LLMStick – An AI and LLM USB device based on Raspberry Pi Zero W and optimized llama.cpp

LLMStick

Youtuber and tech enthusiast Binh Pham has recently built a portable plug-and-play AI and LLM device housed in a USB stick called the LLMStick and built around a Raspberry Pi Zero W. This device portrays the concept of a local plug-and-play LLM which you can use without the internet. After DeepSeek shook the world with its performance and open-source accessibility, we have seen tools like Exo that allow you to run large language models (LLMs) on a cluster of devices, like computers, smartphones, and single-board computers, effectively distributing the processing load. We have also seen Radxa release instructions to run DeepSeek R1 (Qwen2 1.5B) on a Rockchip RK3588-based SBC with 6 TOPS NPU. Pham thought of using the llama.cpp project as it’s specifically designed for devices with limited resources. However, running llama.cpp on the Raspberry Pi Zero W wasn’t straightforward and he had to face architecture incompatibility as the old […]

Kontron 3.5″-SBC-AML/ADN 3.5-inch Amston Lake/Alder Lake-N single board computer offers three DisplayPort video outputs

Kontron 3.5"-SBC-AML/ADN single board computer

Kontron 3.5″-SBC-AML/ADN is a 3.5-inch single board computer powered by either Intel Amston Lake (Industrial grade) or Alder Lake-N (commercial grade) processor and designed for applications such as automation, healthcare, smart city, and smart retail. It builds upon the smaller Kontron 2.5”-SBC-AML/ADN Pico-ITX SBC with many of the same features, but replaces eMMC flash storage with an M.2 SATA/NVMe socket and a SATA connector, features DDR5 SO-DIMM memory instead of soldered-on LPDDR5, and the larger PCB size allows it to gain an extra DisplayPort connector, a USB 2.0 Type-A port, additional serial ports, and a board-to-board (B2B) connector for expansion. It also supports a wider 9 to 36V DC range. Kontron 3.5″-SBC-AML/ADN specifications: SoC Standard Intel Atom x7211RE dual-core processor up to 3.2GHz with 6MB cache, 16EU Intel UHD graphics; TDP: 6W Intel Atom x7433RE quad-core processor up to 3.4GHz with 6MB cache, 32EU Intel UHD graphics; TDP: 9W Intel […]

ArmSoM RK3588 AIModule7 NVIDIA Jetson Nano-compatible SOM

Xcrhom T4S WiFi outdoor smart socket features power meter function, Tasmota open-source firmware

Xcrhom T4S Tasmota outdoor wifi smart socket

ESPHome is the favorite open-source firmware of Smart Home devices, but Tasmota is another option that’s been available for many years. We’ve just seen fewer products based on Tasmota (previously Sonoff-Tasmota) in recent years, but it recently showed up on a credit card-sized quad relay board, and I’ve just come across Maker Go’s Xcrhom T4S WiFi Outdoor Smart Socket that also ships with Tasmota firmware and sells on AliExpress for $24.88 shipped. The Xcrhom T4S exposes two sockets with dust and rainproof covers to be used safely outdoors, integrates a power meter, and the Tasmota firmware enables MQTT support, Home Assistant compatibility, and support for Amazon Alexa and Google Assistant. Xcrhom T4S specifications: Two EU sockets Max load – 3680W in total (16A x 230V) Rated Current – Up to 16A in total Power Input – 100 to 240V AC 50Hz Wireless – 2.4 GHz 802.11b/g/n WiFi 4; Tx power […]

Check out this 24-layer HDI PCB made with PCBWay’s high-layer, high-order interposer PCB manufacturing services (Sponsored)

24 layer HDI interposer PCB

Connections between chips have become increasingly complex, and applications with higher frequency and speed requirements may not make use of traditional PCB technology. That’s where the interposer PCB, a new type of PCB comes into play. PCBWay has the capability to manufacture high-layer, high-order PCBs, and even successfully developed a 24-layer, 6-order arbitrary interconnection HDI PCB. The interposer PCB is a highly precise, high-density interconnect (HDI) PCB that allows for a higher wiring density per unit area compared to traditional PCBs. HDI PCBs are characterized by features such as micro vias, finer lines and spaces, higher connection pad density, and the use of blind and buried vias. These features enable the miniaturization of electronic devices by allowing more functionality to be packed into a smaller space. The design characteristics of this PCB include inner layers connected to the outer layers through laser microvias and dense routing, resulting in a multi-structure […]

