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Cypress PSoC 4100/4200 (ARM Cortex M0) Prototyping Kits Sell for $4

I just wrote about Cypress Semiconductor PSoC 4 ARM Cortex M0 MCUs last week, as well as their $25 PSoC 4 pioneer development board. I’ve just found out there are cheaper, albeit very basic, evaluation boards called PSoC 4100 Prototyping Kit (CY8CKIT-049-41xx) and PSoC 4200 Prototyping Kit (CY8CKIT-049-42xx) that sell for only $4. PSoC 4×000 boards specifications: MCU PSoC 4100 ARM Cortex M0 MCU @ 24 MHz with up to 32 kB of flash, Up to 4 kB of SRAM PSoC 4200 ARM Cortex M0 MCU @ 48 MHz with up to 32 kB of flash, Up to 4 kB of SRAM USB – USB port using CY7C65211 USB-serial controller for PC connectivity and serial interfaces such as USB-UART, USB-I2C, USB-SPI, and USB-GPIO Onboard CMOD capacitors to enable CapSense development A bypass capacitor to ensure the high quality ADC conversions Prototyping – Breadboard compatible through holes for access to power, GPIOs, UART, USB etc… Misc – User and power […]

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AMD Introduces Embedded G-Series “Steppe Eagle” SoCs and “Crowned Eagle” CPUs

​AMD has added six new members to is Embedded G-Series family with “Steppe Eagle” SoCs comprising a CPU, GPU and I/O in a single chip, and “Crowned Eagle” CPUs that are not actually CPUs in the old sense, but SoCs comprised of a CPU and I/O chipset, and all of them also include AMD’s ARM based PSP (Platform Security Processor) built upon ARM TrustZone architecture. You may also remember AMD G-Series APUs which are comprised of a CPU and GPU, and connected to an external I/O chipset, but none of these were announced today. The six new AMD G-Series processors are as follows: “Steppe Eagle” SoCs: GX-424CC – Quad core @ 2.4 GHz with 2MB L2 cache, and a GPU @ 497MHz. DDR3-1866 support. TDP: 25W GX-412HC – Quad core @ 1.2 GHz with 2MB L2 cache, ad a GPU @ 300MHz. DDR3-1333 support. TDP: 7W GX-212JC – Dual core @ 1.2 GHz […]

ArmSoM RK3588 AIModule7 NVIDIA Jetson Nano-compatible SOM
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First Tizen 3.0 Common Milestone Released, Developer Program Announced

The Tizen Steering Group has announced the first release of Tizen 3.0 Common. Tizen Common is the common subset of development / build / test platform of the Tizen profiles, used by platform developers to develop the next version of the profiles, and a Tizen 3.0 common release is planned every quarter. This milestone release includes: 64-bit support for both Intel and ARM architectures Crosswalk-based web runtime Multiuser support Systemd Security: three-domain rule system for SMACK and Cynara as authorization framework Wayland display server Pre-built binary releases for can be downloaded @ http://download.tizen.org/releases/daily/tizen/common/common-wayland-x86_64/tizen_20140602.26/ for Intel Atom 3815 NUC Kit and NEXCOM VTC1010 in-vehicle computer based on Intel Atom 3825. However, Tizen 3.0 Common will also be tested on Intel NUC Haswell (core i5),  Lenovo x230 IvyBridge (core i5) and on the ARM side, ODROID-U3 development board. If you want to build your own, refer to the developer guide, using tizen_common_2014.Q2 tag. More details can be found […]

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MediaTek Unveils LinkIt Platform with MT2502 Aster SoC for Wearables and IoT Applications

After Ineda Systems Dhanush SoC and SHASTRA Devkit, here’s another Wearable SoC and development kit for today with Mediatek announcement of their LinkIt platform providing both hardware and software to develop wearables and IoT applications using their Aster SoC for wearables. Key features of LinkIt platform listed on Mediatek Labs: MediaTek Aster (MT2502) measures only 5.4 x 6.2mm and is specifically designed for wearable devices Developer platform supported by reference designs that enable creation of various form factors, functionalities and internet connected services Synergies between microprocessor unit and communication modules, facilitating development and saving time in new device creation Modularity in software architecture provides developers with high degree of flexibility Supports over-the-air (OTA) updates for apps, algorithms and drivers Plug-in software development kit (SDK) for Arduino and VisualStudio; planned (Q4 2014) support for Eclipse Hardware Development Kit (HDK) based on LinkIt board by third party No details have been provided for […]

