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Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iW-RainboW-G54S credit card-sized OSM SBC

iWave Systems iW-RainboW-G54S is a credit card-sized SBC fitted with an OSM Size-S (30x30mm) system-on-module based on STM32MP133 or STM32MP135 Cortex-A7 SoC with up to 1GB RAM, and up to 128GB flash. Interfaces include a Gigabit Ethernet port, a USB Type-A port, an 18-bit RGB LCD display interface, and three 100-pin high-density connectors for additional I/Os. The iW-RainboW-G54S SBC is designed for industrial applications with a temperature range of -40 to +85°C. While it’s fitted with an OSM Size-S module, we’ll also notice the carrier board has a footprint for OSM Size-M (45x30mm) and OSM Size-L (45x45mm) modules indicating it will be used with other OSM modules in the future. iWave Systems iW-RainboW-G54S specifications: System-on-Module – iW-RainboW-G54M SoC (one or the other) STMicro STM32MP133 single-core Cortex-A7 with or without Secure boot + Cryptography; for headless applications STMicro STM32MP135 single-core Cortex-A7 with or without Secure boot + Cryptography; supports LCD-TFT parallel […]

Posted on by Debashis Das - No Comments on SparkFun Digi X-ON LoRaWAN development kit combines Digi HX15 gateway with RP2350 IoT node and environmental sensors module

SparkFun Digi X-ON LoRaWAN development kit combines Digi HX15 gateway with RP2350 IoT node and environmental sensors module

SparkFun Digi X ON Kit

SparkFun has recently released the Digi X-ON LoRaWAN development kit an all-in-one IoT development kit designed to simplify the setup and deployment of LoRa-based IoT systems. It includes the Digi HX15 Gateway, SparkFun IoT Node for LoRaWAN, and the ENS160/BME280 environmental sensor, enabling rapid prototyping and connectivity with the help of the Digi X-ON cloud platform. The SparkFun IoT Node is built around the Raspberry Pi RP2350 microcontroller, which features 16MB flash, 8MB PSRAM, multiple GPIOs, LiPo battery support, microSD storage, and USB-C connectivity. It also integrates the Digi XBee LR module for long-range LoRaWAN communication with pre-activated cloud connectivity. With an onboard Qwiic connector and Arduino support, this development kit is ideal for applications like industrial monitoring, environmental sensing, smart agriculture, remote data collection, and more. Digi HX15 gateway specifications Microprocessor – STMicro STM32MP157C MPU with dual-core Cortex A7 @ 650 MHz, Cortex-M4 @ 209 MHz with FPU/MPU, 3D […]

Posted on by Debashis Das - No Comments on SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SOM SMARC QCS5430 SoM

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Toradex launches its first SMARC modules with NXP SoCs for improved compatibility and supply chain

Toradex launches its first SMARC modules with NXP SoCs for improved compatibility and supply chain

Toradex SMARC modules with NXP i.MX 8MPlus and i.MX 95

Toradex has introduced its first SMARC-compliant system-on-modules (SoMs) with the SMARC iMX8M Plus and SMARC iMX95 SoMs based on NXP i.MX 8M Plus and NXP i.MX 95 SoC respectively. The company has made proprietary system-on-modules for years with the Colibri, Apalis, Aquila, and Verdin families. Those typically are cost-optimized and use most or all I/Os from the selected SoC, but customers are tied to one supplier: Toradex. To offer more flexibility, the company decided to introduce its first standardized system-on-modules by selecting the SMARC 2.2 standard for compatibility with existing SMARC-compliant carrier boards and adding the Swiss company as an alternative supplier. Highlights of the SMARC iMX8M Plus module: SoC – NXP i.MX 8M Plus CPU Quad-core ARM Cortex-A53 application processor @ 1.6 GHz Arm Cortex-M7 real-time core @ 800 MHz GPU – Vivante GC380 2D GPU and GC7000UL 3D GPU VPU – 1080p60 video decoder & encoder AI accelerator […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-cBLS COM-HPC Intel Barlett Lake S module

Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others. The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers. Congatec conga-HPC/cBLS specifications: Bartlett Lake-S SoC Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / […]

