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March 1, 2024March 1, 2024 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

Embedded Open Source Summit 2024 schedule – Embedded Linux, Zephyr OS, and Real-time Linux

The Embedded Open Source Summit 2024 (EOSS 2024) will take place on April 16-18 and the Linux Foundation has already announced the schedule with conference sessions, lightning talks, and birds of a feather (BoF) sessions covering embedded Linux, Zephyr OS, and real-time (RT) Linux. While I won’t be attending in person, I still find it interesting to check out the schedule as we may learn more about the current status of embedded Linux. So I’ve created my own little virtual schedule out of the available talks. Tuesday, April 16 – Day 1, Embedded Open Source Summit 2024 9:05 – 9:45 – No, It’s (Still) Never Too Late to Upstream Your Legacy Linux-Based Platforms by Neil Armstrong, Linaro Nearly 7 years ago, Neil already spoke about this subject in Berlin, and it’s still very true. Do you maintain or used to maintain a Linux-based board or SoC off-tree? Then there are […]

February 20, 2024February 20, 2024 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Rockchip RK3568-powered ASUS Tinker Board 3N is now available in three variants

The ASUS Tinker board 3 was first unveiled in April 2023 before being renamed as Tinker Board 3N later that year, and the three variants of the Rockchip RK3568 single board computer (SBC) are now available. The standard configuration is the Tinker Board 3N in the commercial temperature range, while the Tinker Board 3N Plus has the same features, except it can operate in the industrial temperature range (-40°C to 85°C). The Tinker Board 3N Lite is a cost-down version in the same form factor, but with a single gigabit Ethernet port without PoE support, no M.2 B-key socket for an NVMe SSD or 4G/5G cellular connectivity, no 16MB SPI flash, fewer serial interfaces, and no CAN Bus. You’ll find a comparison of the specifications for the three variants in the table below. Note the prices above are from Amazon with a 10% discount when applicable. ASUS provides support for […]

February 16, 2024February 16, 2024 by Debashis Das - No Comments

Avnet MSC C10M-ALN – A COM Express Type 10 Mini Module with Intel Alder Lake-N CPU, LPDDR5 memory

Avnet MSC C10M-ALN is a COM Express Type 10 module powered by the Alder Lake-N family of processors including the Intel Core i3, Intel Atom x7000E, and Intel Processor N-Series. The design allows for easy adaptation of applications between various Intel CPU models, ensuring compatibility across different performance and power needs. The module supports up to 16GB LPDDR5 memory with optional In-Band Error Correcting Code(IBECC), eMMC 5.1 storage, and features an Intel i226 2.5GbE controller. It can handle up to two 4K displays through DDI and eDP video outputs, ten USB ports including USB 3.2 Gen 2, and four PCI Express Gen 3 x1 slots for expanded connectivity options. Avnet MSC C10M-ALN Com Express Module Specification: Alder Lake-N SoC (one or the other) Intel Core i3-N305, eight-core, 1.0GHz/1.8GHz, 32EU Intel UHD Graphics, 9/15W, PUC (PC Client Use Conditions) Intel Atom x7425E, four-core, 1.5GHz, 24EU Intel UHD Graphics, TCC, 12W, EUC […]

February 5, 2024February 6, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

PANZER-PLUS fanless AIoT computer to support Ubuntu 24.04, Android 14, Yocto 5.0

Taiwan-based MayQueen Technologies has recently introduced the PANZER-PLUS fanless AIoT computer powered by an NXP i.MX 8M Plus Arm SoC with support for Ubuntu 22.04, Android 12/13, and Yocto 4.0 “Kirkstone”, but the company also claims it is working on Ubuntu 24.04 and Android 14 operating systems, as well as Yocto 5.0 “Scarthgap”. The company initially pinged us in 2018 about its NXP iMX6UL-powered PANZER fanless box PC and contacted us again last week with the new PANZER-PLUS model equipped with an NXP i.MX 8M Plus AI processor, which I found only mildly interesting until the company informed me about (planned) software support. So let’s have a closer look. PANZER-PLUS specifications: SoC – NXP i.MX8M Plus CPU – Quad-core Arm Cortex-A53 processor @ 1.8GHz MCU – Arm Cortex-M7 real-time core @ 400 MHz GPU – Vivante GC520L 2D GPU, Vivante GC7000UL 3D GPU VPU – 1080p60 hardware decoder (HEVC, H.264, […]

December 18, 2023December 18, 2023 by Debashis Das - No Comments

Congatec conga-TC675r – A COM Express Type 6 module with soldered RAM, 13th Gen Intel Core CPU

Congatec has recently announced Six new COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core(Raptor Lake) processors. The module comes with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W.

