Beelink U59 Pro review – A Jasper Lake mini PC with faster GPU performance

23 Replies to “Beelink U59 Pro review – A Jasper Lake mini PC with faster GPU performance”

1. According to Intel there are a few more minor details between N5095 and N5105, especially a lower TDP of the latter maybe resulting in a less noisy system under full load?

   Reply

   1. That’s odd that the N5105 mobile processor looks identical to the N5095 desktop processor, except for the former having a more powerful GPU, and yet a lower TDP. I suppose the desktop processor may burst for a longer period of time?

      Reported power consumption numbers for the N5095 are also higher in most cases. I reproduce them here to ease the comparison:
      N5095 (15W TDP):

      • BIOS* – 10.8 Watts
      • GRUB boot menu – 10.5 Watts
      • Idle – 9.6 Watts (Windows) and 5.0 Watts (Ubuntu)
      • CPU stressed – 20.4 Watts (Windows ‘cinebench’) and 22.2 Watts (Ubuntu ‘stress’)

      N5105 (10W TDP):

      • BIOS – 14.0 Watts
      • GRUB boot menu – 13.2 Watts
      • Idle – 11.9 Watts (Windows) and 5.4 Watts (Ubuntu)
      • CPU stressed – 22.7 Watts (Windows ‘Cinebench’) and 18.3 Watts (Ubuntu ‘stress’)

      Reply

      1. I mentioned in the opening paragraph that the processor had swapped from being a ‘desktop’ to ‘mobile’ one implying the lower TDP gimping that Intel defines, however the ‘Power Limits’ between the two devices are probably responsible for the increase power consumption as PL/2 goes from 25W to 30W in the lower TDP N5105 U59 Pro device.

         Reply

         1. > lower TDP

            And as we learned the last years: TDP with Intel is a rather useless metric anyway since TDP is all about ‘base frequency’ while with benchmarks or any real-world workload we’re at ‘burst frequency’ that is subject to thermal/power limits.

            N5100 in my PN41 has a 6W TDP rating (at 1.1 GHz) compared to N5105’s 10W TDP rating (at almost twice the clockspeed: 2.0 GHz).

            Reply

      2. Well, based on my experiences with N5100 (Asus PN41) which is closer to N5105 than N5095 disabling integrated Audio helped a lot with idle consumption. Also U59 Pro has one more GbE NIC and another HDMI PHY that might also contribute to higher idle consumption.

         Reply

      3. > N5095: 20.4 Watts (Windows ‘cinebench’) and 22.2 Watts (Ubuntu ‘stress’)
         > N5105: 22.7 Watts (Windows ‘Cinebench’) and 18.3 Watts (Ubuntu ‘stress’)

         Makes no sense at all 🙂

         IMO using stress/stress-ng without additional monitoring is rather useless. Better use cpuminer to generate load since the generated scores provide insights at the same time (like: CPU cores throttled due to different UEFI/ACPI settings resulting in different thermal trip points).

         Cinebench R23 uses AVX on Intel and as such real clockspeeds (or different Turbo behaviour) are also important.

         Reply

         1. The power consumption figures are only meant to be indicative rather than metrics to give people an idea of the power usage profile when the CPU is idle vs when busy. I was already thinking about dropping the BIOS/GRUB readings simply because they were relatively meaningless – I originally only included them as they were easy to measure!

            Another point that doesn’t get much coverage in reviews is that power consumption is affected by the fan, including the number of fans in a device and type/efficiency of fan(s) etc. However I don’t plan on starting this discussion as it is a level of detail beyond just a simple product review.

            Reply

            1. > I was already thinking about dropping the BIOS/GRUB readings

               I always enjoyed them since they give a clue what happens if all the power management mechanisms aren’t (properly) at work.

               A PC idling at ~11W in UEFI vs. 5W in Linux just shows how important the software side of things is not only for performance but also for consumption.

