CNX Software - Embedded Systems News

March 27, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

AsiaRF AWH575-MF1 WiFi HaLow industrial IoT controller offers RS232, RS485, I2C, SPI, UART, and ADC interfaces

AsiaRF AWH575-MF1 is a WiFi HaLow industrial IoT controller / remote control kit with RS232, RS485, I2C, SPI, UART, and 12-bit ADC interfaces to connect sensors or actuators and designed for long-range, low-power M2M communication. The board is comprised of an STMicro STM32U5 Cortex-M33 microcontroller to handle I/Os and communicate with an MM6108 WiFi HaLow (802.11ah) module made by AsiaRF. The board takes power from a USB-C port or optionally from a terminal block supporting a wider 9V to 24V DC input. AsiaRF AWH575-MF1 specifications: MCU – STMicro STM32U585CIT6Q CPU – Arm Cortex-M33 core @ 160 MHz Memory – 786 KB SRAM Storage – 2MB Flash Wi-Fi HaLow AsiaRF 802.11ah module based on Morse Micro MM6108 chipset Frequency Range – 902MHz to 928MHz Channel bandwidth – 1/2/4/8MHz Data Rate – Single-stream max data rate of 10 Mbps Transmit Power – 21dBm +/-2dBm @ MCS 0 Modulation – BPSK/QPSK/16 QAM/64 QAM […]

March 27, 2025March 26, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Radxa CM3J industrial-grade Rockchip RK3568J SoM is compatible with Raspberry Pi Compute Module 4

Radxa CM3J is a Raspberry Pi Compute Module 4 compatible SoM powered by a Rockchip RK3568J industrial-grade quad-core Cortex-A55 SoC and equipped with up to 8GB LPDDR4x and up to 256GB eMMC flash. It’s an update to the Radxa CM3 based on the Rockchip RK3566 SoC with an industrial temperature range and only two board-to-board connectors, and can also be viewed as a cost-down version of the Radxa CM3i with RK3568 and four B2B connectors. It competes directly against the industrial-grade Raspberry Pi Compute Module 4 introduced at the beginning of this month. Radxa CM3J specifications compared to the Radxa CM3 and Raspberry Pi CM4: The Radxa CM3J has been tested with the official Raspberry Pi CM4 IO Board, WaveShare CM4‑POE‑UPS‑BASE, WaveShare CM4‑IO‑BASE‑B, and WaveShare CM4‑NANO‑B, but other carrier boards for the Compute Module 4 may also be supported. Like with other such modules, there’s no 100% pin compatibility with […]

ArmSoM RK3588 AIModule7 NVIDIA Jetson Nano-compatible SOM

March 26, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Sterolabs ZED Box Mini is a compact NVIDIA Jetson Orin Nano/NX Vision AI PC with two GMSL2 camera inputs

Stereolabs ZED Box Mini “Super” is a compact mini PC based on NVIDIA Jetson Orin Nano or NX system-on-module and equipped with two GMSL2 camera inputs with synchronization trigger input/output, enabling AI Vision processing for robotics and smart infrastructure. The AI vision mini PC / embedded computer unit (ECU) also features a 256GB SSD, HDMI 1.4/2.1 video output, a gigabit Ethernet port, an optional Intel AX201 wireless module with two external antennas, a USB 3.0 port, a micro USB port for flashing the OS, and a 10-pin GPIO header with CAN Bus and UART for expansion. ZED Box mini specifications: System-on-Module (one or the other) NVIDIA Jetson Orin Nano 4GB | 34 TOPS NVIDIA Jetson Orin Nano 8GB | 67 TOPS NVIDIA Jetson Orin NX 8GB | 117 TOPS NVIDIA Jetson Orin NX 16GB | 157 TOPS Storage – 256GB SSD inserted in M.2 Key-M 2242 socket Video Output – […]

March 26, 2025March 26, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Teledyne Tetra 2.5 GbE line scan camera supports up to 8K resolution for machine vision applications

Teledyne DALSA has recently announced the Tetra line scan camera family with 2.5GbE networking, up to 8K resolution, a line rate of up to 150 kHz, and offered in monochrome or color versions. Traditional cameras (aka scan camera) will capture a full frame, but line scan cameras will only capture one line at a time to scan an object or scene as it moves past the camera providing higher resolution image provided the speed of the scan and the motion of the object are syncrhonized, for instance, on a production line. Line scan cameras like the Tetra are typically used for quality control at the factory, document scanning, license plate scanning, and scientific research (e.g. satellite imaging). Teledyne Tetra specifications: Color cameras Tetra 2k Color – TL-GC-02K05T-00 Resolution – 2048 x 3 Pixel size – 14 μm Max line rate – 50 kHz x 3 Tetra 4k Color – […]

