Intrinsyc Introduces Open-X 8M SoM and Mini-ITX Development Kit with Optional LCD Display

Intrinsyc announced their own NXP i.MX 8M system-on-module, as well as a corresponding development kit back in February 2018 for Embedded World 2018.

Somehow I missed it until today when the company tweeted about the kit unboxing video, so let’s have a look, starting with the module itself.Open-X 8M SoM specifications:

• SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ up to 1.5 GHz, Arm Cortex-M4 core with 256 KB tightly coupled memory (TCM), Vivante GC7000Lite GPU
• System Memory – 3GB LPDDR4 RAM
• Storage – 16GB eMMC Flash
• Video – 4Kp60 HEVC/H.265 main, and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30 AVC/H.264 decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder
• On-module Connectivity – WiFi  802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1 pre-certified module
• 3x 100 pin board to board connectors exposing:
  • Display Interfaces
    • HDMI 2.0a up to 4096 x 2160 at 60 Hz
    • 4-lane MIPI DSI interface up to 1920×1080 at 60 Hz
  • Camera Interfaces – 2x 4-lane MIPI CSI2 camera inputs
  • Audio Interfaces
    • S/PDIF input and output
    • 1x 16 channel bi-directional SAI digital audio interface supporting I2S, AC97, TDM, DSP
    • 1x 8 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 2x 2 channel bi-directional SAI digital audio interface (I2S, AC97, TDM, DSP)
  • Connectivity – Gigabit Ethernet
  • USB – 2x USB 3.0
  • Other I/Os – 1x PCIe Gen2, 4-bit SDIO, 2x debug UART, JTAG
• Power Supply – 3.3V; PMIC:  NXP PF4210
• Temperature Range – 0°C to +70°C
• Dimensions – 55mm x 35mm

The company provides Linux and Android 8 BSP for the module,  as well as a Open-X 8M development kit featuring a carrier board with the following specifications:

• Supported SoM – Open-X 8M SoM with NXP i.MX 8M/3GB RAM/16GB storage/Wireless module
• Storage – micro SD slot
• Display Interfaces – HDMI 2.0a, MIPI DSI display connector for optional LCD / Touch Panel (as shown on photo above)
• Audio Interfaces
  • 3.5mm line-level stereo output
  • Audio Expansion headers:
    • 1x 16 channel bi-directional SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x 8 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x 2 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x S/PDIF input and output
• Camera – 2x MIPI CSI2 camera connectors for optional camera module
• Connectivity – Gigabit Ethernet, WiFi + Bluetooth (on-module) with PCB antennas on carrier board with coaxial connection to SOM
• USB – 1x USB3.0 Type-A port, 1x USB3.0 Type-C port
• Expansion
  • 1x M.2 socket with PCIe Gen2, USB HS, UART, I2C, I2S
  • I2C, GPIO
  • NAND interface
• Debug Features – JTAG header; dual debug UART (1 Cortex-A53 debug, 1 Cortex-M4 debug) on USB serial micro-B
• Power Supply
  • 12V/3A to barrel jack (power supply included) or USB Type-C power
  • Power probe header for SOM power consumption measurement
• Dimensions – 170 x 170mm (mini ITX form factor)

The video below shows the content of the kit, and first boot to Android.

Both the module and development kit are available, but pricing has not been made public. You can get further details and/or request a quote via Open-X 8M SoM or development kit pages.

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