               BTW: IMHO calling UEFI BIOS is rather misleading…

            2. Based on your interest then I’ll keep showing the BIOS/GRUB readings.

               Whilst the definition of ‘UEFI’ and ‘BIOS’ are clear, when the terms are used in mini PCS they are often confused and used somewhat interchangeably. For example, after power-on and pressing <DEL> to enter ‘Setup’ as instructed on the screen, AMI’s Aptio Setup screen is displayed and the first column is headed ‘BIOS Information’ with the first entry has ‘BIOS Vendor’ set to ‘American Megatrends’ but further down there is an entry for ‘Compliancy’ set to ‘UEFI 2.7; PI 1.6’. Even AMI’s website refers to it as ‘BIOS’ in places, e.g. ‘To find out how to enter your system’s BIOS setup’ (ref: www ami com/top-three-keys-used-to-enter-uefi-bios-setup) as well as ‘BIOS/UEFI’ and ‘UEFI BIOS’ in various places on their website. Often mini PC vendors talk of ‘BIOS’ updates when offering fixes or solutions to user issues so again there may be confusion when people do not realise they are referring to UEFI updates.

               If I called it ‘UEFI (BIOS)’ would that be more acceptable without being too confusing?

            3. > ‘UEFI (BIOS)’

               Would prefer that since while there are many consumers who never heard of UEFI (while this exploit-friendly OS nowadays runs on every modern PC in the background) it might raise awareness that this is something different than ‘good old’ BIOS handing over control to some OS after booting from four decades ago.

2. Fun thing: on “chineese 4 port firewall” from Ali with same N5105 processor seller claim 64Gb RAM supported. I installed 32 and they works fine…

   Reply

   1. Beelink’s U59 N5105 page (id=334) also says 64 GB is supported.

      Intel’s N5105 page says 16 GB maximum.

      Intel should fix its nuisance bad info. Maybe I should buy one of these just so I can get in on a class action lawsuit.

      Reply

      1. > Intel’s N5105 page says 16 GB maximum.

         As with every other Jasper Lake SKU. With Gemini Lake (Refresh) it was exactly the same: Intel claiming 8GB max while in reality those users who bought slow DIMMs could use up to 32GB. Those who bought more expensive ones with low latency / high clocks had no luck and the modules didn’t work reliable or at all (even with upgraded UEFI).

         Most probably with Jasper Lake it’s the same: Intel playing safe to avoid consumers ‘getting in on a class action lawsuit’. 😉

         Reply

   2. Care to provide output from ‘dmidecode –type 17’ to get a clue which timings have been negotiated?

      Reply

      1. You point to very interesting info, thanks.

         I see no timing info in the dmidecode output:

         dmidecode -t 17 # dmidecode 3.3 Getting SMBIOS data from sysfs. SMBIOS 3.3.0 present. Handle 0x0046, DMI type 17, 100 bytes Memory Device Array Handle: 0x0039 Error Information Handle: Not Provided Total Width: 64 bits Data Width: 64 bits Size: 16 GB Form Factor: SODIMM Set: None Locator: Controller0-ChannelA Bank Locator: BANK 0 Type: DDR4 Type Detail: Synchronous Speed: 3200 MT/s Manufacturer: AMD Serial Number: 00000000 Asset Tag: 9876543210 Part Number: R9416G3206S2S Rank: 1 Configured Memory Speed: 2933 MT/s Minimum Voltage: 1.2 V Maximum Voltage: 1.2 V Configured Voltage: 1.2 V Memory Technology: DRAM Memory Operating Mode Capability: Volatile memory Firmware Version: Not Specified Module Manufacturer ID: Bank 1, Hex 0x01 Module Product ID: Unknown Memory Subsystem Controller Manufacturer ID: Unknown Memory Subsystem Controller Product ID: Unknown Non-Volatile Size: None Volatile Size: 16 GB Cache Size: None Logical Size: None Handle 0x0047, DMI type 17, 100 bytes Memory Device Array Handle: 0x0039 Error Information Handle: Not Provided Total Width: 64 bits Data Width: 64 bits Size: 16 GB Form Factor: SODIMM Set: None Locator: Controller0-ChannelB Bank Locator: BANK 1 Type: DDR4 Type Detail: Synchronous Speed: 3200 MT/s Manufacturer: AMD Serial Number: 00000000 Asset Tag: 9876543210 Part Number: R9416G3206S2S Rank: 1 Configured Memory Speed: 2933 MT/s Minimum Voltage: 1.2 V Maximum Voltage: 1.2 V Configured Voltage: 1.2 V Memory Technology: DRAM Memory Operating Mode Capability: Volatile memory Firmware Version: Not Specified Module Manufacturer ID: Bank 1, Hex 0x01 Module Product ID: Unknown Memory Subsystem Controller Manufacturer ID: Unknown Memory Subsystem Controller Product ID: Unknown Non-Volatile Size: None Volatile Size: 16 GB Cache Size: None Logical Size: None

