conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-cBLS COM-HPC Intel Barlett Lake S module

Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others. The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers. Congatec conga-HPC/cBLS specifications: Bartlett Lake-S SoC Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / […]

Luckfox Lyra boards feature Rockchip RK3506G2 triple-core SoC, display interface, optional Ethernet port

Luckfox Lyra RK3506G2 RJ45 display interface

The Luckfox Lyra boards feature a Rockchip RK3506G2 triple-core Arm Cortex-A7 SoC with one Cortex-M0 real-time core, 128MB on-chip DDR3, a MIPI DSI display interface, and built on a 22nm process. Three versions are available with the Luckfox Lyra, Lyra B (with 256MB flash), and Luckfox Lyra Plus offering similar features, but the longer Plus model also adds a 10/100Mbps Ethernet RJ45 connector besides having 256MB SPI NAND flash. These are Luckfox’s first boards featuring the RK3506G2 processor, offering Ethernet connectivity and a display interface. But it’s not quite the first Arm Linux board from the company with Ethernet and a display interface, and we covered the Luckfox Pico Ultra micro development board all based on a Rockchip RV1106G3 SoC earlier this year. The company also introduced the similar-looking LuckFox Pico Pro and Pico Max boards powered by an RV1006G2 SoC in February, but instead of a display interface, they […]

AAEON’s first Arm-based SMARC 2.1 module is NXP i.MX 8M Plus-powered uCOM-IMX8P system-on-module

AAEON uCOM-IMX8P top

AAEON has released its first Arm-based SMARC 2.1 compliant CPU module, the uCOM-IMX8P built on the NXP i.MX 8M Plus SoC and offered with up to 4GB RAM, up to 128GB eMMC flash. and support for a range of interfaces such as dual Gigabit Ethernet, USB 3.0, PCIe 3.0, and more. The 82mm x 50mm SMARC system-on-module is designed for industrial use with a -40°C to 85°C operating temperature range, Time Sensitive Networking (TSN) support, CAN Bus, MIPI interfaces, and more. That makes it suitable for applications such as predictive maintenance, process optimization, and automated control systems with cameras and displays. AAEON uCOM-IMX8P specifications: SoC – NXP i.MX 8M Plus CPU – Quad-core ARM Cortex-A53 processor @ 1.6 GHz GPU – Vivante GC380 2D GPU and GC7000UL 3D GPU VPU – 1080p60 video decoder & encoder AI accelerator – Optional 2.3 TOPS Neural Processing Unit (NPU) System Memory – Up […]

VOIPAC iMX93 industrial development kit targets AI, HMI, and Edge Computing applications

Voipac iMX93 Industrial Development Kit

VOIPAC Technologies has recently launched its iMX93 Industrial Development Kit (iMX93 module and iMX development baseboard) which comes in Max, Pro, Basic, and Lite configurations. The system-on-module (SoM) is built around the NXP i.MX93 SoC with dual-core Arm Cortex-A55 application processor running at up to 1.7GHz, a Cortex-M33 co-processor running at up to 250MHz, and an Arm Ethos-U65 microNPU with up to 0.5 TOPS of AI performance. Other features include DDR4 memory, eMMC Flash, and industrial-grade 100-pin shielded connectors for signal integrity and thermal performance. Additionally, the devkit also exposes CAN, PWM, ADC, etc.. signals and supports WiFi 6, Bluetooth 5.3, and dual GbE. These features make the VOIPAC iMX93 industrial development kit suitable for applications including AI, machine learning, human-machine interface (HMI) solutions, and more. iMX93 Industrial Development Kit specifications: System-on-Module (four options) iMX93 Industrial Module Max SoC – NXP i.MX 93 dual-core @ 1.7 GHz with real-time Cortex-M33 co-processor NPU […]

SECO launches Mediatek Genio 510 and 700 SMARC SoMs built for industrial and edge AI applications

