Posted on by Tomisin Olujinmi - No Comments on Ronetix launches NXP i.MX93 SoMs in SMARC and OSM-L form factors

Ronetix launches NXP i.MX93 SoMs in SMARC and OSM-L form factors

RNX iMX93 SMARC

Austrian embedded equipment manufacturer, Ronetix, has released two i.MX93 system-on-modules (SoMs): the RNX-iMX93-OSM that follows the Open Standard Module (OSM) form factor, and the RNX-iMX93-SMARC compliant with the SMARC 2.1 (smart mobility architecture) standard. Ronetix i.MX93 SoMs are powered by the NXP i.MX93 processor featuring a 64-bit dual-core Arm Cortex-A55 application processor running at 1.7GHz and a Cortex-M33 core running at 250MHz for low-latency and real-time tasks. The SoC supports up to 2GB LPDDR4 RAM and 512GB eMMC storage, and the integrated Arm Ethos-U65 microNPU offers up to 0.5 TOPS of computing power for machine vision applications and intelligent energy management (IEM). Applicable for industrial automation and IoT, the SoMs also feature two CAN and Ethernet interfaces to aid high-speed data transfer. Other hardware featuring the i.MX93 that we have covered recently include the ADLINK OSM-IMX93, MaaXBoard OSM93, and Ka-Ro Electronics’ QS93. The RNX-iMX93-SMARC system-on-module comes in 82 x 50mm […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on IBASE ISR500 fanless Edge AI computer and digital signage player features MediaTek Genio 510 or 700 SoC

IBASE ISR500 fanless Edge AI computer and digital signage player features MediaTek Genio 510 or 700 SoC

Mediatek Genio 700 Edge AI computer

IBASE Technology ISR500 is a fanless digital signage player and Edge AI computer powered by either a MediaTek Genio 510 hexa-core Cortex-A78/A55 processor or Genio 720 octa-core Cortex-A78/A55 SoC with a real-time AI performance up to 3.2 TOPS. The system ships with 4GB RAM and 64GB eMMC flash, features two HDMI video outputs, a gigabit Ethernet port, a few USB ports, a 3.5mm audio jack, a COM port, and an M.2 socket for wireless expansion. IBASE ISR500 specifications: SoC (one or the other) MediaTek Genio 700 (MT8390) Octa-core CPU – Dual-core Cortex-A78 @ 2.2GHz with 256KB L2 cache, hexa-core Cortex-A55 @ 2.0GHz with 128KB L2 cache, shared 2MB L3 cache GPU – Arm Mali-G57 MC3 with support for OpenGL ES 1.1/2.0/3.2, Vulkan 1.0/1.1, OpenCL 2.2 AI accelerator – Tensilica VP6 MediaTek APU 3.0 up to 3.2 TOPS VPU Video Encode – 4Kp30 H.265/H.264 Video Decode – 4Kp75, AV1, VP9, H.265/H.264 […]

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Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on ASRock SBC-262M-WT 3.5-inch motherboard features up to Intel Atom X7433RE Amston Lake processor

ASRock SBC-262M-WT 3.5-inch motherboard features up to Intel Atom X7433RE Amston Lake processor

Amston Lake 3.5-inch motherboard

ASRock Industrial SBC-262M-WT is a 3.5-inch SBC motherboard powered by the latest Intel Atom x7433RE quad-core Amston Lake embedded processor with support for up to 48GB DDR5-4800 memory, triple 4K display outputs, two Ethernet ports, including one with 2.5Gbps Ethernet and Intel TSN/TCC. The motherboard also takes SATA 3.0 and M.2 Key M NVMe storage, offers multiple USB interfaces, supports WiFi and/or  4G LTE or 5G cellular connectivity via M.2 modules and SIM card socket, and provides industrial features such as a wide -40 to 85°C operating temperature range and a wide 9V to 36V DC voltage input range that make it suitable for smart retail, smart cities, and embedded industrial environments. ASRock Industrial SBC-262M-WT 3.5-inch motherboard specifications: SoC – Intel Amston Lake Processors up to Atom X7433RE quad-core processor clocked up to 3.4GHz with Intel UHD Graphics; 9W TDP System Memory – Up to 48GB single-channel DDR5 4800 MHz […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on STMicro LSM6DSV32X Edge AI motion sensor aims to extend battery life in wearables, trackers, and activity monitors

STMicro LSM6DSV32X Edge AI motion sensor aims to extend battery life in wearables, trackers, and activity monitors

STMicro LSM6DSV32X AI motion sensor

STMicro LSM6DSV32X is a new low-power 6-axis inertial module with the company’s machine-learning core (MLC) with AI algorithms based on decision trees, a 3-axis accelerometer with a full-scale range of 32g, and a 4000 degrees-per-second gyroscope designed to measure intensive movements, impacts, and freefall height (estimation). The features of the sensors enable it to lower the power consumption for functions such as gym-activity recognition to under 6µA, while 3D orientation tracking consumes just 30µA when using STMicro’s Sensor Fusion Low-Power (SFLP) algorithm. It will be found in a range of battery-powered devices such as consumer wearables, asset trackers, and impact and fall alarms for workers or the elderly. STMicro LSM6DSV32X specifications: Triple-channel architecture for UI (user interface), EIS, and OIS data processing Data storage – Smart FIFO up to 4.5 KB Sensors Accelerometer – ±4/±8/±16/±32 g full scale Gyroscope – ±125/±250/±500/±1000/±2000/±4000 dps full scale Embedded temperature sensor Host interfaces SPI, […]

