Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-cBLS COM-HPC Intel Barlett Lake S module

Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others. The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers. Congatec conga-HPC/cBLS specifications: Bartlett Lake-S SoC Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Arduino Portenta Proto Kit ME aims to ease prototyping for professionals

Arduino Portenta Proto Kit ME aims to ease prototyping for professionals

Arduino Portenta Proto Kit ME

Arduino has introduced the Portenta Proto Kit ME (Motion Environment) at CES 2025 with the kit designed to allow engineers, designers, and innovators to turn ideas into functional prototypes quickly. The kit does not include new hardware, but it is based on the Arduino Portenta H7, Mid Carrier, and Nicla Sense ME module, as well as other off-the-shelf parts such as a 4G LTE and GNSS module and some Modulino modules, plus three months of Arduino Cloud access. The company expects the prototyping kit to be used for predictive maintenance, environmental sensing, and industrial automation prototypes. Arduino Portenta Proto Kit ME kit content: Portenta H7  board based on STMicro STM32H747 Arm Cortex-M7 @ 480 MHz + M4 @ 200 MHz MCU capable of handling ML workloads and advanced processing Portenta Mid Carrier with gigabit Ethernet, USB 2.0 port, MIPI CSI and Arduino camera connectors, CAN Bus, mPCIe socket, GPIO header, […]

ArmSoM CM5 Raspberry Pi CM4 alternative with Rockchip RK3576 SoC
Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on HDMI 2.2 to support Ultra96 HDMI cable, DisplayPort 2.1b coming soon for DP80LL cables

HDMI 2.2 to support Ultra96 HDMI cable, DisplayPort 2.1b coming soon for DP80LL cables

HDMI 2.2 Ultra96 HDMI cable

The HDMI Forum and VESA had announcements for the upcoming HDMI 2.2 and DisplayPort 2.1b respectively at CES 2025 mostly to introduce future cables supporting higher bandwidth of up to 96 Gbps for the Ultra96 HDMI cable and 80Gps for the DP80LL cables. HDMI 2.2 and Ultra96 cable We don’t have that many details yet, and both were announcements about the future release of specifications. HDMI Forum explained that version 2.2 of HDMI specification will handle up to 96Gbps bandwidth (double the 48Gbps supported by HDMI 2.1) and support next-gen HDMI Fixed Rate Link technology to “provide optimal audio and video for a wide range of device applications” as well as Latency Indication Protocol (LIP) for improving audio and video synchronization, notably in audio video receivers or soundbars. The higher bandwidth will be especially useful for data-intensive, immersive, and virtual applications such as AR/VR/MR, spatial reality, and light field displays, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ASROCK Industrial launches NUC(S) Ultra 200 (Intel Arrow Lake-H) and 4X4 AI300 (AMD Ryzen 300 AI) motherboards and BOX PCs

ASROCK Industrial launches NUC(S) Ultra 200 (Intel Arrow Lake-H) and 4X4 AI300 (AMD Ryzen 300 AI) motherboards and BOX PCs

ASROCK Industrial NUC Ultra 200 BOX PC Motherboard

Following new SoC announcements by Intel and AMD at CES 2025, ASRock Industrial has launched the NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series powered by Intel Core Ultra 200H Arrow Lake-H processors with of to 99 TOPS of AI inferencing power, and the 4X4 BOX AI300 Series and 4X4 AI300 Motherboard Series based on  AMD Ryzen AI 300 processors with up to 50 TOPS of NPU performance. ASROCK NUC(S) Ultra 200 BOX PCs & NUC ULTRA 200 motherboards NUC(S) Ultra 200 specifications: Arrow Lake-H/U SoC (one or the other) Intel Core Ultra 7 255H (6P+8E) processor up to 5.1 GHz with 24MB cache, Intel Arc 140T GPU (74 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 Watts Intel Core Ultra 5 225H (4P+8E) processor up to 4.9 GHz with 18MB cache, Intel Arc 130T GPU (63 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on Qualcomm Snapdragon X octa-core Arm SoC to power $600+ mainstream AI PCs with Copilot+ support

Qualcomm Snapdragon X octa-core Arm SoC to power $600+ mainstream AI PCs with Copilot+ support