We’ve noticed a surge in the popularity of COM Express modules and Congatec has recently announced six new conga-TC675r COM Express Type 6 Computer-on-Modules based on 13th Gen Intel Core (Raptor Lake) processors that happen to come with soldered RAM instead of the usual SO-DIMM memory slots found in this form factor. The modules come with up to 14(6P+8E) cores and 20-thread, ultra-fast LPDDR5x memory, all within a total TDP of 45W. According to Congatec, this device is designed to work under extreme temperatures (-40°C to +85°C), and is built to withstand the highest standards for shock and vibrations notably thanks to the user of soldered onboard RAM, making this device suitable for off-road vehicles for mining, construction, agriculture, forestry, and other demanding mobility applications. Previously we have seen manufacturers like ADLINK announce COM Express modules based on the 13th Gen architecture, and both ADLINK and Congatec have also just […]

December 15, 2023December 20, 2023 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

COM Express Type 6 Compact module features 14th gen Intel Core Ultra “Meteor Lake” processor

ADLINK cExpress-MTL is a COM Express Type 6 Compact module based on the just-announced 14th gen Intel Core Ultra “Meteor Lake” processor family with up to fourteen CPU cores in 6P+8E configuration, eight Xe-cores (128 EUs), and an NPU (11pTOPS/8.2eTOPS) in a 15 or 28W TDP thermal configuration delivering up to 1.9x the GPU performance of the previous generation (Raptor Lake). The power consumption will also be lower thanks to Intel Core Ultra’s new Low-Power E-cores that are 30 to 50% more efficient than the E-cores in 13th gen Intel Core processors, and the faster GPU and built-in NPU will enable hardware-accelerated AV1 encoding/decoding and various devices leveraging AI such as portable medical ultrasound devices, industrial automation, autonomous driving, AI robots, and more. cExpress-MTL specifications: Meteor Lake-H/U SoC (one of the other) Intel Core Ultra 7 MS3 165H 16-core (6P+8E+2LPE) processor @ 1.4 / 5.0 GHz with 24MB cache, Intel […]

December 11, 2023December 11, 2023 by Aditi Ambadkar - No Comments

TQ MBa8MP-RAS314 i.MX 8M Plus single board computer targets industrial, medical, and transportation applications

TQ has recently introduced a single board computer (SBC) called MBa8MP-RAS314. This industrial SBC is built on the TQMa8MPxL embedded module powered by the i.MX 8M Plus Arm Cortex-A53 processor developed by NXP and incorporates all the interfaces of the processor. The MBa8MP-RAS314 single board computer (SBC) finds many applications across various industries due to its features and versatility. In the medical field, it can be found in equipment for sleep monitoring, HMI eye laser systems, dialysis system control, and patient monitoring. In transportation, it can be used for in-vehicle diagnostics and acts as a gateway. Its capabilities extend to industrial automation, where it contributes to optical inspection systems, soft PLCs, programmable control, machine control, and maintenance systems. Specifications: CPU/Processor NXP i.MX 8M Plus Quad 8 ML/AI NXP i.MX 8M Plus Quad 6 Video NXP i.MX 8M Plus Quad 4 Lite Memory/Storage LPDDR4-SDRAM: Up to 8 GB Quad SPI NOR: […]

December 6, 2023December 6, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

AMD Ryzen Embedded V3000 COM Express Type 7 module supports up to 64GB DDR5 memory

ADLINK Express VR7 is a COM Express Basic size Type 7 computer-on-module powered by the eight-core AMD Ryzen Embedded V3000 processor with two 10GbE interfaces, fourteen PCIe Gen 4 lanes, and optional support for the “extreme temperature range” between -40°C and 85°C. The COM Express module supports up to 64GB dual-channel DDR5 SO-DIMM (ECC/non-ECC) memory and targets headless embedded applications such as edge networking equipment, 5G infrastructure at the edge, video storage analytics, intelligent surveillance, industrial automation and control, and rugged edge servers. Express-VR7 specifications: SoC – AMD Embedded Ryzen V3000 (one or the other Ryzen V3C48 8-core/16-thread processor @ 3.3/3.8GHz; TDP: 45W Ryzen V3C44 4-core/8-thread processor @ 3.5/3.8GHz; TDP: 45W Ryzen V3C18I 8-core/16-thread processor 1.9/3.8GHz; TDP: 15W (useful in the extreme temperature range) Ryzen V3C16 6-core/12-thread processor 2.0/3.8GHz; TDP: 15W Ryzen V3C14 4-core/8-thread processor 2.3/3.8GHz; TDP: 15W System Memory – Up to 64GB (2x 32GB) dual-channel ECC/non-ECC DDR5 memory […]