         1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76

         dmidecode -t 17 # dmidecode 3.3 Getting SMBIOS data from sysfs. SMBIOS 3.3.0 present.     Handle 0x0046, DMI type 17, 100 bytes Memory Device Array Handle: 0x0039 Error Information Handle: Not Provided Total Width: 64 bits Data Width: 64 bits Size: 16 GB Form Factor: SODIMM Set: None Locator: Controller0-ChannelA Bank Locator: BANK 0 Type: DDR4 Type Detail: Synchronous Speed: 3200 MT/s Manufacturer: AMD Serial Number: 00000000 Asset Tag: 9876543210 Part Number: R9416G3206S2S Rank: 1 Configured Memory Speed: 2933 MT/s Minimum Voltage: 1.2 V Maximum Voltage: 1.2 V Configured Voltage: 1.2 V Memory Technology: DRAM Memory Operating Mode Capability: Volatile memory Firmware Version: Not Specified Module Manufacturer ID: Bank 1, Hex 0x01 Module Product ID: Unknown Memory Subsystem Controller Manufacturer ID: Unknown Memory Subsystem Controller Product ID: Unknown Non-Volatile Size: None Volatile Size: 16 GB Cache Size: None Logical Size: None     Handle 0x0047, DMI type 17, 100 bytes Memory Device Array Handle: 0x0039 Error Information Handle: Not Provided Total Width: 64 bits Data Width: 64 bits Size: 16 GB Form Factor: SODIMM Set: None Locator: Controller0-ChannelB Bank Locator: BANK 1 Type: DDR4 Type Detail: Synchronous Speed: 3200 MT/s Manufacturer: AMD Serial Number: 00000000 Asset Tag: 9876543210 Part Number: R9416G3206S2S Rank: 1 Configured Memory Speed: 2933 MT/s Minimum Voltage: 1.2 V Maximum Voltage: 1.2 V Configured Voltage: 1.2 V Memory Technology: DRAM Memory Operating Mode Capability: Volatile memory Firmware Version: Not Specified Module Manufacturer ID: Bank 1, Hex 0x01 Module Product ID: Unknown Memory Subsystem Controller Manufacturer ID: Unknown Memory Subsystem Controller Product ID: Unknown Non-Volatile Size: None Volatile Size: 16 GB Cache Size: None Logical Size: None

         decode-dimms give more info:

