Variscite VAR-SOM-AM62P SoM features Texas Instruments Sitara AM62P5 SoC for cost-effective multimedia applications

VAR SOM AM62P development kit

Variscite VAR-SOM-AM62P is a system-on-module powered by Texas Instruments Sitara AM62P5 quad-core Cortex-A53 + Cortex-R5F SoC coupled with up to 8GB LPDDR4 RAM and 128GB eMMC flash, and designed for cost-effective multimedia applications. The SO-DIMM module offers high speed interfaces such as gigabit Ethernet and USB 2.0, a certified WiFi 6 and Bluetooth 5.4 module, and operating in the -40 to 85°C industrial range. As a VAR-SOM module, it’s pin-to-pin compatible with other modules from the family such as the VAR-SOM-6UL or VAR-SOM-IMX93. Variscite VAR-SOM-AM62P specifications: SoC – Texas Instruments Sitara AM62P5 CPU 4x Arm Cortex-A53 @ 1.4 GHz up to 12,880 DMIPS Arm Cortex-R5F real-time core up to @ 800 MHz GPU –  3D GPU with OpenGL ES 3.2 & Vulkan1.2 VPU – H.264/H.265 Video Encoder/Decoder No PRU System Memory – 1GB to 8GB LPDDR4 Storage – 8GB to 128GB eMMC flash Networking Gigabit Ethernet PHY (Analog Devices ADIN1300) […]

5th Gen AMD EPYC Embedded 9005 Series Zen 5 processors supports up to 6TB DDR5 memory, up to 160 PCIe Gen 5 lanes

AMD EPYC Embedded 9005

AMD has just introduced the 5th Gen AMD EPYC Embedded 9005 Series “Zen 5” processors designed for embedded systems with a focus on longevity (7 years), reliability, and system resiliency, and targeting networking, storage, and industrial edge systems with support for up to 6TB of DDR5 memory, up to 160 PCIe Gen5 lanes with CXL 2.0. The EPYC Embedded 9005 Series processors are offered with 8 to 192 cores in a single socket and deliver up to a 1.3x faster networking process and 1.6x faster storage. The company also claims a 1.3x increase in socket throughput and 1.3x better performance/Watts compared to the competition thanks to the new Zen 5c architecture. AMD EPYC Embedded 9005 highlights: CPU sub-system AMD EPYC Embedded 9745 to 9965 – Zen 5c architecture up to 12x core complex dies (CCDs), 192x cores, 384x threads AMD EPYC Embedded 9015 to 9655 – Zen5 architecture up to […]

UP Squared 7100 Edge fanless mini PC features Intel Processor N97 or N100 CPU for industrial automation

UP Squared 7100 Edge

AEEON UP Squared 7100 Edge is a fanless industrial mini PC for edge applications powered by an Intel Processor N97 or Processor N100 CPU and based on the UP Squared 7100 SBC. The computer comes with up to 16GB LPDDR5, 128GB eMMC flash, M.2 sockets for storage and wireless expansion, HDMI and DisplayPort video outputs, two gigabit Ethernet ports, three USB 3.2 ports, two COM ports (RS232/RS485), and Line Out and Mic In audio jacks. The mini PC takes 12V DC up to 5A via a screwable DC lock and can operate in the 0 to 60°C temperature range.   UP Squared 7100 Edge mini PC specifications: Alder Lake-N SoC (one or the other) Intel Processor N97 quad-core processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics Gen 12 @ 1.2 GHz; TDP: 12W Intel Processor N100 quad-core processor up to 3.4 GHz with 6MB cache, 24EU […]

ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

OSM-MTK510

ADLINK OSM-MTK510 is an OSM Size-L compliant module powered by a MediaTek Genio 510 hexa-core Arm Cortex-A78/A55 SoC with a 3.2 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and 128GB eMMC flash. The OSM module supports HDMI 2.0, MIPI DSI, and eDP display interfaces, up to 30MP cameras, and I/O options such as gigabit Ethernet, USB 3.0, and PCIe Gen2 x1. The OSM-MTK512 is available in either commercial or industrial (-40°C to 85°C) temperature grades and the company offers at least a 10-year lifecycle for long-term use. ADLINK OSM-MTK510 specifications: SoC – MediaTek Genio 510 (MT8370) CPU – Hexa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU VPU for visual processing Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp60, AV1, VP9, HEVC, H.264 codecs supported AI […]