SECO SOM SMARC Genio510 module with MediaTek Genio510

SECO SOM-SMARC-Genio500 and SOM-SMARC-Genio700 are two new SMARC system-on-modules products powered by MediaTek Genio 510 and 700 Cortex-A78/A55 series SoCs. These industrial modules are designed for high power efficiency and offer reduced energy consumption even during intensive edge AI workloads, and are suitable for retail touchscreens, intelligent industrial sensors, advanced conferencing systems, and dynamic digital signage. Both modules feature up to 8GB LPDDR4 memory, 64GB eMMC flash, two Ethernet interfaces via RGMII and USB, an optional M.2 slot for a Wi-Fi/Bluetooth module, and camera inputs. We’ve previously considered Via’s offerings with the same MediaTek Genio 700 application processor: a SMARC module, a single-board computer, and a fully embedded system. The IBase ISR500 is another option featuring the Mediatek Genio 510 or Genio 700. SECO SOM-SMARC-Genio700 & SOM-SMARC-Genio510 specifications: SoC (one or the other) SOM-SMARC-Genio700 – MediaTek Genio 700 (MT8390) CPU – Octa-core processor with 2x Cortex-A78 cores @ up to […]

reComputer R1113-10 industrial IoT gateway offers isolated RS485, RS232, DI, DO, and dual Gigabit Ethernet

reComputer R1113-10 industrial IoT gateway

Seeed Studio has launched the reComputer R1100 series industrial IoT gateway family based on Raspberry Pi CM4. The first model, the reComputer R1113-10, is powered by a Raspberry Pi Compute Module 4 module with 2GB RAM and 8GB eMMC storage. It includes two isolated RS485 ports, two isolated RS232 ports, DI and DO interfaces, and twelve LED indicators. Additional connectivity options include dual Gigabit Ethernet ports, Wi-Fi, Bluetooth 5.0, LoRa, 4G LTE, and Zigbee. The device also features two USB-A 2.0 ports, a USB-C 2.0 port for OS flashing, an HDMI 2.0 output, and a MicroSD card slot. There are many such industrial IoT gateways based on Raspberry Pi CM4 and other SoMs or SoCs on the market, and we covered a bunch including the Compulab IOT-DIN-IMX8PLUS, Digi IX40, Dusun DSGW-380, Cytron IRIV PiControl, and Robustel EG5101 and EG5200, among others, each with their own unique set of features. reComputer […]

SolidRun unveils HummingBoard i.MX8M IIOT SBC and the IIOT-200-8M Gateway for Edge AI and industrial IoT applications

HummingBoard i.MX8M IIOT

SolidRun has recently introduced HummingBoard i.MX8M IIOT SBC and IIOT-200-8M Gateway built around the NXP i.MX 8M Plus Edge AI processor. Designed for IIoT and HMI applications the SBC hosts the NXP i.MX 8M Plus SOM which gives access to various connectivity options, including dual Gigabit Ethernet, Wi-Fi/Bluetooth, CAN-FD, RS232/RS485, and audio. Additionally, it has support for industrial protocols such as Modbus and MQTT, making it suitable for factory automation and smart energy projects. Based on the HummingBoard i.MX8M IIOT SBC, the IIOT-200-8M Gateway features a DIN-rail mountable design, which sacrifices some I/O interfaces to meet the demands of harsh deployment environments. Both products support Industrial temperature ranges, fanless construction, and compact dimensions, making them reliable choices for demanding applications like industrial automation, predictive maintenance, and remote monitoring. HummingBoard i.MX8M IIOT SBC Specifications SoC – NXP i.MX 8M Plus AI SoC CPU Quad-core Arm Cortex-A53 processor @ up to 1.6 GHz […]

UP 710S – A slim, credit card-sized Intel N97 development board with M.2 E-Key WiFi socket and GPIO, I2C, SPI, and COM wafers

UP 710S Intel N97 development board

AAEON’s UP 710S is a credit card-sized Intel N97 SBC and development board with an M.2 E-Key socket for a WiFi and Bluetooth module, and similar interfaces such as gigabit Ethernet, USB 2.0, USB 3.0, and  HDMI outputs as found in Raspberry Pi boards. It’s very similar to the UP 7000 SBC with Intel N50, N97, or N100 CPU, but it’s designed to be slimmer so the 40-pin Raspberry Pi-compatible header has been replaced by 1mm pitch wafers exposing GPIO, I2C, SPI, and serial (COM) interfaces. UP 710S specifications: Alder Lake-N SoC Default – Intel Processor N97 quad-core  processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics Gen 12 @ 1.2 GHz; TDP: 12W Options – Intel N50, N100, N200 System Memory – Up to 8GB LPDDR5 Storage Up to 128GB eMMC flash 256Mbit flash for the BIOS/UEFI Video Output – HDMI 1.4b video output up to 4Kp30 […]

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