         decode-dimms # decode-dimms version 4.3 ... Decoding EEPROM: /sys/bus/i2c/drivers/ee1004/4-0050 Guessing DIMM is in                              bank 1 Kernel driver used                               ee1004 ---=== SPD EEPROM Information ===--- EEPROM CRC of bytes 0-125                        OK (0x2ABD) # of bytes written to SDRAM EEPROM               384 Total number of bytes in EEPROM                  512 Fundamental Memory type                          DDR4 SDRAM SPD Revision                                     1.0 Module Type                                      SO-DIMM EEPROM CRC of bytes 128-253                      OK (0x55EF) ---=== Memory Characteristics ===--- Maximum module speed                             3200 MT/s (PC4-25600) Size                                             16384 MB Banks x Rows x Columns x Bits                    16 x 17 x 10 x 64 SDRAM Device Width                               8 bits Ranks                                            1 Primary Bus Width                                64 bits AA-RCD-RP-RAS (cycles)                           22-22-22-52 Supported CAS Latencies                          28T, 26T, 24T, 23T, 22T, 21T, 20T, 19T, 18T, 17T, 16T, 15T, 14T, 13T, 12T, 11T, 10T ---=== Timings at Standard Speeds ===--- AA-RCD-RP-RAS (cycles) as DDR4-3200              22-22-22-52 AA-RCD-RP-RAS (cycles) as DDR4-2933              21-21-21-47 AA-RCD-RP-RAS (cycles) as DDR4-2666              19-19-19-43 AA-RCD-RP-RAS (cycles) as DDR4-2400              17-17-17-39 AA-RCD-RP-RAS (cycles) as DDR4-2133              15-15-15-35 AA-RCD-RP-RAS (cycles) as DDR4-1866              13-13-13-30 AA-RCD-RP-RAS (cycles) as DDR4-1600              11-11-11-26 ---=== Timing Parameters ===--- Minimum Cycle Time (tCKmin)                      0.625 ns Maximum Cycle Time (tCKmax)                      1.600 ns Minimum CAS Latency Time (tAA)                   13.750 ns Minimum RAS to CAS Delay (tRCD)                  13.750 ns Minimum Row Precharge Delay (tRP)                13.750 ns Minimum Active to Precharge Delay (tRAS)         32.000 ns Minimum Active to Auto-Refresh Delay (tRC)       45.750 ns Minimum Recovery Delay (tRFC1)                   550.000 ns Minimum Recovery Delay (tRFC2)                   350.000 ns Minimum Recovery Delay (tRFC4)                   260.000 ns Minimum Four Activate Window Delay (tFAW)        21.000 ns Minimum Row Active to Row Active Delay (tRRD_S)  2.500 ns Minimum Row Active to Row Active Delay (tRRD_L)  4.900 ns Minimum CAS to CAS Delay (tCCD_L)                5.000 ns Minimum Write Recovery Time (tWR)                15.000 ns Minimum Write to Read Time (tWTR_S)              2.500 ns Minimum Write to Read Time (tWTR_L)              7.500 ns ---=== Other Information ===--- Package Type                                     Monolithic Maximum Activate Count (MAC)                     Unlimited Post Package Repair                              One row per bank group Soft PPR                                         Supported Module Nominal Voltage                           1.2 V Thermal Sensor                                   No ---=== Physical Characteristics ===--- Module Height                                    30 mm Module Thickness                                 2 mm front, 2 mm back Module Reference Card                            A revision 1 ---=== Manufacturer Data ===--- Module Manufacturer                              AMD DRAM Manufacturer                                AMD Manufacturing Location Code                      D Part Number                                      R9416G3206S2S

         1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80

         decode-dimms # decode-dimms version 4.3 ...   Decoding EEPROM: /sys/bus/i2c/drivers/ee1004/4-0050 Guessing DIMM is in                              bank 1 Kernel driver used                               ee1004     ---=== SPD EEPROM Information ===--- EEPROM CRC of bytes 0-125                        OK (0x2ABD) # of bytes written to SDRAM EEPROM               384 Total number of bytes in EEPROM                  512 Fundamental Memory type                          DDR4 SDRAM SPD Revision                                     1.0 Module Type                                      SO-DIMM EEPROM CRC of bytes 128-253                      OK (0x55EF)     ---=== Memory Characteristics ===--- Maximum module speed                             3200 MT/s (PC4-25600) Size                                             16384 MB Banks x Rows x Columns x Bits                    16 x 17 x 10 x 64 SDRAM Device Width                               8 bits Ranks                                            1 Primary Bus Width                                64 bits AA-RCD-RP-RAS (cycles)                           22-22-22-52 Supported CAS Latencies                          28T, 26T, 24T, 23T, 22T, 21T, 20T, 19T, 18T, 17T, 16T, 15T, 14T, 13T, 12T, 11T, 10T     ---=== Timings at Standard Speeds ===--- AA-RCD-RP-RAS (cycles) as DDR4-3200              22-22-22-52 AA-RCD-RP-RAS (cycles) as DDR4-2933              21-21-21-47 AA-RCD-RP-RAS (cycles) as DDR4-2666              19-19-19-43 AA-RCD-RP-RAS (cycles) as DDR4-2400              17-17-17-39 AA-RCD-RP-RAS (cycles) as DDR4-2133              15-15-15-35 AA-RCD-RP-RAS (cycles) as DDR4-1866              13-13-13-30 AA-RCD-RP-RAS (cycles) as DDR4-1600              11-11-11-26     ---=== Timing Parameters ===--- Minimum Cycle Time (tCKmin)                      0.625 ns Maximum Cycle Time (tCKmax)                      1.600 ns Minimum CAS Latency Time (tAA)                   13.750 ns Minimum RAS to CAS Delay (tRCD)                  13.750 ns Minimum Row Precharge Delay (tRP)                13.750 ns Minimum Active to Precharge Delay (tRAS)         32.000 ns Minimum Active to Auto-Refresh Delay (tRC)       45.750 ns Minimum Recovery Delay (tRFC1)                   550.000 ns Minimum Recovery Delay (tRFC2)                   350.000 ns Minimum Recovery Delay (tRFC4)                   260.000 ns Minimum Four Activate Window Delay (tFAW)        21.000 ns Minimum Row Active to Row Active Delay (tRRD_S)  2.500 ns Minimum Row Active to Row Active Delay (tRRD_L)  4.900 ns Minimum CAS to CAS Delay (tCCD_L)                5.000 ns Minimum Write Recovery Time (tWR)                15.000 ns Minimum Write to Read Time (tWTR_S)              2.500 ns Minimum Write to Read Time (tWTR_L)              7.500 ns     ---=== Other Information ===--- Package Type                                     Monolithic Maximum Activate Count (MAC)                     Unlimited Post Package Repair                              One row per bank group Soft PPR                                         Supported Module Nominal Voltage                           1.2 V Thermal Sensor                                   No     ---=== Physical Characteristics ===--- Module Height                                    30 mm Module Thickness                                 2 mm front, 2 mm back Module Reference Card                            A revision 1     ---=== Manufacturer Data ===--- Module Manufacturer                              AMD DRAM Manufacturer                                AMD Manufacturing Location Code                      D Part Number                                      R9416G3206S2S