Posted on by Sayantan Nandy - 4 Comments on Luckfox Lyra boards feature Rockchip RK3506G2 triple-core SoC, display interface, optional Ethernet port

Luckfox Lyra boards feature Rockchip RK3506G2 triple-core SoC, display interface, optional Ethernet port

Luckfox Lyra RK3506G2 RJ45 display interface

The Luckfox Lyra boards feature a Rockchip RK3506G2 triple-core Arm Cortex-A7 SoC with one Cortex-M0 real-time core, 128MB on-chip DDR3, a MIPI DSI display interface, and built on a 22nm process. Three versions are available with the Luckfox Lyra, Lyra B (with 256MB flash), and Luckfox Lyra Plus offering similar features, but the longer Plus model also adds a 10/100Mbps Ethernet RJ45 connector besides having 256MB SPI NAND flash. These are Luckfox’s first boards featuring the RK3506G2 processor, offering Ethernet connectivity and a display interface. But it’s not quite the first Arm Linux board from the company with Ethernet and a display interface, and we covered the Luckfox Pico Ultra micro development board all based on a Rockchip RV1106G3 SoC earlier this year. The company also introduced the similar-looking LuckFox Pico Pro and Pico Max boards powered by an RV1006G2 SoC in February, but instead of a display interface, they […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AAEON’s first Arm-based SMARC 2.1 module is NXP i.MX 8M Plus-powered uCOM-IMX8P system-on-module

AAEON’s first Arm-based SMARC 2.1 module is NXP i.MX 8M Plus-powered uCOM-IMX8P system-on-module

AAEON uCOM-IMX8P top

AAEON has released its first Arm-based SMARC 2.1 compliant CPU module, the uCOM-IMX8P built on the NXP i.MX 8M Plus SoC and offered with up to 4GB RAM, up to 128GB eMMC flash. and support for a range of interfaces such as dual Gigabit Ethernet, USB 3.0, PCIe 3.0, and more. The 82mm x 50mm SMARC system-on-module is designed for industrial use with a -40°C to 85°C operating temperature range, Time Sensitive Networking (TSN) support, CAN Bus, MIPI interfaces, and more. That makes it suitable for applications such as predictive maintenance, process optimization, and automated control systems with cameras and displays. AAEON uCOM-IMX8P specifications: SoC – NXP i.MX 8M Plus CPU – Quad-core ARM Cortex-A53 processor @ 1.6 GHz GPU – Vivante GC380 2D GPU and GC7000UL 3D GPU VPU – 1080p60 video decoder & encoder AI accelerator – Optional 2.3 TOPS Neural Processing Unit (NPU) System Memory – Up […]

Posted on by Debashis Das - No Comments on VOIPAC iMX93 industrial development kit targets AI, HMI, and Edge Computing applications

VOIPAC iMX93 industrial development kit targets AI, HMI, and Edge Computing applications

Voipac iMX93 Industrial Development Kit

VOIPAC Technologies has recently launched its iMX93 Industrial Development Kit (iMX93 module and iMX development baseboard) which comes in Max, Pro, Basic, and Lite configurations. The system-on-module (SoM) is built around the NXP i.MX93 SoC with dual-core Arm Cortex-A55 application processor running at up to 1.7GHz, a Cortex-M33 co-processor running at up to 250MHz, and an Arm Ethos-U65 microNPU with up to 0.5 TOPS of AI performance. Other features include DDR4 memory, eMMC Flash, and industrial-grade 100-pin shielded connectors for signal integrity and thermal performance. Additionally, the devkit also exposes CAN, PWM, ADC, etc.. signals and supports WiFi 6, Bluetooth 5.3, and dual GbE. These features make the VOIPAC iMX93 industrial development kit suitable for applications including AI, machine learning, human-machine interface (HMI) solutions, and more. iMX93 Industrial Development Kit specifications: System-on-Module (four options) iMX93 Industrial Module Max SoC – NXP i.MX 93 dual-core @ 1.7 GHz with real-time Cortex-M33 co-processor NPU […]