UP Squared i12 Edge is a compact, yet feature-rich, fanless Alder Lake-P mini PC

UP Squared i12 Edge

UP Squared i12 Edge is a compact fanless mini PC powered by 12th Generation Intel Alder Lake-P processors from the Celeron 7305E penta-core CPU up to an Intel Core i7-1270PE 12-core processor, but still a good range of ports and features. Based on the UP Squared i12 SBC introduced earlier this year, the UP Squared i12 edge mini PC comes with up to 16GB LPDDR5 RAM and features a 64GB or 128GB SSD soldered on board, plus an M.2 2280 NVMe socket and a SATA port for additional storage. The system also has two gigabit Ethernet ports, optional WiFi and Bluetooth, three 4K-capable display interfaces (HDMI, DisplayPort, USB-C), and three USB 3.2 Gen 2 ports. UP Squared i12 Edge specifications: 12th generation Alder Lake-P SoC: Intel Core i7-1270PE 12-core/16-thread processor @ up to 3.30GHz (E-cores) / 4.50GHz )P-cores) with 96EU Intel Xe graphics – PBP: 28W, up to 64W MTP […]

AMD Kria K24 Zynq Ultrascale+ system-on-module targets motor control and DSP applications

AMD Kria 24

The AMD Kria K24 System-on-Module (SOM) with a custom-built Zynq UltraScale+ MPSoC and the KD240 Drives Starter Kit are designed for the development of cost-sensitive industrial and commercial edge applications. The new Kria K24 is about half the size of a credit card and uses half the power of the larger, but connector-compatible, Kria K26 SOM that was introduced in 2021 for computer vision applications when the company was still known as Xilinx. That means existing K26 carrier boards can be reused with the Kria K24 SOM without modifying the PCB, but note there’s only one 240-pin connector on the new module, plus an extra 40-pin connector. AMD Kria K24 specifications: MPSoC – Custom-built Zynq Ultrascale+ XCK24 Quad-core Arm Cortex-A53 processor  up to 1.3 GHz Dual-core Arm Cortex-R5F real-time processor up to 533 MHz Mali-400 MP2 GPU up to 600 MHz FPGA fabric with 154K logic cells AMD Deep Learning […]

SemiDrive D9-Pro (D9360) Arm Cortex-A55/R5 processor powers industrial CPU module for motor control

MYD JD9360 SemiDrive D9 Pro Development Board

MYiR MYC-JD9360 is a CPU Module powered by SemiDrive D9-Pro (D9360) processor with six Arm Cortex-A55 application cores, a dual-core lock-step Cortex-R5 real-time core along with a PowerVR GPU, 4Kp30 H.265/H.264 VPU and a 0.8 TOPS NPU, and designed for motion control and industrial applications. The MYC-JD9360 CPU module also comes with 2GB LPDDR4, 16GB eMMC flash, 16MB QSPI Flash, 256Kbit EEPROM, and exposes I/Os such as PCIe 3.0, USB 3.0, CAN FD, and TSN-enabled Gigabit Ethernet through a 314-pin MXM connector. The company also provides the MYD-JD9360 development board to quickly get started with the module and evaluate the solution. MYiR MYC-JD9360 CPU module with SemiDrive D9-Pro SoC Specifications: SoC – SemiDrive D9-Pro (D9360) CPU Application – Hexa-core Arm Cortex-A55 processor @ 1.6 GHz Real-time – Dual-core lock-step Cortex-R5 cores @ 800MHz GPU – Imagination PowerVR 9XM GPU @ 100 GFLOPS VPU – 4Kp30 H.265/VP8/VP9 video decoder, 4Kp30 H.264 […]

Getting started with VOIPAC IMX8M Industrial development kit (Yocto Linux SDK)

VOIPAC IMX8M Developer Kit Audio Testing

Last month I went through an unboxing of the VOIPAC iMX8M Industrial Development Kit with some specs and a quick try with the pre-loaded Yocto 3.1 Linux image. The kit is quite versatile with plenty of interfaces and headers, and eventually, it will support Android 12 and Ubuntu 22.04 LTS. but in the meantime, I played a bit with the Yocto Linux SDK for the NXP i.MX 8M board and will report by experience getting started with VOIPAC IMX8M Industrial development kit. WiFi antennas installation But before checking out Yocto Linux, I will install the two WiFi antennas since I did not do it last time around. We can attach the SMA connectors to the two metal plates on the side of the board securing them with the provided nuts and spacers. The other side of the antenna’s cable comes with a tiny u.FL (or is it MHF4) connector and […]

Tiny solder-down NXP i.MX 93 System-on-Module powers credit card-sized evaluation board

