Banana Pi BPI-F2S SBC is Powered by SunPlus SP7021 Processor, Supports Xilinx Artix-7 FPGA Add-on Board

Banana Pi BPI-F2S

BPI Tech, a spinoff from SinoVoIP, has introduced a new single board computer with Banana Pi BPI-F2S powered by SunPlus SP7021 “Plus1” SoC with four Cortex-A7 cores, one older ARM9 real-time core, and one even older 8051 IO controller. The chip also embeds up to 512MB DDR3 memory. The board comes an 8GB flash, dual Fast Ethernet, HDMI, a 40-pin Raspberry Pi compatible GPIO header, as well as headers for an optional Xilinx Artix-7 FPGA expansion board. Banana Pi BPI-F2S SBC Specifications: SoC – Sunplus SP7021 “Plus1” with a quad-core Cortex-A7 processor @ 1.0 GHz, one Arm A926 microprocessor, an 8051 core to handle I/Os, and 128MB or 512MB DDR3 DRAM. Storage – 8GB eMMC flash, microSD card slot Video Output – HDMI 1.4 output Camera I/F –  MIPI CSI connector Connectivity – 2x 10/100M Ethernet USB – 2x USB 2.0 host ports, 1x micro USB port Expansion 40-pin GPIO […]

Intrinsyc Unveils Open-Q 845 µSOM and Snapdragon 845 Mini-ITX Development Kit

Open-Q 845 µSOM Development Kit

Intrinsyc introduced the first Qualcomm Snapdragon 845 hardware development platform last year with its Open-Q 845 HDK designed for OEMs and device makers. But the company has now just announced a solution for embedded systems and Internet of Things (IoT) products with Open-Q 845 micro system-on-module (µSOM) powered by the Snapdragon 845 octa-core processor, as well as a complete development kit featuring the module and a Mini-ITX baseboard. Open-Q845 µSOM Specifications: SoC – Qualcomm Snapdragon SDA845 octa-core processor with 4x Kryo 385 Gold cores @ 2.649GHz + 4x Kryo 385 Silver low-power cores @ 1.766GHz cores, Hexagon  685 DSP, Adreno 630 GPU with OpenGL ES 3.2 + AEP (Android Extension Pack),  DX next, Vulkan 2, OpenCL 2.0 full profile System Memory – 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz Storage – 32GB or 64GB UFS Flash Storage Connectivity Wi-Fi 5 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz […]

TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module

TechNexion XORE LGA System-on-Module

There are several ways to design a system-on-module to carrier board interface, and the most common solutions are edge connectors (e.g. SO-DIMM), board-to-board connectors (placed under the module), and castellated holes where the board is soldered directly to the baseboard. Another less common method is to design an LGA (Land Grid Array) module, which also have to be soldered straight unto the carrier board, but enables much more compact system-on-modules, and that’s exacty what TechNexion has done with their XORE family of LGA system-on-module currently powered by the 14-nm NXP i.MX 8M Mini processor. XORE-IMX8M-Mini Module TechNexion XORE module specifications: SoC (one of the other) NXP i.MX8M Mini Solo single Arm Cortex-A53  @ 1.8 GHz + M4 processor, Vivante GC7000Lite 3D GPU NXP i.MX8M Mini Dual 2x Arm Cortex-A53 @ 1.8 GHz + M4 processor, Vivante GC7000Lite 3D GPU NXP i.MX8M Mini Quad 4x Arm Cortex-A53 @ 1.8 GHz + M4 […]

NPi i.MX6ULL (Not So) Industrial-grade Linux SBC Starts at $39

NPi i.MX6ULL

[Update: I was initially informed the temperature range of the board was -40°C to +105°C, but Seeed Studio issues a correction explaining the Core module itself is rated -20℃ ~ 80℃ temperature range, and they haven’t tested the breakout board at all so we just don’t know. That means the board is not industrial-grade at all. I’ve left the rest of the post mostly unchanged] We’ve covered several NXP i.MX boards in recent days, but here’s another NXP board courtesy of Seeed Studio with NPi i.MX6ULL industrial-grade Linux SBC powered by a low power NXP i.MX6ULL Arm Cortex A7 processor. The board also comes with 512MB RAM, either an 8GB eMMC flash or 256MB NAND flash for storage, features two Fast Ethernet ports, and various I/Os including two 40-pin GPIO expansion headers. NPi i.MX6ULL board specifications: Core Module SoC – NXP MCIMX6Y2CVM08AB single Cortex-A7 core @ up to 800 MHz […]

MaaXBoard NXP i.MX 8M Raspberry Pi Compatible Board Runs Android 9.0 or Yocto Linux