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Ineda Systems Dhanush WPU is a MIPS based SoC Specifically Designed for Wearables

What’s a WPU? It stands for Wearable Processor Unit, and as you may guess it’s a processor specifically designed to be used in wearables such as smartwatches or fitness trackers. Currently, many wearables are based on application processors that are used in smartphones (e.g. Galaxy Gear), and lower-end versions are based on standard low power MCUs (e.g. Pebble), but none of them are actually based on SoC specifically designed for wearables, and analysts are asserting that new types of SoC are definitely needed if companies are to provide wearables with the battery life and features consumers want. Ineda Systems Dhanush WPU is not the first Wearable SoC announced, as for instance AllWinner mentioned their WX quad-core SoC for Wearables should become available in Q4 2014 in their roadmap, and Mediatek vaguely unveiled their Aster SoC at CES 2014, but it’s the first that I know of where we’ve got most of the […]

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Aaeon AIOT-X1000 Linux Gateway is Powered by an Intel Quark SoC

Intel Quark SoC for low power embedded devices has been seen on platforms designed by Intel themselves, such as Intel Galileo board or Edison wearable development kit, but I had not found Quark SoC in actual products until Aaeon announced their AIOT-X1000 gateway for the internet of things running Linux on an Intel Quark X1000 SoC, and working with a Cloud Service by Asus, Aaeon’s parent company. The solution targets manufacturing, transportation, and energy applications. Aaeon AIOT-X1000 specifications: Processor – Intel Quark X1000-series SoCs @ up to 400 MHz System Memory – 1GB DDR3 800/1066 SODIMM Storage – IDE port, and micro SD slot Connectivity – 10/100M Ethernet USB 4x USB2.0 ports Serial – 1x RS-232/422/485, 1x RS-422/485 Other I/Os — I2C, GPIO, JTAG Mini-PCIe card expansion – 1x full-size and  1x half-size, allowing for WiFi, 2G/3G/LTE cellular, Bluetooth, CAN bus, ZigBee, and RFID add-on boards Power – 5V or 9-24V DC input Dimensions – 146 x […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025
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Get Cypress PSoC 4 MCUs for $1 Delivered to Your Door by Fedex

How many times have you found a low cost MCU, or a development kit, ready to order, until shipping fees, sometimes several times the price of the item, curbed your enthusiasm, to the point you just decided to cancel your purchase? It happened to me several times, so I was pleased to find out Cypress Semiconductor will ship their PSoC 4 MCUs via Fedex anywhere in the world without actually charging for shipping. PSoC 4 are ARM Cortex M0 MCUs with up to 32 kB Flash, up to 4 kB SRAM, and analog and digital I/Os. CY8CKIT-042 PSoC 4 Pionner Kit is the corresponding kit development kit, which happened to be voted product of the year 2013 on Element14 community beating the BeagleBone Black, Freescale SABRELite, and PiFace Digital for the Raspberry Pi. Development can be performed using PSoC Creator, and there seems to be a developer community active enough to provide 100 projects in 100 days. So […]

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Intel Showcases Tablet / 2-in-1 Reference Design based on 14nm “Broadwell” Core M SoC

Intel has unveiled a thin tablet reference design at Computex 2014, in Taiwan, which is based on their upcoming “Broadwell” Core M processor manufactured using 14nm process technology, which will be the most power efficient Intel Core processor to date. Intel fanless mobile PC reference design features a 7.2mm thick, 12.5″ tablet that weights 670 grams. You can also connect it to a media dock providing additional cooling allowing more performance, as well as a keyboard dock. Intel expects 2-in-1 products (tablet + laptop) based on Intel Core M to be available later this year.     Intel claims 60% lower power dissipation, 20 to 40% better performance, and 10 to 45% low SoC power, and half the package footprint compared to third generation “Haswell” Core processors, which will allow fanless and thin designs. Currently Mobile Haswell Core processors have a maximum TDP of 11.5W to 47W, so in theory, at best, Broadwell SoCs might achieve […]

Boardcon CM3588 Rockchip RK3588 System-on-Module designed for AI and IoT applications