Intrinsyc Open-Q 670 HDK Development Kit Features Snapdragon 670 Processor
Qualcomm introduced the Snapdragon 670 this August with improved camera capabilities and improved performance, including a near doubling of the performance of the AI Engine over the one in Snapdragon 660. Intrinsyc is normally the first company to launch mobile development platform for Qualcomm processor, and this time is no exception, as the company has just introduced Open-Q 670 HDK Development Kit with Snapdragon 670 Mobile Platform. Open-Q 670 HDK specifications: SoC – Qualcomm Snapdragon SDA670 Octa-core 64-bit Kryo 360 processor with 2x high-performance Gold cores @ 2.016 GHz, 6x low-power Silver cores @ 1.708 GHz, Qualcomm Adreno 615 GPU @ 430 MHz, and Qualcomm Hexagon 685 DSP dedicated for Computer Vision and Video Post Processing System Memory – 6GB LPDDR4x RAM Storage – 64GB eMMC 5.1 Flash Storage (non-PoP memory) + uSD card socket Display MIPI DSI connector with 1x 4-lane DSI port + Touch for included LCD panel […]