         Reply

         1. Ah, just realized that it’s ‘decode-dimms’ that does a better job (if supported by your system – you need most probably package ‘i2c-tools’ and should do a ‘modprobe eeprom’ before calling ‘decode-dimms’)

            See for example starting at ‘Decoding EEPROM’ here with a Jasper Lake thingy: http://ix.io/41aB

            Reply

            1. I don’t think ‘decode-dimms’ shows XMP timings if you have then enabled in the UEFI (BIOS) and I’d be interested in learning what command would show them if anyone knows.

            2. At least CPU-Z on Windows should list profiles and timings. But no clue about other OS at all…

            3. Spoilt for choice on Windows as HWiNFO64 is another example.

            4. i2c-tools installed, after “modprobe eeprom” nothing changed, only second module detected. What exactly we search for?

               Decoding EEPROM: /sys/bus/i2c/drivers/ee1004/0-0050 Guessing DIMM is in                              bank 1 Kernel driver used                               ee1004 ---=== SPD EEPROM Information ===--- EEPROM CRC of bytes 0-125                        OK (0x2ABD) # of bytes written to SDRAM EEPROM               384 Total number of bytes in EEPROM                  512 Fundamental Memory type                          DDR4 SDRAM SPD Revision                                     1.0 Module Type                                      SO-DIMM EEPROM CRC of bytes 128-253                      OK (0x55EF) ---=== Memory Characteristics ===--- Maximum module speed                             3200 MT/s (PC4-25600) Size                                             16384 MB Banks x Rows x Columns x Bits                    16 x 17 x 10 x 64 SDRAM Device Width                               8 bits Ranks                                            1 Primary Bus Width                                64 bits AA-RCD-RP-RAS (cycles)                           22-22-22-52 Supported CAS Latencies                          28T, 26T, 24T, 23T, 22T, 21T, 20T, 19T, 18T, 17T, 16T, 15T, 14T, 13T, 12T, 11T, 10T ---=== Timings at Standard Speeds ===--- AA-RCD-RP-RAS (cycles) as DDR4-3200              22-22-22-52 AA-RCD-RP-RAS (cycles) as DDR4-2933              21-21-21-47 AA-RCD-RP-RAS (cycles) as DDR4-2666              19-19-19-43 AA-RCD-RP-RAS (cycles) as DDR4-2400              17-17-17-39 AA-RCD-RP-RAS (cycles) as DDR4-2133              15-15-15-35 AA-RCD-RP-RAS (cycles) as DDR4-1866              13-13-13-30 AA-RCD-RP-RAS (cycles) as DDR4-1600              11-11-11-26 ---=== Timing Parameters ===--- Minimum Cycle Time (tCKmin)                      0.625 ns Maximum Cycle Time (tCKmax)                      1.600 ns Minimum CAS Latency Time (tAA)                   13.750 ns Minimum RAS to CAS Delay (tRCD)                  13.750 ns Minimum Row Precharge Delay (tRP)                13.750 ns Minimum Active to Precharge Delay (tRAS)         32.000 ns Minimum Active to Auto-Refresh Delay (tRC)       45.750 ns Minimum Recovery Delay (tRFC1)                   550.000 ns Minimum Recovery Delay (tRFC2)                   350.000 ns Minimum Recovery Delay (tRFC4)                   260.000 ns Minimum Four Activate Window Delay (tFAW)        21.000 ns Minimum Row Active to Row Active Delay (tRRD_S)  2.500 ns Minimum Row Active to Row Active Delay (tRRD_L)  4.900 ns Minimum CAS to CAS Delay (tCCD_L)                5.000 ns Minimum Write Recovery Time (tWR)                15.000 ns Minimum Write to Read Time (tWTR_S)              2.500 ns Minimum Write to Read Time (tWTR_L)              7.500 ns ---=== Other Information ===--- Package Type                                     Monolithic Maximum Activate Count (MAC)                     Unlimited Post Package Repair                              One row per bank group Soft PPR                                         Supported Module Nominal Voltage                           