IoT solutions company Raytac has introduced the AN7002Q Wi-Fi 6 module series, which integrates Nordic Semiconductor’s nRF7002 chipset and is designed for Industrial IoT, smart home, healthcare, consumer electronics, and automotive applications. They can be paired with Raytac’s MDBT53 Bluetooth LE modules based on the nRF5340 multiprotocol SoC, supporting Wi-Fi and Bluetooth LE solutions. The AN7002Q is a low-power Wi-Fi 6 module supporting dual-band 2.4 GHz and 5 GHz operation with a maximum PHY data rate of 86 Mbps (MCS7). It is compatible with IEEE 802.11ax, a/b/g/n/ac standards, and connects to a host SoC or MCU via SPI or QSPI interfaces. The module also supports coexistence with Bluetooth LE, Thread, and Zigbee systems, making it ideal for IoT applications. Previously, we covered the Abluetech PTR7002, a low-power wireless module based on the Nordic Semiconductor nRF7002. The PTR7002 has a slightly larger size and offers more GPIO options, while the AN7002Q […]
NXP i.MX RT700 dual-core Cortex-M33 AI Crossover MCU includes eIQ Neutron NPU and DSPs
NXP has recently announced the release of NXP i.MX RT700 RT700 AI crossover MCU following the NXP i.MX RT600 series release in 2018 and the i.MX RT500 series introduction in 2021. The new i.MX RT700 Crossover MCU features two Cortex-M33 cores, a main core clocked at 325 MHz with a Tensilica HiFi 4 DSP and a secondary 250 MHz core with a low-power Tensilica HiFi 1 DSP for always-on sensing tasks. Additionally, it integrates a powerful eIQ Neutron NPU with an upgraded 7.5 MB of SRAM and a 2D GPU with a JPEG/PNG decoder. These features make this device suitable for applications including AR glasses, hearables, smartwatches, wristbands, and more. NXP i.MX RT700 specifications: Compute subsystems Main Compute Subsystem Cortex-M33 @ up to 325 MHz with Arm TrustZone, built-in Memory Protection Unit (MPU), a floating-point unit (FPU), a HiFi 4 DSP and supported by NVIC for interrupt handling and SWD […]
Toshiba TCKE9 reusable e-fuse features a fixed over-voltage clamp with adjustable overcurrent limit
Toshiba has recently introduced the Toshiba TCKE9 reusable e-fuse (electronic fuse) series, a new lineup of e-fuse ICs that can be used repeatedly, to protect power supply lines from various electrical faults like overcurrent, overvoltage, overtemperature, and short circuits. These new chips integrate various protection features into a single chip which simplifies circuit design and reduces component count compared to how a traditional protection circuit with multiple components is designed. This new line of products offers different ICs with different voltage ratings and adjustable current settings, alongside two reset modes auto-retry and latching. All these features make this e-fuse useful for applications like laptops, wearables, audio/video equipment, and industrial applications like automation systems, robotics, and many other applications. Toshiba TCKE9 reusable e-fuse Specification Input Voltage – 2.7V to 23V (Maximum – 25V) Output Current – 0 to 4.0A (Adjustable overcurrent limit – 0.5A to 4.0A via external resistor) ON Resistance […]
Abluetech PTR7002 WiFi 6 and PTR5302 WiFi 6 and BLE 5.4 modules feature Nordic Semi nRF7002/nRF5340 wireless chips
Shenzhen-based Abluetech has launched two low-power wireless modules based on Nordic Semi nRF7002 and nRF5340 wireless chips. The PTR7002 is a dual-band WiFi 6 module based on the nRF7002 chip, and the PTR5302 module combines the nRF7002 with the nRF5340 wireless microcontroller to offer dual-band WiFi 6 and Bluetooth LE 5.4 connectivity Abluetech PTR7002 dual-band WiFi 6 module with nRF7002 PTR7002 specifications: Chipset – Nordic Semi nRF7002 Wireless Dual-band Wi-Fi 6 Tx power – Up to +21dBm Rx sensitivity – -96.5dBm @ 2.4GHz / -90.5dBm @ 5GHz PHY bandwidth – Up to 86 Mbps (MCS7) 1SISO; 20MHz bandwidth Modes – Station, Wi-Fi Direct, Soft AP (Wi-Fi 4 operation only), simultaneous Station +Soft AP/Wi-Fi Direct/Station modes. 2.4GHz and 5GHz dual-band PCB antenna Range – Up to 300 meters Host interface – SPI / QSPI; AT command set Supply Voltage – 2.9 to 4.5V Power Consumption (@ 3.6V TBC) Tx peak current […]
