ADLINK launches SMARC Short Size Module, Devkit with NXP i.MX 8M Plus

We had seen many i.MX 8M Plus modules with built-in AI accelerator announced at Embedded World 2021, including two SMARC modules from Congatec and iWave Systems.

ADLINK has added another of i.MX 8M Plus module compliant with SMARC 2.1 “short” standard with LEC-IMX8MP system-on-module equipped with up to 8GB RAM, 128 GB eMMC flash, as well as a development kit called I-Pi SMARC IMX8M Plus prototyping platform.

LEC-IMX8MP module specifications

Specifications:

• SoC – NXP i.MX8M Plus with quad-core ARM Cortex-A53 processor, Vivante GC380 2D GPU and GC7000UL 3D GPU, 1080p60 video decoder & encoder, optional 2.3 TOPS Neural Processing Unit (NPU)
• System Memory – 2/4/8GB LPDDR4L-4266
• Storage – 16, 32, 64, or 128GB eMMC flash (build option)
• Wireless – Optional 802.11 ac/a/b/g/n WiFi 5 2X2 MIMO and Bluetooth 5.0 module
• 314-pin MXM 3.0 edge connector
  • Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0
  • Display – 4-lane MIPI-DSI interface, LVDS, HDMI 2.0a
  • Cameras
    • 1x dual-lane MIPI-CSI interface
    • 1x quad-lane MIPI-CSI interface
  • Audio – 2x I2C interfaces, audio codec on carrier
  • Networking – 2x Gigabit Ethernet, including on TSN capable
  • PCIe – 2x PCIe x1 Gen3
  • USB – 2x USB 3.0, 3x USB 2.0, 1x USB 2.0 OTG
  • CAN – 2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps
  • 2x SPI, 4x I2C, 3x UART
  • 14x GPIO with interrupt, one GPIO with PWM
• Security
  • TrustZone, ARMv8 Cryptography Extensions
  • Resource Domain Controller (RDC) supports 4 domains and up to 8 regions
    of DDR
  • On-chip RAM (OCRAM) secure region protection using OCRAM controller
  • High Assurance Boot (HAB)
  • Cryptographic Acceleration and Assurance Module (CAAM)
  • Capable to support Widevine and PlayReady content protection
  • Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms
  • Real-time integrity checker (RTIC)
  • DRM support for RSA, AES, 3DES, DES
  • Side-channel attack resistance
  • True random number generation (RNG)
  • Manufacturing protection support / Secure Non-Volatile Storage (SNVS)
• SEMA Board Controller – Voltage/current monitoring, boot configuration, logistics and forensic information, flat-panel control, watchdog timer
• Debug Header – 30-pin multipurpose flat cable connector for use with optional DB-30 debug module with JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration
• Supply Voltage – 5V DC +/- 5%
• Dimensions – 82 x 50 mm (SMARC specification 2.1)
• Temperature Range – Operating: standard: 0°C to +60°C; rugged: -40°C to +85°C (optional)
• Humidity
  • 5-90% RH operating, non-condensing
  • 5-95% RH storage (and operating with conformal coating)
• Shock and Vibration – IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
• HALT – Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

ADLINK provides standard BSP support for Debian, the Yocto Project, and Android for the module, as well as extended support for VxWorks, and promises 15 years of longevity and software portability through NXP Semiconductors eIQ AI SDK. There’s also an MRAA HAL that allows engineers to reuse the code written for Raspberry Pi or Arduino environments to the I-Pi devkit.

The SoM targets AI-based applications for industrial AIoT/ IoT, smart homes, smart cities, smart building, smart retail, robotics, factory automation, and more.

I-Pi SMARC IMX8M Plus prototyping platform

We’ve already written about another ADLINK I-PI SMARC development kit but the kit was based on a Rockchip PX30 module with a completely different baseboard.

The baseboard for the LEC-IMX8MP module has a different  layout and more I/Os:

• Supported SoM – LEC-IMX8MP SMARC module
• Video Output – HDMI 2.0 ports, MIPI DSI & LVDS connectors
• Camera I/F – 2x MIPI CSI connectors
• Audio – 3.5mm audio jack
• Networking – 2x Gigabit Ethernet RJ45 ports
• USB – 2x USB 3.0 ports, 2x USB 2.0 ports, micro USB port (for console)
• I/Os
  • 40-pin GPIO header
  • 50-pin MRAA header
• Misc – Reset and power buttons
• Power Supply – 19V via DC jack

The development kit includes the carrier board, an LEC-IMX8MP SMARC module with NXP i.MX8M Plus, 2GB soldered memory and 32GB eMMC flash, a 110/220 VAC to 19V DC adapter with power cord, and a Micro USB Cable.

You’ll find more information about the LEC-IMX8MP module on the product page, and for details about the development kit, check out ipi.wiki website, where you should soon be able to purchase the prototyping platform.

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