1.2 V Thermal Sensor                                   No ---=== Physical Characteristics ===--- Module Height                                    30 mm Module Thickness                                 2 mm front, 2 mm back Module Reference Card                            A revision 1 ---=== Manufacturer Data ===--- Module Manufacturer                              AMD DRAM Manufacturer                                AMD Manufacturing Location Code                      D Part Number                                      R9416G3206S2S Decoding EEPROM: /sys/bus/i2c/drivers/eeprom/0-0052 Guessing DIMM is in                              bank 3 Kernel driver used                               eeprom ---=== SPD EEPROM Information ===--- EEPROM CRC of bytes 0-125                        OK (0x2ABD) # of bytes written to SDRAM EEPROM               384 Total number of bytes in EEPROM                  512 Fundamental Memory type                          DDR4 SDRAM SPD Revision                                     1.0 Module Type                                      SO-DIMM EEPROM CRC of bytes 128-253                      OK (0x0000) ---=== Memory Characteristics ===--- Maximum module speed                             3200 MT/s (PC4-25600) Size                                             16384 MB Banks x Rows x Columns x Bits                    16 x 17 x 10 x 64 SDRAM Device Width                               8 bits Ranks                                            1 Primary Bus Width                                64 bits AA-RCD-RP-RAS (cycles)                           22-22-22-52 Supported CAS Latencies                          28T, 26T, 24T, 23T, 22T, 21T, 20T, 19T, 18T, 17T, 16T, 15T, 14T, 13T, 12T, 11T, 10T ---=== Timings at Standard Speeds ===--- AA-RCD-RP-RAS (cycles) as DDR4-3200              22-22-22-52 AA-RCD-RP-RAS (cycles) as DDR4-2933              21-21-21-47 AA-RCD-RP-RAS (cycles) as DDR4-2666              19-19-19-43 AA-RCD-RP-RAS (cycles) as DDR4-2400              17-17-17-39 AA-RCD-RP-RAS (cycles) as DDR4-2133              15-15-15-35 AA-RCD-RP-RAS (cycles) as DDR4-1866              13-13-13-30 AA-RCD-RP-RAS (cycles) as DDR4-1600              11-11-11-26 ---=== Timing Parameters ===--- Minimum Cycle Time (tCKmin)                      0.625 ns Maximum Cycle Time (tCKmax)                      1.600 ns Minimum CAS Latency Time (tAA)                   13.750 ns Minimum RAS to CAS Delay (tRCD)                  13.750 ns Minimum Row Precharge Delay (tRP)                13.750 ns Minimum Active to Precharge Delay (tRAS)         32.000 ns Minimum Active to Auto-Refresh Delay (tRC)       45.750 ns Minimum Recovery Delay (tRFC1)                   550.000 ns Minimum Recovery Delay (tRFC2)                   350.000 ns Minimum Recovery Delay (tRFC4)                   260.000 ns Minimum Four Activate Window Delay (tFAW)        21.000 ns Minimum Row Active to Row Active Delay (tRRD_S)  2.500 ns Minimum Row Active to Row Active Delay (tRRD_L)  4.900 ns Minimum CAS to CAS Delay (tCCD_L)                5.000 ns Minimum Write Recovery Time (tWR)                15.000 ns Minimum Write to Read Time (tWTR_S)              2.500 ns Minimum Write to Read Time (tWTR_L)              7.500 ns ---=== Other Information ===--- Package Type                                     Monolithic Maximum Activate Count (MAC)                     Unlimited Post Package Repair                              One row per bank group Soft PPR                                         Supported Module Nominal Voltage                           1.2 V Thermal Sensor                                   No ---=== Physical Characteristics ===--- Module Height                                    15 mm or less Module Thickness                                 1 mm front, 1 mm back Module Reference Card                            A revision 0 Number of SDRAM DIMMs detected and decoded: 2