Posted on by Dennis Mwihia - No Comments on Ambarella CV75S AI SoC brings Vision Language Models (VLM) and Vision Transformer Networks to cameras

Ambarella CV75S AI SoC brings Vision Language Models (VLM) and Vision Transformer Networks to cameras

ambarella cv75s

Ambarella has been expanding its AI SoC portfolio, and the latest addition is the CV75S family of 5nm chips. The company claims this family introduces the most cost- and power-efficient SoC option for running the latest AI-based image processing like vision language models (VLMs) and vision transformer networks in security, robotics, conferencing, and sports cameras. The CV75S family is the first in Ambarella’s lineup to integrate the latest CVflow 3.0 AI engine, which results in 3 times the performance compared to the former generation. CVflow 3.0 is a chip architecture designed based on a deep understanding of the core computer vision algorithms. It features a dedicated vision-processing engine that Ambarella has programmed using a high-level algorithm description and works with Tensorflow, Caffe, and PyTorch. This engine enables the SoC to perform trillions of operations each second at a fraction of the power consumption of leading GPUs and general-purpose CPU solutions. These chips also […]

Posted on by Debashis Das - 1 Comment on BIGTREETECH Pi 2 SBC and CB2 module for 3D printers now feature Rockchip RK3566 SoC with Gigabit Ethernet

BIGTREETECH Pi 2 SBC and CB2 module for 3D printers now feature Rockchip RK3566 SoC with Gigabit Ethernet

BIGTREETECH Pi 2 and the BIGTREETECH CB2 Compute Modules

BIGTREETECH recently announced the release of the BIGTREETECH Pi 2 SBC and BIGTREETECH CB2 SoM, both powered by the Rockchip RK3566 SoC. These new modules are direct upgrades from the BIGTREETECH Pi v1.2 and BIGTREETECH CB1, which we covered and reviewed in our previous posts. Specially designed for 3D printers, these new modules have a similar form factor to that of a Raspberry Pi and the RPI CM4 module, and come with a set of upgraded features including support for GbE Ethernet, dual-band WiFi, up to 32GB of LPDDR4 RAM, eMMC storage, HDMI, USB, and more. BIGTREETECH Pi 2 Specifications SoC – Rockchip RK3566 CPU – Quad-core Arm Cortex-A55 processor @ 1.8 GHz GPU – Arm Mali G52-2EE GPU with support for OpenGL ES 1.1/2.0/3.2, Vulkan 1.1, OpenCL 2.0 NPU – 0.8 TOPS AI accelerator VPU – 4Kp60 H.265/H.264/VP9 video decoding, 1080p100f H.265/H.264 video encoding System Memory – 2GB LPDDR4 (Customizable – 1GB/2GB/4GB/8GB) […]

Rockchip RK3568/RK3588 and Intel x86 SBCs
Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Silicon Labs BG22E, MG22E, FG22E wireless MCUs target energy harvesting, battery-free IoT devices

Silicon Labs BG22E, MG22E, FG22E wireless MCUs target energy harvesting, battery-free IoT devices

BG22E MG22E FG22E energy harvesting wireless microcontroller

Silicon Labs xG22E is a family of wireless SoCs consisting of the BG22E, MG22E, and FG22E and designed to operate within an ultra-low power envelope required for battery-free, energy harvesting applications such as electronic shelf labels, Smart Home sensors, remote controls, and so on. Like the just-announced Silicon Labs MG26, BG26, and PG26, the new xG22E family features a Cortex-M33 core clocked up to 76.8MHz. As an evolution of the low-power BG22, the BG22E offers Bluetooth 5.4 LE connectivity with “Energy Conservation” to further enhance battery longevity and even support designs that eliminate the need for batteries. The MG22E is similar but embeds an 802.15.4 radio for Zigbee connectivity, and the FG22E provides a 2.4GHz proprietary plus the Cortex-M33 is clocked up to 38.4MHz. Silicon Labs BG22E, MG22E, FG22E specifications: MCU – Arm Cortex-M33 @ 76.8 MHz with DSP and FPU (38.4 MHz for FG22E) Memory – Up to 32 […]

Posted on by Tomisin Olujinmi - 5 Comments on SC730 module from Small Computer Central features the now-discontinued Zilog Z80 CPU

SC730 module from Small Computer Central features the now-discontinued Zilog Z80 CPU

SC730 RCBus Z80 CPU plus MMU Module

Small Computer Central has released a new module kit, the SC730, for the 80pin-RCBus backplane which features the widely-used 8-bit Zilog Z80 CPU and a memory management unit. The Zilog Z80 is an 8-bit microprocessor created to be compatible with the Intel 8080 microprocessor while offering more advanced features such as built-in DRAM refresh, a better interrupt system, and non-multiplexed buses. The Z80 microprocessor was widely used for various applications between the 70s and the 80s and is still quite popular among retro computing enthusiasts today. Cousins’ SC730 module kit is designed to fit into an 80-pin socket on an RCBus backplane. The module is built to be used with a memory module as part of a complete computer system. The memory management unit (MMU) is compatible with a 1MB linear memory module such as the SC721. It maps a fixed 32KB bank of RAM to the top of the […]

Boardcon Rockchip and Allwinner SoM and SBC products