NXP EdgeLock A30 Secure Authenticator chip enables battery authentication for compliance with EU regulation 2023/1542

NXP EdgeLock A30 secure authenticator

NXP recently launched the EdgeLock A30 Secure Authenticator chip, a Common Criteria EAL 6+ certified secure authentication designed for IoT devices, including battery authentication applications. It complies with the EU’s Batteries Regulation 2023/1542, which mandates the inclusion of a Digital Product Passport (DPP), by 2027 to ensure traceability, sustainability, and safety in battery manufacturing and recycling. Alasdair Ross, Senior Director, NFC IoT Security, NXP explains: Secure authentication helps to ensure brand protection, consumer safety, and product traceability, fostering trust and shielding devices from physical damage. Smaller than a grain of rice, the EdgeLock A30 is designed to fit into even the smallest of devices. It supports multiple authentication use cases, making it easier for developers to support a variety of devices and accessories with a single solution, including device to device, cloud to device, counterfeit protection, and storage or protection of device identity. To address these requirements NXP’s EdgeLock A30 […]

Linux 6.13 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.13 Changelog

Linus Torvalds has just announced the release of Linux 6.13 on the Linux Kernel Mailing List: So nothing horrible or unexpected happened last week, so I’ve tagged and pushed out the final 6.13 release. It’s mostly some final driver fixes (gpu and networking dominating – normal), with some doc updates too. And various little stuff all over. The shortlog is appended for people who want to see the details (and, as always, it’s just the shortlog for the last week, the full 6.13 log is obviously much too big). With this, the merge window for 6.14 will obviously open tomorrow. I already have two dozen pull requests pending – thank you, you know who you are. Linus Release about two months ago, Linux 6.12 – the new LTS version – brought us real-time “PREEMPT_RT” support that had always required out-of-tree patchsets until now, the completion of the EEVDF (Earliest Eligible […]

NXP MCX L14x and MCX L25x ultra-low-power Cortex-M33 MCUs target energy harvesting and battery-powered devices

MCX L series chip

NXP Semiconductors has launched the MCX L series of ultra-low-power Arm Cortex-M33 MCUs with the MCX L14x and MCX L25x SKUs. The new series offers similar peripherals as the rest of the MCX portfolio but uses a new “power management architecture that supports always-on, battery-powered applications” The MCX L series uses a dual domain architecture, with “real-time processing and ultra-low-power sensing functions in a single device.” The Arm Cortex-M33 core supports real-time processing functions while the Arm Cortex-M0+ core offers always-on operation in the ultra-low-power sense domain. The new microcontrollers reportedly use three times less power than their predecessors. The ultra-low-power series is targeted at energy-constrained applications, powered by a battery, ultracapacitor, or power harvesting circuit. These include building control, industrial sensing, smoke and fire alarms, flow meters, smart appliances, and motion detectors. NXP MCX L14x and L25x specifications: CPU Main core: Arm Cortex-M33 microcontroller @ up to 96 MHz […]

u-blox MAYA-W4 tri-radio IoT module features NXP IW610 chipset with Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios

MAYA-W4 Wi Fi 6 Module

Last year, we covered the u-blox MAYA-W3 module, which was based on the Infineon AIROC CYW5551x chipset and utilized separate chipsets for 2.4 GHz, 5 GHz, and 6 GHz frequencies. Now, u-blox has introduced the MAYA-W4 series, a host-based Wi-Fi 6, Bluetooth 5.4, and 802.15.4 module built on the NXP IW610 chipset. Designed for industrial and commercial applications such as building automation, energy management, smart homes, and healthcare, the MAYA-W4 series supports SISO Wi-Fi 6 with a 20 MHz channel width, ensuring reliable performance in dense network environments. These modules can function as access points, stations, P2P devices, or in mixed modes. The MAYA-W4 modules are compatible with the Matter protocol over Thread and Wi-Fi, facilitating seamless integration across ecosystems. With a compact size of 10.4 x 14.3 mm, these modules rank among the smallest Wi-Fi 6 SMD modules and are available with integrated antennas or U.FL connectors. Rigorous testing […]