TinyWatch S3 is an open-source, customizable smartwatch powered by ESP32-S3 SoC
The TinyWatch S3 is an ESP32-S3 development board in a smartwatch form factor from Seon Rozenblum, also known as Unexpected Maker. It is powered by the ESP32-S3 wireless microcontroller with 8MB quad SPI flash storage and 2MB of additional QSPI PSRAM. It features a 240 x 280 LCD with capacitive touch (via a CST816T module) and several onboard sensors including a 6-axis inertial measurement unit, a magnetometer, and a MEMS microphone. It has a USB-C port for power, programming, and charging a connected LiPo battery (250mAh or 500mAh). While the product’s firmware is still in active development, it is usable as a watch and even a daily driver. The TinyWatch S3 is described as a “wrist-wearable ESP32-S3 development board” but lacks pin headers and is not breadboard compatible. The hardware is open-source but the product is mostly useful for firmware development, testing, and other general projects. The firmware is being […]
LILYGO T-Glass – An ESP32-powered smart glasses with 1.1-inch prism display, IMU, microphone, and more
LILYGO T-Glass is an ESP32-S3-powered smart glasses development platform with a smart Bosch IMU, an integrated microphone, a touch button, and a 1.1-inch full-color prism display with 126 x 126 resolution. The features and specifications make this device similar to a Google Glass 2 or Google Glass Enterprise Edition v2 but with a developer-friendly codebase and much room for tinkering. In our previous post, we also wrote about Pivothead SMART glasses and Qualcomm Snapdragon XR1 AR smart viewer feel free to check those out if you are looking for similar but more powerful products than this one. LILYGO T-Glass specifications: Wireless SoC – Espressif Systems ESP32-S3FN4R2 CPU – Dual-core Tensilica LX7 @ up to 240 MHz with vector instructions for AI acceleration Memory – 512KB RAM, 2MB PSRAM Storage – 4MB flash Wireless – 2.4 GHz WiFi 4 and Bluetooth Display – 1.1-inch full color LTPS AMOLED JD9613 display (294 x 126 pixels) […]
Infineon CY8CKIT-062S2-AI PSoC 6 Edge AI evaluation kit features multiple sensors, Arduino headers, Pmod connectors
Infineon CY8CKIT-062S2-AI evaluation kit is a hardware platform built around the PSoC 6 family of MCUs and designed to help developers easily create and test edge AI applications. The dev board features an array of sensors including radar, microphone, magnetometer, IMU, and an air pressure sensor, which make it easy for data collection applications. The board also features Wi-Fi and Bluetooth connectivity and includes an additional expansion header that can be used to connect other modules and sensors. All of these features make this board useful for building a wide range of AI-powered applications, including smart home automation, industrial monitoring, wearables, healthcare devices, and robotics. Previously we have written about similar low-power edge AI modules such as the Digi ConnectCore MP25, the Axiomtek AIE110-XNX, and the Arducam KingKong feel free to check those out if you are interested in such low-power modules. Infineon CY8CKIT-062S2-AI Evaluation Kit specifications: MCU – Infineon […]
Quectel SG368Z WiFi 5 and Bluetooth 4.2 smart module is built around Rockchip RK3568 SoC
The Quectel SG368Z Smart Module is an all-in-one hardware package built around a Rockchip RK3568 AI SoC that combines computing, graphics, storage, and connectivity in a compact form factor. The LGA module offers WiFi 5 and Bluetooth 4.2 connectivity, dual gigabit Ethernet networking, various video output options (HDMI, LVDS, RGB, MIPI, eDP), USB, PCIe, and many other features making it suitable for applications like smart homes, wearables, and industrial automation. Previously we have seen Quectel introduce various communication modules like the Quectel BG95-S5 5G, the Quectel KG200Z LoRa the Quectel RG255G RedCap IoT Module, and the Quectel CC660D-LS IoT-NTN module, but this is the first time we have seen Quectel release a Smart Module which can be certainly be considered as a SoM in a LGA package. Quectel SG368Z Smart Module specifications: SoC – Rockchip RK3568 CPU – Quad-core Cortex A55 processor at up to 2.0 GHz GPU – Mali G52 […]