Qualcomm Snapragon X highlights

Qualcomm has unveiled the Snapdragon X octa-core Arm SoC at CES 2025 designed for mainstream AI PCs with Copilot+, which should start at $600 and up. This follows the announcements of the high-end 4.3GHz Snapdragon X Elite 12-core SoC in 2023, and the Snapdragon X Plus 10-/8-core processors last year, and should make AI PCs affordable to a wider range of consumers. The new Snapdragon X is clocked at up to 3.0 GHz, still features a 45 TOPS Hexagon NPU, supports NVMe storage, up to 64GB LPDDR5,  up to 2560 x 1440 built-in displays, up to three external displays at 4Kp60, and a single camera up to 36MP resolution. Systems based on the new octa-core processor can support WiFi 7, WiFi 6E, and/or 5G LTE connectivity. Qualcomm Snapdragon X (X1-26-100) specifications: CPU – Octa-core 64-bit Armv8 Oryon processor clocked at up to 3.0 GHz (2976 MHz) with 30MB cache GPU […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on FOSDEM 2025 schedule – Embedded, Open Hardware, RISC-V, Edge AI, and more

FOSDEM 2025 schedule – Embedded, Open Hardware, RISC-V, Edge AI, and more

FOSDEM 2025 Schedule Embedded

FOSDEM 2025 will take place on February 1-2 with over 8000 developers meeting in Brussels to discuss open-source software & hardware projects. The free-to-attend (and participate) “Free and Open Source Software Developers’ European Meeting” grows every year, and in 2025 there will be 968 speakers, 930 events, and 74 tracks. Like every year since FOSDEM 2015 which had (only) 551 events, I’ll create a virtual schedule with sessions most relevant to the topics covered on CNX Software from the “Embedded, Mobile and Automotive” and “Open Hardware and CAD/CAM” devrooms, but also other devrooms including “RISC-V”, “FOSS Mobile Devices”, “Low-level AI Engineering and Hacking”, among others. FOSDEM 2025 Day 1 – Saturday 1 10:30 – 11:10 – RISC-V Hardware – Where are we? by Emil Renner Berthing I’ll talk about the current landscape of available RISC-V hardware powerful enough to run Linux and hopefully give a better overview of what to […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025
Posted on by Debashis Das - 8 Comments on PiSugar3 is a low-cost Raspberry Pi UPS module with RTC, hardware battery protection, and power management features

PiSugar3 is a low-cost Raspberry Pi UPS module with RTC, hardware battery protection, and power management features

Pisugar 3 Raspberry Pi UPS module

PiSugar Kitchen’s PiSugar3 is a compact Raspberry Pi UPS module with integrated power management features that make Raspberry Pi Zero boards portable. This new module is an upgraded version of the PiSugar S and PiSugar S Pro, which we previously wrote about. The PiSugar S features a compact 1,200mAh battery for Raspberry Pi Zero, and the PiSugar S Pro comes with a 5,000mAh battery for Raspberry Pi 3/4. The PiSugar3 adds new features to these models with upgrades including an RTC, and a fully functional UPS functionality with customizable wake-up options. It also includes an anti-mistaken touch switch to avoid accidental shutdowns, a software watchdog, and hardware battery protection to extend battery longevity. The UPS module gets attached to the bottom of the Pi and there are pogo pins on the UPS module that deliver the power while the GPIO pins of the Pi remain free for other tasks, on top […]

Posted on by Tomisin Olujinmi - No Comments on ZigEasy GEX is a series of ZigBee 3 & DigiMesh coordinators powered by the XBee 3 and XBee SX 868 modules

ZigEasy GEX is a series of ZigBee 3 & DigiMesh coordinators powered by the XBee 3 and XBee SX 868 modules

ZigEasy GEX Zigbee DigiMesh coordinators

The ZigEasy GEX series is a lineup of Zigbee / DigiMesh coordinators and Ethernet gateways based on Digi International’s XBee 3 and XBee SX 868 modules. These devices connect a ZigBee or DigiMesh network to a local Ethernet network or the internet. This makes it easier to create a robust Zigbee/DigiMesh network that can send and receive data from servers. The GEX2400 and GEX2400S devices integrate the Digi XBee3 module which supports Zigbee, 802.15.4, DigiMesh, and BLE and is configured directly with the XCTU software (USB or TCP/IP). The Digi SX 868 module on the GEX868 and GEX868S coordinators only supports DigiMesh. The “S” models include TLS 1.2 and AES-256 encryption for secure internet communication and are ideal for use cases that require internet access. These ZigEasy GEX Zigbee / DigiMesh coordinators can be used in mesh networks for smart homes, monitoring weather conditions, and tracking agricultural data. They can […]

Boardcon EM3562 Rockchip RK3562 SBC with 8 analog camera inputs