OSD3358 SiP Integrates TI Sitara AM3358 SoC, Memory, PMIC, LDO and Passive Components into a Single BGA System-in-Package
Octavo Systems has created a BeagleBone Black reference design that’s exactly like the original board, except for one detail: It’s based on the company’s OSD3358 system-in-package (SiP) that combine Texas Instruments AM3358 Cortex A8 processor with up to 1GB RAM, TI LDO and PMIC, and over 140 passive components into a single 400-ball BGA package. The only three other main components on the reference design are the eMMC flash, Ethernet transceiver and HDMI framer. Key specs of OSD3358 SiP: Texas Instruments AM335x (AM3358 or AM3352) Cortex A8 processor @ 1 GHz 256MB, 512 MB or 1GB DDR3 memory Texas Instruments TPS62217C PMIC Texas Instruments TL5209 LDO Over 140 passive components Package – 400 1.27mm pitch BGA – 27 x 27 mm package size Temperature Range – Base version: 0 to 85°C; Industrial version: -40° to 85° C Some of the advantages of a SiP package over using multiple chips include faster […]