Edge video processing platform features NXP i.MX 8M Plus, i.MX 93, or i.MX 95 SoC, supports up to 23 camera types

DAB Embedded AquaEdge video processing platform

DAB Embedded AquaEdge is a compact computer based on NXP i.MX 8M Plus, i.MX 93, or i.MX 95 SoC working as an edge video processing platform and supporting 23 types of vision cameras with resolution from VGA up to 12MP, and global/rolling shutter. The small edge computer features a gigabit Ethernet RJ45 jack with PoE to power the device. It is also equipped with a single GSML2 connector to connect a camera whose input can be processed by the built-in AI accelerator found in the selected NXP i.MX processors. Other external ports include a microSD card slot, a USB 3.0 Type-A port, and a mini HDMI port (for the NXP i.MX 8M Plus model only). DAB Embedded AquaEdge specifications: SoC / Memory / Storage options NXP i.MX 8M Plus CPU – Quad-core Cortex-A53 processor @ 1.8GH, Arm Cortex-M7 real-time core AI accelerator – 2.3 TOPS NPU VPU Encoder up to […]

iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iW-RainboW-G54S credit card-sized OSM SBC

iWave Systems iW-RainboW-G54S is a credit card-sized SBC fitted with an OSM Size-S (30x30mm) system-on-module based on STM32MP133 or STM32MP135 Cortex-A7 SoC with up to 1GB RAM, and up to 128GB flash. Interfaces include a Gigabit Ethernet port, a USB Type-A port, an 18-bit RGB LCD display interface, and three 100-pin high-density connectors for additional I/Os. The iW-RainboW-G54S SBC is designed for industrial applications with a temperature range of -40 to +85°C. While it’s fitted with an OSM Size-S module, we’ll also notice the carrier board has a footprint for OSM Size-M (45x30mm) and OSM Size-L (45x45mm) modules indicating it will be used with other OSM modules in the future. iWave Systems iW-RainboW-G54S specifications: System-on-Module – iW-RainboW-G54M SoC (one or the other) STMicro STM32MP133 single-core Cortex-A7 with or without Secure boot + Cryptography; for headless applications STMicro STM32MP135 single-core Cortex-A7 with or without Secure boot + Cryptography; supports LCD-TFT parallel […]

SparkFun Digi X-ON LoRaWAN development kit combines Digi HX15 gateway with RP2350 IoT node and environmental sensors module

SparkFun Digi X ON Kit

SparkFun has recently released the Digi X-ON LoRaWAN development kit an all-in-one IoT development kit designed to simplify the setup and deployment of LoRa-based IoT systems. It includes the Digi HX15 Gateway, SparkFun IoT Node for LoRaWAN, and the ENS160/BME280 environmental sensor, enabling rapid prototyping and connectivity with the help of the Digi X-ON cloud platform. The SparkFun IoT Node is built around the Raspberry Pi RP2350 microcontroller, which features 16MB flash, 8MB PSRAM, multiple GPIOs, LiPo battery support, microSD storage, and USB-C connectivity. It also integrates the Digi XBee LR module for long-range LoRaWAN communication with pre-activated cloud connectivity. With an onboard Qwiic connector and Arduino support, this development kit is ideal for applications like industrial monitoring, environmental sensing, smart agriculture, remote data collection, and more. Digi HX15 gateway specifications Microprocessor – STMicro STM32MP157C MPU with dual-core Cortex A7 @ 650 MHz, Cortex-M4 @ 209 MHz with FPU/MPU, 3D […]

SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SOM SMARC QCS5430 SoM

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

UP 7000 x86 SBC