Tungsten700 SMARC SoM and devkit features MediaTek Genio 700 AIoT processor

Laird Connectivity Tungsten700 SOM is a SMARC system-on-module powered by a MediaTek Genio 700 Arm Cortex-A78/A55 AIoT processor with up to 8GB LPDDR4, 16GB eMMC flash, and a Sona MT320 Wi-Fi 6/Bluetooth 5.3 module based on the Filogic 320 chipset.

The board was designed by Boundary Devices, recently acquired by Laird, and is offered with a SMARC 2.1 carrier board that can be used for development or as a single board computer integrated into designs.

Tungsten700 SMARC module

Tungsten700 specifications:

• SoC – MediaTek Genio 700 (MT8390)
  • CPU – Octa-core processor with 2x Arm Cortex-A78 cores @ up to 2.2 GHz, 6x Arm Cortex-A55 cores @ up to 2.0 GHz
  • GPU – ARM Mali-G57 MC3 GPU
  • VPU as in “Video Processing Unit”
    • Encode up to 4Kp30 HEVC/H.264
    • Decode up to 4Kp75 HEVC/H.264/AV1/VP9
  • VPU as in “Vision Processing Unit” – Tensilica VP6 Vision Processing Unit
  • ISP
    • Single Camera: 32MP @ 30FPS
    • Dual Camera: 16MP + 16 MP @ 30 FPS
    • Video HDR with stagger HDR sensor: Up to 16MP @ 30FPS
  • AI accelerator – 3.7 TOPS NPU
  • Audio DSP – Cadence Tensilica HiFi 5
• System Memory – 4GB or 8GB LPDDR4
• Storage – 16GB eMMC flash (other capacities available upon request)
• Networking chips/modules
  • Ethernet – KSZ9031 Gigabit Ethernet PHY, LAN7850 USB 2.0 to Ethernet bridge (meaning that “GbE” port is limited to less than 480 Mbps)
  • Wireless – Sona MT320 Wi-Fi 6/Bluetooth 5.3 module
• 314-pin MXM 3.0 edge connector as per SMARC 2.1 specifications:
  • Storage – 1x SDIO 3.0
  • Display I/F
    • 1x HDMI 2.0a Tx up to 4Kp60
    • 1x DisplayPort up to 4K60
    • 1x Embedded DisplayPort (eDP) up to 1920×1410 @ 60Hz
    • 2x 4-Lane MIPI DSI up to 1.2 Gbps per lane
  • Camera I/F – 2x 4-Lane MIPI CSI
  • Audio – I2S headphone, I2S microphone
  • Networking – 2x Gigabit Ethernet
  • USB – 2x USB 3.0, 2x USB 2.0, 1x USB 2.0 OTG
  • Low-speed I/Os – 5x I2C, 3x SPI, 3x UART 5Mbit/s,
  • PCIe – 1x PCIe Gen3 1-Lane Dual Mode with PHY
• Power Supply – 5V; MT6319 + MT66365 PMIC
• Dimensions – 82 x 50 mm (SMARC 2.1.1 standard)
• Temperature Range – Commercial: 0°C to +70°C; industrial (soon): -40°C to +85°C
• 10+ year product lifecycle

The company will provide support for Yocto Linux, Android, and Ubuntu, but no details are available at this stage. Applications will include industrial vision systems, smart signage and retail POS, industrial tablets and handhelds, industrial IoT gateways, autonomous and automated robots and vehicles, and more.

SMARC 2.1 carrier board

Specifications:

• Video Output
  • HDMI 2.0 up to 4kp60
  • DisplayPort up to 4kp60
  • 2x eDP
  • 2x LVDS
  • 2x 4-Lane MIPI-DSI
• Camera Interfaces – 2x 4-Lane MIPI CSI
• Audio
  • 3.5mm headphones (with mic) jack
  • Support for 2W stereo speakers
  • Mic input via Molex connector, Line In via Molex connector
• Networking – 2x Gigabit Ethernet
• USB
  • 2x USB 3.0 USB Type-A port
  • 1x USB 2.0 USB Type-A port
  • 1x USB 2.0 Type-C port
  • USB 2.0 on M.2 socket
• Expansion
  • I2C – 2x on debug connectors, 2x on camera connectors, 2x on display connectors
  • SPI – 2x on debug connectors, 1x on M.2 socket
  • UART – 1x on debug connector, 2x Molex connectors
  • PCIe on M.2 socket
  • 2x CAN bus
• Misc – RTC + battery
• Power Supply – 5V
• Dimensions – 168 x 87mm
• Temperature – 0-70°C

A 7-inch 1280×800 Display with PCAP Multi-touch and/or a 10.1-inch 1280×800 IPS Display with PCAP Multi-touch can be interfaced with the carrier board.

The MediaTek Genio 700 SoM brings a mid-range alternative to the higher-end ADLINK LEC-MTK-I1200 SoM and I-Pi SMARC 1200 development kit based on the MediaTek Genio 1200 octa-core (4x A78 + 4x A55) which I recently tested with Yocto Linux. Laird Connectivity/Boundary Devices did not mention any availability and pricing information. More details may be found on the product page and the press release.

Thanks to TLS for the tip

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