               1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154

               Decoding EEPROM: /sys/bus/i2c/drivers/ee1004/0-0050 Guessing DIMM is in                              bank 1 Kernel driver used                               ee1004     ---=== SPD EEPROM Information ===--- EEPROM CRC of bytes 0-125                        OK (0x2ABD) # of bytes written to SDRAM EEPROM               384 Total number of bytes in EEPROM                  512 Fundamental Memory type                          DDR4 SDRAM SPD Revision                                     1.0 Module Type                                      SO-DIMM EEPROM CRC of bytes 128-253                      OK (0x55EF)     ---=== Memory Characteristics ===--- Maximum module speed                             3200 MT/s (PC4-25600) Size                                             16384 MB Banks x Rows x Columns x Bits                    16 x 17 x 10 x 64 SDRAM Device Width                               8 bits Ranks                                            1 Primary Bus Width                                64 bits AA-RCD-RP-RAS (cycles)                           22-22-22-52 Supported CAS Latencies                          28T, 26T, 24T, 23T, 22T, 21T, 20T, 19T, 18T, 17T, 16T, 15T, 14T, 13T, 12T, 11T, 10T     ---=== Timings at Standard Speeds ===--- AA-RCD-RP-RAS (cycles) as DDR4-3200              22-22-22-52 AA-RCD-RP-RAS (cycles) as DDR4-2933              21-21-21-47 AA-RCD-RP-RAS (cycles) as DDR4-2666              19-19-19-43 AA-RCD-RP-RAS (cycles) as DDR4-2400              17-17-17-39 AA-RCD-RP-RAS (cycles) as DDR4-2133              15-15-15-35 AA-RCD-RP-RAS (cycles) as DDR4-1866              13-13-13-30 AA-RCD-RP-RAS (cycles) as DDR4-1600              11-11-11-26     ---=== Timing Parameters ===--- Minimum Cycle Time (tCKmin)                      0.625 ns Maximum Cycle Time (tCKmax)                      1.600 ns Minimum CAS Latency Time (tAA)                   13.750 ns Minimum RAS to CAS Delay (tRCD)                  13.750 ns Minimum Row Precharge Delay (tRP)                13.750 ns Minimum Active to Precharge Delay (tRAS)         32.000 ns Minimum Active to Auto-Refresh Delay (tRC)       45.750 ns Minimum Recovery Delay (tRFC1)                   550.000 ns Minimum Recovery Delay (tRFC2)                   350.000 ns Minimum Recovery Delay (tRFC4)                   260.000 ns Minimum Four Activate Window Delay (tFAW)        21.000 ns Minimum Row Active to Row Active Delay (tRRD_S)  2.500 ns Minimum Row Active to Row Active Delay (tRRD_L)  4.900 ns Minimum CAS to CAS Delay (tCCD_L)                5.000 ns Minimum Write Recovery Time (tWR)                15.000 ns Minimum Write to Read Time (tWTR_S)              2.500 ns Minimum Write to Read Time (tWTR_L)              7.500 ns     ---=== Other Information ===--- Package Type                                     Monolithic Maximum Activate Count (MAC)                     Unlimited Post Package Repair                              One row per bank group Soft PPR                                         Supported Module Nominal Voltage                           1.2 V Thermal Sensor                                   No     ---=== Physical Characteristics ===--- Module Height                                    30 mm Module Thickness                                 2 mm front, 2 mm back Module Reference Card                            A revision 1     ---=== Manufacturer Data ===--- Module Manufacturer                              AMD DRAM Manufacturer                                AMD Manufacturing Location Code                      D Part Number                                      R9416G3206S2S         Decoding EEPROM: /sys/bus/i2c/drivers/eeprom/0-0052 Guessing DIMM is in                              bank 3 Kernel driver used                               eeprom     ---=== SPD EEPROM Information ===--- EEPROM CRC of bytes 0-125                        OK (0x2ABD) # of bytes written to SDRAM EEPROM               384 Total number of bytes in