MaaXBoard

When we looked for information about PICO-PI-IMX8M single board computer, we noticed another Raspberry Pi shaped board powered by NXP i.MX 8M processor: MaaXBoard by Embest, an AVNET company. The board comes with up to 4 GB DDR4 RAM, a MicroSD card slot or eMMC flash for storage, Gigabit Ethernet, WiFi & Bluetooth, HDMI 2.0, USB 3.0 port, MIPI CSI & DSI ports, and of course a the 40-pin “Raspberry Pi” expansion header. MaaxBoard specifications: SoC – NXP i.MX 8MQ quad-core Arm Cortex-A53 processor, Cortex-M4F real-time core, and Vivante GPU with OpenGL/ES 3.1, OpenGL 3.0, Vulkan, OpenCL 1.2 System Memory – 2GB DDR4 SDRAM (up to 4GB) Storage – MicroSD card slot or optional eMMC flash up to 64GB Video Output – HDMI 2.0 up to 4K @ 60 Hz, MIPI DSI display connector Video Playback – 4Kp60 with High Dynamic Range (H.265, VP9), 4Kp30 (H.264), 1080p60 (MPEG2, MPEG4p2, VC1, […]

Compulab CL-SOM-iMX8X SoM & SBC Feature NXP i.MX 8QuadXPlus Quad Core Cortex-A35 Processor

SBC-iMX8X-Single-Board-Computer

NXP i.MX 8X Cortex-A35 processor designed for automotive infotainment and a variety of industrial applications was officially announced in early 2017 with three parts: i.MX 8QuadXPlus with four Cortex-A35 cores, a Cortex-M4F core, a 4-shader GPU, a multi-format VPU and a HiFi 4 DSP i.MX 8DualXPlus with two Cortex-A35 cores, a Cortex-M4F core, a 4-shader GPU, a multi-format VPU and a HiFi 4 DSP i.MX 8DualX with two Cortex-A35 cores, a Cortex-M4F core, a 2-shader GPU, a multi-format VPU, and a HiFi 4 DSP In 2018, several companies unveiled i.MX 8X systems-on-module including Toradex Colibri iMX8X and Phytech phyCORE-i.MX 8X, and the processor was launched at the end of that year. There’s now another option with Compulab introducing CL-SOM-iMX8X module powered by NXP i.MX 8QuadXPlus processor, as well as SBC-IMX8X single board computer fitted with the module. CL-SOM-iMX8X System-on-Module Key features and specifications: SoC – NXP i.MX 8QuadXPlus quad-core Arm […]

Variscite VAR-SOM-6UL System-on-Module Supports NXP i.MX 6UltraLite, i.MX 6ULL, or i.MX 6ULZ ARM Cortex-A7 Processor

VAR-SOM-6UL Development Kit

Variscite has just announced the launch of the VAR-SOM-6UL System-on-Module (SoM) powered by a choice of NXP’s i.MX 6UltraLite / 6ULL / 6ULZ Arm Cortex-A7 processor clocked at up to 900MHz CPU clock and based on the company earlier DART-6UL module while integrating an additional LVDS bridge option, all packed in SO-DIMM200 form factor to fit the VAR-SOM Pin2Pin family. The module is optimized for power, size, and cost, and supports dual Ethernet, dual USB, audio, CAN Bus, camera, optional single or dual-band WiFi, Bluetooth BLE, Touch, ADC, PWM, as well as support for industrial temperature grades with -40 to 85°C range. Variscite VAR-SOM-6UL specifications & key features:  SoC – NXP i.MX 6UltraLite / 6ULL / 6ULZ ARM Cortex-A7 with optional security features up to 900MHz CPU Clock with 2D Pixel acceleration engine System Memory – Up to 1024 MB DDR3L Storage – 512 MB NAND / 64 GB eMMC […]

Embedded Linux Conference (ELC) Europe 2019 Schedule – October 28-30

Embedded Linux Conference Europe 2019 Schedule

I may have just written about Linaro Connect San Diego 2019 schedule, but there’s another interesting event that will also take place this fall: the Embedded Linux Conference Europe on  October 28 -30, 2019 in Lyon, France. The full schedule was also published by the Linux Foundation a few days ago, so I’ll create a virtual schedule to see what interesting topics will be addressed during the 3-day event. Monday, October 28 11:30 – 12:05 – Debian and Yocto Project-Based Long-Term Maintenance Approaches for Embedded Products by Kazuhiro Hayashi, Toshiba & Jan Kiszka, Siemens AG In industrial products, 10+ years maintenance is required, including security fixes, reproducible builds, and continuous system updates. Selecting appropriate base systems and tools is necessary for efficient product development. Debian has been applied to industrial products because of its stability, long-term supports, and powerful tools for packages development. The CIP Project, which provides scalable and […]

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