Raspberry Pi NXP i.MX 93 SBC

Ka-Ro Electronics’ QS93 is a tiny solder-down NXP i.MX 93 System-on-Module (SoM) running Linux and designed for edge processing. The company also offers a credit card-sized evaluation board that may remind some of the Raspberry Pi with its GPIO header and general layout, but it comes with two Fast Ethernet ports and one USB 2.0 port. We’ve already covered several system-on-modules based on the NXP i.MX 93 Cortex-A55/M33 AI processor including some with high-density board-to-board connectors such as the Compulab UCM-IMX93 and Forlinx FET-MX9352-C, others with a SO-DIMM connector like the VAR-SOM-MX93, and finally some designed to be soldered on the carrier board such as the OSM-L compatible iW-RainboW-G50M, and the QS93 adds to the latter category in a tiny 27×27 mm form factor. Ka-Ro electronics QS93 specifications: SoC – NXP i.MX 93 with CPU – Up to dual-core Cortex-A55 processor @ up to 1.5 GHz Real-time core – Arm […]

Tungsten700 SMARC SoM and devkit features MediaTek Genio 700 AIoT processor

Tungsten700 SMARC carrier board

Laird Connectivity Tungsten700 SOM is a SMARC system-on-module powered by a MediaTek Genio 700 Arm Cortex-A78/A55 AIoT processor with up to 8GB LPDDR4, 16GB eMMC flash, and a Sona MT320 Wi-Fi 6/Bluetooth 5.3 module based on the Filogic 320 chipset. The board was designed by Boundary Devices, recently acquired by Laird, and is offered with a SMARC 2.1 carrier board that can be used for development or as a single board computer integrated into designs. Tungsten700 SMARC module Tungsten700 specifications: SoC – MediaTek Genio 700 (MT8390) CPU – Octa-core processor with 2x Arm Cortex-A78 cores @ up to 2.2 GHz, 6x Arm Cortex-A55 cores @ up to 2.0 GHz GPU – ARM Mali-G57 MC3 GPU VPU as in “Video Processing Unit” Encode up to 4Kp30 HEVC/H.264 Decode up to 4Kp75 HEVC/H.264/AV1/VP9 VPU as in “Vision Processing Unit” – Tensilica VP6 Vision Processing Unit ISP Single Camera: 32MP @ 30FPS Dual […]

UP 7000 is a powerful x86 alternative to the Raspberry Pi 4 SBC with an Intel Processor N50/N97/N100 CPU

UP 7000 Alder Lake N Raspberry Pi SBC

AAEON UP 7000 is an x86 single board computer with a layout similar to the Raspberry Pi 4 but based on a more powerful Intel Processor N50, N97, or N100 Alder Lake-N SoC with Gigabit Ethernet, three USB 3.2 Gen 2 ports, HDMI 1.4 video output, and a 40-pin GPIO header. Not to be confused with the larger UP Squared Pro 7000 also powered by an Alder Lake-N processor, the UP 7000 is an update to the UP 4000 SBC with an Intel Apollo Lake processor introduced just last year. The new fanless board also comes with up to 8GB LPDDR5, 64GB eMMC flash, and an onboard TPM 2.0. UP 7000 (SKU: UP-ADLN01) specifications: Alder Lake-N SoC Intel Processor N50 dual-core processor up to 3.4 GHz with 6MB cache, 16EU Intel UHD Graphics Gen 12 @ 750 MHz; TDP: 6W Intel Processor N97 quad-core processor up to 3.6 GHz with […]

Edgeble AI Neural Compute Module 2 (Neu2) follows 96Boards SoM form factor

Edgeble AI Display carrier board 96Board SoM

Edgeble AI’s Neurable Compute Module 2, or Neu2 for shorts, is a system-on-module for computer vision applications based on the Rockchip RV1126 quad-core Cortex-A7 camera processor that follows the 96Boards SoM form factor. I first found the Neu2 and Neu6 (Rockchip RK3588) in the release log for the Linux 6.3 kernel, but at the time I found there was not enough information about those. The specifications for the Neu6 are still wrong (e.g. “64-bit processor with 4x Cortex-A7 core”) at the time of writing, so I’ll check the Neu2 system-on-module and its industrial version – the Neu2K based on RK1126K – for which we have more details. Edgeble Neu2 SoM specifications: SoC – Rockchip RV1126/RV1126K with CPU – Quad-core Arm Cortex-A7 @ 1.5GHz, RISC-V MCU @ 200MHz; (14nm SMIC process) GPU – 2D graphics engine NPU – 2 TOPS with INT8/INT16 VPU 4K H.264/H.265 video encoder up to 3840 x […]

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