TQ unveils i.MX 8M Plus LGA module and evaluation single board computer

We’ve seen plenty of systems-on-module based on NXP i.MX 8M Plus AI processor announced at Embedded World 2021 either with edge or board-to-board connectors.

TQ TQMa8MPxL is a bit different as an i.MX 8M Plus LGA (Land Grid Array) system-on-module meant to be soldered on a carrier board. The company also took the occasion to unveil STKa8MPxL evaluation kit based on TQMa8MxML in single board computer format to demonstrate its new LGA module.

TQMa8MPxL i.MX 8M Plus LGA module

Specifications:

• SoC – NXP i.MX 8M Plus “Quad 8 ML/AI”, “Quad 6 Video”, or “Quad 4 Lite” processor with four Cortex-A53 cores, one Cortex-M7 core,  Vivante GPU, video encoder/decoder, HiFi4 audio DSP, and 2.3 TOPS AI accelertor
• System Memory – Up to 4 GB LPDDR4
• Storage – Up to 256 MB (MBytes)Quad SPI NOR flash, up to 256 GB eMMC flash, optional EEPROM up to 64 Kbit
• 362-pin LGA with
  • Storage – Up to 3x SDIO/eMMC
  • Display interfaces – 1x MIPI DSI (4 Lanes), LVDS (4/8 Lanes), 1x HDMI 2.0a
  • Camera – 2x MIPI CSI2 (4 Lanes)
  • Networking – Up to 2x Gigabit Ethernet (including 1x TSN)
  • USB – Up to 2x USB 3.0
  • CAN – Up to 2x CAN FD
  • Serial – Up to 4x UART
  • PCIe – Up to 1x PCIe 3.0
  • Up to 6x I2C, up to 3x SPI, up to 1x QSPI
  • Audio – Up to 18x I²S, up to 8x PDM Mic, up to 1x SPDIF
• Debugging – JTAG interface
• Misc – RTC, optional NXP EdgeLock SE050 secure element, temperature sensor
• Dimensions – 38 x 38 mm
• Temperature range – Standard: -25°C…+85°C; extended: -40°C…+85°C

The company provides a Yocto-based Linux BSP for the module, and Android is available on request. TQMa8MPxL module targets applications in the medical (sleep monitoring, HMI eye laser, dialysis system control, etc..), transportation (vehicle diagnostics, energy management, sensor data acquisition), and industrial automation (optical inspection systems, Soft PLC / programmable control, machine control) fields.

STKa8MPxL evaluation kit

In order to ease evaluation of the module and early development work the company also offers the STKa8MPxL evaluation kit that forms a single board computer with MBa8MPxL carrier board and the soldered-on TQMa8MPxL LGA system-on-module.

STKa8MPxL key features:

• SoM – TQMa8MPxL with NXP i.MX 8M Plus AI processor described above
• Storage – MicroSD card slot
• Display – LVDS connectors, HDMI, and DisplayPort video outputs
• Audio – 3x  3.5 mm jacks for MIC, Line-in, Line-out
• Camera – 2x MIPI CSI connectors
• Networking – 2x Gigabit Ethernet ports, optional WiFi or cellular via M.2 card, SIM card slot
• USB – 2x USB 3.0 ports, 1x USB 3.0 OTG
• Serial – 2x CAN FD terminals
• Expansion
  • M.2 socket with PCIe and USB 3.0
  • GPIO header up to 24V
• Debugging – JTAG header, micro USB port for console
• Power Supply – 24V DC input via 2-pin terminal block
• Dimensions – 160 x 100mm

Pricing, availability, advantages of LGA modules

Both the TQMa8MPxL system-on-module and the STKa8MPxL Starterkit/single board computer appear to be available now, but the company did not publish any pricing information. More details may be found on the announcement and product page.

As noted in the introduction, most modules are using edge or board-to-board connectors for easy upgrade and replacement, but some other relies on castellated holes, and need to be soldered. LGA modules are harder to find, and previously we covered TechNexion XORE LGA System-on-Module based on NXP i.MX 8M Mini with the key advantage of such being being the tiny form factor and low height allowing integration into compact/thin designs. I also assume soldered-on modules should manage vibrations and shocks better than modules inserted into a socket.

Via LinuxGizmos

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