Variscite DART-MX91 SoM offers dual GbE, WiFi 6, 15 years support

DART MX91 SoM

The Variscite DART-MX91 system-on-module (SoM) is a compact, cost-effective NXP i.MX 91 Arm Cortex-A55 module which is part of the DART Pin2Pin family already includes the DART-MX93 and DART-MX8M-PLUS among others. The SoM supports up to 2GB of LPDDR4 RAM and 8 to 128 GB of EMMC storage along with dual CAN-FD, dual Gigabit Ethernet, and dual USB interfaces. Wireless options include certified Wi-Fi 6, Bluetooth 5.4, and optional 802.15.4 for low-power wireless communication. Additionally, it supports three I2S audio interfaces, S/PDIF, and support for both digital and analog stereo mics along with 8-bit parallel camera interfaces and display with a capacitive touch controller. Variscite DART-MX91 SoM Specifications SoC – NXP i.MX91 single-core Cortex-A55 processor clocked at 1.4 GHz with 32 KB I-cache and D-cache, 256KB L2 cache (no 3D GPU) System Memory – Up to 2GB LPDDR4 Storage – 8 to 128GB eMMC flash Networking Qualcomm Atheros AR8033 Gigabit […]

NXP i.MX 94 octa-core Cortex-A55/M33/M7 processor targets Edge AI industrial and automotive applications

NXP i.MX 94

NXP i.MX 94 is an octa-core Arm SoC with up to four Cortex-A55 application cores, two Arm Cortex-M33 real-time/functional safety cores, two Arm Cortex-M7 real-time/functional safety cores, and an NXP eIQ Neutron NPU designed for Edge AI industrial and automotive applications I initially thought it would be a cost-down version of the NXP i.MX 95, and while it shares many of the same features, it’s more an application-specific processor designed specifically for industrial and automotive applications, lacking a 3D GPU, camera input interfaces, a MIPI DSI display interface, and 10GbE networking, but increasing the number of real-time cores (at the cost of application cores) and adding several networking features such as an Ethernet time-sensitive networking (TSN) switch, 2.5GbE interface, an Ethercat controller, and support for industrial protocols like Profinet or OPC-UA FX. NXP i.MX 94 specifications: CPU Up to 4x Arm Cortex-A55 cores 2x Arm Corex-M7 cores, one for functional […]

NXP RW612 Arm Cortex-M33 Wireless MCU offers Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios

NXP RW61X Block Diagram

The NXP RW612 is an Arm Cortex-M33 SoC with three radios, namely WiFi 6, Bluetooth 5.4, and 802.15.4 for Thread and Matter connectivity. It also has a small sibling called the RW610 without the 802.15.4 radio. I first came across RW61x chips, when Debashis wrote about the Trimension SR250 UWB chip mentioning it can work with “host processors like NXP’s i.MX, RW61x, and MCX families”. I initially thought it was a typo for the iW612 tri-radio solution introduced in 2022, and the RW612 is indeed similar, but it’s a complete wireless microcontroller/SoC with an Arm Cortex-M33 application core so it can be used independently as a host instead of a companion chip. NXP RW612 and RW610 specifications: MCU sub-system Core – 260 MHz Arm Cortex-M33 with TrustZone-M Memory On-chip 1.2 MB SRAM PSRAM interface for memory expansion Storage – Quad FlexSPI Flash XIP with on-the-fly decryption Peripheral interfaces Up to […]

NXP i.MX RT700 dual-core Cortex-M33 AI Crossover MCU includes eIQ Neutron NPU and DSPs

NXP i.MX RT700 AI crossover MCU block diagram

NXP has recently announced the release of  NXP i.MX RT700 RT700 AI crossover MCU following the NXP i.MX RT600 series release in 2018 and the i.MX RT500 series introduction in 2021. The new i.MX RT700 Crossover MCU features two Cortex-M33 cores, a main core clocked at 325 MHz with a Tensilica HiFi 4 DSP and a secondary 250 MHz core with a low-power Tensilica HiFi 1 DSP for always-on sensing tasks. Additionally, it integrates a powerful eIQ Neutron NPU with an upgraded 7.5 MB of SRAM and a 2D GPU with a JPEG/PNG decoder. These features make this device suitable for applications including AR glasses, hearables, smartwatches, wristbands, and more. NXP i.MX RT700 specifications: Compute subsystems Main Compute Subsystem Cortex-M33 @ up to 325 MHz with Arm TrustZone, built-in Memory Protection Unit (MPU), a floating-point unit (FPU),  a HiFi 4 DSP and supported by NVIC for interrupt handling and SWD […]

EmbeddedTS embedded systems design