Bapaco is a mechanical keyboard PC with an ultra-wide 12.3-inch touchscreen display (Crowdfunding)

Bapaco mechanical keyboard PC with integrated touchscreen display

Made by Shenzhen SIDIQIAO Technology, the Bapaco is a mechanical keyboard PC powered by an Intel Core i5-1235U 10-core Alder Lake SoC and equipped with a 12.3-inch ultra-wide touchscreen display with 1920×720 resolution. The keyboard PC is offered as a barebone model without memory or storage but supports up to 32GB RAM, an M.2 2280 NVMe SSD, and/or an M.2 2242 SATA 3.0 SSD.  It also features an HDMI output to connect an extra display, WiFi 6 connectivity, a few USB ports, and a 3.5mm audio jack and stereo speakers. Bapaco specifications: SoC – Intel Core i5-1235U CPU – 10-core/12-thread hybrid Alder Lake U-Series processor with 2x Performance cores @ 1.3/4.4GHz, 8x Efficient cores @ 0.9/3.3GHz Cache – 12 MB Intel Smart Cache GPU – 80EU Iris Xe Graphics @ 1.2 GHz BPB: 15W System Memory – Up to 32GB DDR4 3200MT/s SO-DIMM single-channel memory Storage M.2 2280 NVMe PCIe […]

Vaaman reconfigurable edge computer features Rockchip RK3399 SoC and Efinix Trion T120 FPGA (Crowdfunding)

Vaaman reconfigurable edge computer

Vaaman is a reconfigurable single-board edge computer that integrates a Rockchip RK3399 hexa-core ARM processor with an Efinix Trion T120 FPGA, offering a reconfigurable platform for edge computing applications. The board combines the flexibility of an FPGA with the raw power of a hard processor to create a system capable of adapting to varying computational demands in real time. The compact SBC features the Rockchip RK3399 hexa-core processor with two Cortex-A72 cores and four Cortex-A53 cores, as well as an Efinix Trion T120 FPGA with 112,128 logic elements, interlinked with RK3399 via a high-speed 300Mbps bridge (but it’s unclear how this is implemented). It is billed as a “Raspberry Pi-style board for the FPGA world” that can be used for cryptographic acceleration, software-defined radio (SDR), digital signal processing, real-time robotics, real-time video processing, edge AI deployments, industrial automation, and hardware prototyping. It features a 40-pin Raspberry Pi-compatible GPIO header and […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025

exo software – A distributed LLM solution running on a cluster of computers, smartphones, or SBCs

Exo software distributed LLM solution

You’d typically need hardware with a large amount of memory and bandwidth and multiple GPUs, if you want to run the latest large language models (LLMs), such as DeepSeek R1 with 671 billion parameters. But such hardware is not affordable or even available to most people, and the Exo software works around that as a distributed LLM solution working on a cluster of computers with or without NVIDIA GPUs, smartphones, and/or single board computers like Raspberry Pi boards. In some ways, exo works like distcc when compiling C programs over a build farm, but targets AI workloads such as LLMs instead. Key features of Exo software: Support for LLaMA (MLX and tinygrad), Mistral, LlaVA, Qwen, and Deepseek. Dynamic Model Partitioning – The solution splits up models based on the current network topology and device resources available in order to run larger models than you would be able to on any […]

ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

OSM-MTK510

ADLINK OSM-MTK510 is an OSM Size-L compliant module powered by a MediaTek Genio 510 hexa-core Arm Cortex-A78/A55 SoC with a 3.2 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and 128GB eMMC flash. The OSM module supports HDMI 2.0, MIPI DSI, and eDP display interfaces, up to 30MP cameras, and I/O options such as gigabit Ethernet, USB 3.0, and PCIe Gen2 x1. The OSM-MTK512 is available in either commercial or industrial (-40°C to 85°C) temperature grades and the company offers at least a 10-year lifecycle for long-term use. ADLINK OSM-MTK510 specifications: SoC – MediaTek Genio 510 (MT8370) CPU – Hexa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU VPU for visual processing Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp60, AV1, VP9, HEVC, H.264 codecs supported AI […]

Boardcon CM3588 Rockchip RK3588 System-on-Module designed for AI and IoT applications