March 26, 2025March 26, 2025 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

$23 ArmSoM Forge1 industrial SBC is powered by Rockchip RK3506J SoC

ArmSoM Forge1 is an industrial SBC (single board computer) powered by the Rockchip RK3506J triple-core Cortex-A7 processor designed for Smart Audio, HMI, and factory automation applications. The Forge1 is equipped with 512MB RAM, 512MB NAND flash, two Fast Ethernet ports, a MIPI DSI display connector, USB Type-A and Type-C ports, an audio jack, a 40-pin GPIO header partially compatible with Raspberry Pi HATs, and a 16-pin header with speaker output, microphone input, RS-485, and CAN Bus. ArmSoM Forge1 specifications: SoC – Rockchip RK3506J CPU 3x Arm Cortex-A7 core up to 1.5 GHz Arm Cortex-M0 real-time core GPU – 2D GPU only No VPU, no NPU System Memory – 512MB DDR3L Storage 512MB SPI NAND flash MicroSD card Video Output – 2-lane MIPI DSI connector up to 1280 x 1280@ 60FPS Audio 3.5mm audio jack Speaker and Mic via expansion header Networking – 2x 100Mbps Ethernet RJ45 ports USB 1x USB […]

March 25, 2025March 25, 2025 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

LaserPecker LP5 fiber and diode laser engraver review – Part 1: Unboxing and assembly with rotary extension and safety enclosure

LaserPecker LP5 review Rotary Extension Safety Enclosure

We’ve just received the LaserPecker LP5 20W Fiber Laser + Diode Laser engraver for review as part of a kit that includes a rotary extension to engrave cylindrical objects like bottles and glasses and a safety enclosure to engrave or cut workpieces with maximum safety in a fully-enclosed chassis. The LP5 is one of the smallest 2-in-1 laser engravers in the industry and can engrave on a wide range of materials. The fiber laser is suitable for stainless steel, aluminum, brass, silver, plastic, platinum, titanium, gold, etc, while the diode laser works best on wood, acrylic, leather, glass, stone, paper, and rubber. The device is supposed to be relatively fast with an engraving speed of up to 10,000mm/s, and it can cut wood up to 15mm thick and metal up to 1mm thick. We usually do a one-part review for laser engravers, but since our LaserPecker LP5 kit comes with […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025

March 25, 2025March 25, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

SOMDEVICES µSMARC RZ/V2N system-on-module packs Renesas RZ/V2N MPU in a 82x30mm “micro SMARC” form factor

SOMDEVICES µSMARC RZ/V2N is a system-on-module powered by the Renesas RZ/V2N AI MPU and offered in a micro SMARC (µSMARC) form factor that’s quite smaller at 82x30mm than standard 82x50mm SMARC modules. The company told CNX Software it’s still 100% compatible with SMARC 2.1 with a 314-pin MXM 3.0 edge connector. It’s also cost-effective with a compact PCB and can be used in space-constrained applications. The µSMARC features up to 8GB LPDDR4, up to 128GB eMMC flash, two gigabit Ethernet PHY, and an optional WiFi 5 and Bluetooth 5.1 wireless module. µSMARC RZ/V2N specifications: SoC – Renesas RZ/V2N CPU Quad-core Arm Cortex-A55 @ 1.8 GHz Arm Cortex-M33 @ 200 MHz GPU – Arm Mali-G31 3D graphics engine (GE3D) with OpenGL ES 3.2 and Open CL 2.0 FP VPU – Encode & decode H.264 – Up to 1920×1080 @ 60 fps (Renesas specs, but SOMDEVICES also mentions up to 4K @ 30 […]

March 25, 2025March 25, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Linux 6.14 release – Main changes, Arm, RISC-V, and MIPS architecture

Linus Torvalds has just announced the release of Linux 6.14 on LKML: So it’s early Monday morning (well – early for me, I’m not really a morning person), and I’d love to have some good excuse for why I didn’t do the 6.14 release yesterday on my regular Sunday afternoon release schedule. I’d like to say that some important last-minute thing came up and delayed things. But no. It’s just pure incompetence. Because absolutely nothing last-minute happened yesterday, and I was just clearing up some unrelated things in order to be ready for the merge window. And in the process just entirely forgot to actually ever cut the release. D’oh. So yes, a little delayed for no good reason at all, and obviously that means that the merge window has opened. No rest for the wicked (or the incompetent). Below is the shortlog for the last week. It’s nice and […]