batteries on space-constraints devices such as smartphones, tablets, extended reality headsets, laptops, as well as SSDs.

The XMC-2400 can deliver up to 39cc/sec airflow and up to 1,000Pa back pressure per instance while remaining inaudible and only consuming an estimated 30mW. It’s also rated IP58 for water and dust resistance. It leverages the manufacturing process the company has been using for its ultrathin MEMS speakers.

xMEMS XMC-2400 specifications:

• Top-venting and side-venting packages for flexible integration in different system form-factors
• Bi-directional flow rate, adjustable up to 39cc/sec
• Inaudible; all mechanical operation is at ultrasonic frequencies
• Power consumption – 30mW (estimated)
• Dimensions –  9.26 x 7.6 x 1.08 mm
• Weight – 150 mg
• SMT-reflowable
• Ingress Protection – IP58

Two packages will be offered:

• XMC-2400-S – Side-Vented Package supports chip-stacking with the application processor; A “heat spreader” can be used as a lid to transfer heat from the “heat source”. Cold air flows from bottom vent holes (8 of them), striking the “heat spreader” and discharging the “hot air” to the side opening.
• XMC-2400 – Top-Vented Package which lets the airflow go through slits on the lid to blow on the ”heat source” to cool down

It’s not the first time we’ve come across a “solid-state active cooling solution“,  as we covered the Airjet cooling chips last year which can dissipate up to 5W or 10W depending on the model and are suitable for laptops and mini PCs such as the Zotac PI430AJ Pico.

The xMEMS XMC-2400 is a much smaller chip better suited for systems with lower power dissipation but that may still benefit from cooling for sustained performance, improved reliability, etc… xMEMS Labs provided a comparison table between the XMC-2400 and the AirJet Mini Slim (5W dissipation).

While the raw numbers are still better for the Airjet Mini, the XMC-2400 micro cooling fan-on-a-chip is impressive when taking into account the relative performance, as it’s only a 1/39th in size, delivers 16 times better cooling efficiency, and consumes significantly less power.

One benefit of the Airjet chip is that it’s available now, although it’s not used extensively so far likely due to its price (it adds $100+ to the aforementioned Zotac mini PC) and power consumption (1W per chip). The xMEMS XMC-2400 micro cooling fan-on-a-chip still has to prove itself, and samples are only expected in Q1 2025 with mass production following suit in 2026. Additional information may be found on the product page and in the press release. The xMEMS XMC-2400 will also be demonstrated to “lead customers and partners” next month during live events in Shenzhen and Taipei.

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