EEPROM                  512 Fundamental Memory type                          DDR4 SDRAM SPD Revision                                     1.0 Module Type                                      SO-DIMM EEPROM CRC of bytes 128-253                      OK (0x0000)     ---=== Memory Characteristics ===--- Maximum module speed                             3200 MT/s (PC4-25600) Size                                             16384 MB Banks x Rows x Columns x Bits                    16 x 17 x 10 x 64 SDRAM Device Width                               8 bits Ranks                                            1 Primary Bus Width                                64 bits AA-RCD-RP-RAS (cycles)                           22-22-22-52 Supported CAS Latencies                          28T, 26T, 24T, 23T, 22T, 21T, 20T, 19T, 18T, 17T, 16T, 15T, 14T, 13T, 12T, 11T, 10T     ---=== Timings at Standard Speeds ===--- AA-RCD-RP-RAS (cycles) as DDR4-3200              22-22-22-52 AA-RCD-RP-RAS (cycles) as DDR4-2933              21-21-21-47 AA-RCD-RP-RAS (cycles) as DDR4-2666              19-19-19-43 AA-RCD-RP-RAS (cycles) as DDR4-2400              17-17-17-39 AA-RCD-RP-RAS (cycles) as DDR4-2133              15-15-15-35 AA-RCD-RP-RAS (cycles) as DDR4-1866              13-13-13-30 AA-RCD-RP-RAS (cycles) as DDR4-1600              11-11-11-26     ---=== Timing Parameters ===--- Minimum Cycle Time (tCKmin)                      0.625 ns Maximum Cycle Time (tCKmax)                      1.600 ns Minimum CAS Latency Time (tAA)                   13.750 ns Minimum RAS to CAS Delay (tRCD)                  13.750 ns Minimum Row Precharge Delay (tRP)                13.750 ns Minimum Active to Precharge Delay (tRAS)         32.000 ns Minimum Active to Auto-Refresh Delay (tRC)       45.750 ns Minimum Recovery Delay (tRFC1)                   550.000 ns Minimum Recovery Delay (tRFC2)                   350.000 ns Minimum Recovery Delay (tRFC4)                   260.000 ns Minimum Four Activate Window Delay (tFAW)        21.000 ns Minimum Row Active to Row Active Delay (tRRD_S)  2.500 ns Minimum Row Active to Row Active Delay (tRRD_L)  4.900 ns Minimum CAS to CAS Delay (tCCD_L)                5.000 ns Minimum Write Recovery Time (tWR)                15.000 ns Minimum Write to Read Time (tWTR_S)              2.500 ns Minimum Write to Read Time (tWTR_L)              7.500 ns     ---=== Other Information ===--- Package Type                                     Monolithic Maximum Activate Count (MAC)                     Unlimited Post Package Repair                              One row per bank group Soft PPR                                         Supported Module Nominal Voltage                           1.2 V Thermal Sensor                                   No     ---=== Physical Characteristics ===--- Module Height                                    15 mm or less Module Thickness                                 1 mm front, 1 mm back Module Reference Card                            A revision 0         Number of SDRAM DIMMs detected and decoded: 2

            5. Sorry, I overlooked decode-dimm output form your 1st answer (been on cellphone). I guess the information we’re searching for is simply not there 🙁

3. Not to start a terminology flame war but in my opinion bios and uefi are used interchangeably. It hasn’t even been possible to buy a new computer with an actual bios in it since 2019. Everything new comes with a uefi but as a sys admin I pretty much only hear people refer to it as a bios. Kind of similar to people using the windows add/remove programs terminology even though it was renamed years ago. That is all 🙂

   Reply

   1. > in my opinion bios and uefi are used interchangeably

      Sure, but they shouldn’t. UEFI is a horrible exploit-friendly fully blown OS with full control over the hardware that runs in the background all the time.

      I think users should be aware of BIOS and UEFI being two different things even if UEFI vendors don’t want them to realize the fundamental differences.

      Reply