wearables News - Page 16 of 27 - CNX Software

October 31, 2017February 21, 2018 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

SAMA5D2 Based SiPs Combine ARM Cortex-A5 Processor With Up to 128MB DDR2

Atmel SAMA5D2 ARM Cortex-A5 processor was released about two years ago with extended temperature range and lower power consumption compared to previous SAMAD5 processors, with the new SoC still targeting industrial Internet of Things (IIoT), wearables and point of sale applications. In recent years, we’ve seen companies packing main components into systems-in-package (SiP) with products such as Octavo Systems OSD3358 and Espressif Systems ESP32-PICO-D4 with integrate an existing processor with memory, storage, and/or PMIC. Microchip (previously Atmel) has now done the same for their SAMA5D2 processors with SiPs combining the Cortex A5 SoC with DDR2 memory. Four SAMA5D2 SiPs have been launched: ATSAMA5D225C-D1M based on ATSAMA5D22C MPU with extra SD/SDIO, QSPI, FLEXCOMs (2x), I2S, and timers (2x) and: 128 Mb (16 MB) DDR2 DRAM 90 Peripheral I/Os 196 BGA Package Designed for RTOS/bare metal development ATSAMA5D27C-D5M based on ATSAMA5D27C MPU with: 512 Mb (64 MB) DDR2 DRAM 128 Peripheral I/Os […]

September 5, 2017 by Jean-Luc Aufranc (CNXSoft) - No Comments

Connect Watch Runs AsteroidOS Open Source Operating System (Crowdfunding)

At the beginning of last year, we discovered AsteroidOS (hobby) project aiming to provide a Linux based open source operating system working on some Android Wear smartwatches. At the time the OS relied on Android drivers working with libhybris, Qt5/QML for apps, and only supported LG G Watch. Since then, Florent Revest has continued development, with more watches being supported from Samsung, Asus, and other brands, and a French startup has decided to design and bring to market Connect Watch running AsteroidOS. Connect Watch specifications: SoC- Mediatek quad core processeur @ up to 1.39GHz MTK System Memory – 512MB or 1GB RAM Storage – 4 or 8GB flash Display – 1.39″ round Amoled display with 400×400 resolution Audio – Built-in speaker Connectivity Bluetooth Optional GSM ( 850/900/1800/1900MHz) and 3G WCDMA (850/2100MHz) support with nano SIM card slot GPS Camera – 2.0 MP; records to 720p Sensors – Heart rate monitor […]

August 22, 2017August 27, 2017 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

ESP32-PICO-D4 System-in-Package Combines ESP32, 4MB SPI Flash, a Crystal Oscillator, and Passive Components

Espressif Systems has revealed another ESP32 variant, but this time it’s not an SoC, but a 7x7mm system-in-package (SIP) that comes ESP32 dual core processor, a 4MB SPI flash, a crystal oscillator and various passive components, so that you don’t need to include those in your design, and create an ultra-compact PCB for wearables and other space-constrained applications. ESP32-PICO-D4 SiP specifications: SoC – ESP32 with two Tensilica LX6 cores, 448 KB ROM, 520 KB SRAM (inc. 8KB RTC memory), 1kbit eFuse On-module Flash – 4MB SPI flash Connectivity WiFi – 802.11 b/g/n/e/i (802.11n up to 150 Mbps) Bluetooth – Bluetooth V4.2 BR/EDR and BLE specification; ; class-1, class-2 and class-3 transmitter; Audio: CVSD and SBC SIP Interfaces SD card, UART, SPI, SDIO, LED PWM, Motor PWM, I2S, I2C, IR GPIO, capacitive touch sensor, ADC, DAC, LNA pre-amplifier Sensors – On-chip Hall sensor & temperature sensor Clock – On-module 40 MHz crystal […]

July 19, 2017July 19, 2017 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

$99 Mira Prism Augmented Reality Headset Works with your Phone

We’ve seen many virtual reality headsets launched in the last year or so, even through the technology and ecosystem still needs to be improved to offer an acceptable user experience, but so far I have not seen augmented reality headset that combines 3D real and virtual worlds into a single screen. I was pretty enthusiastic about augmented reality technology when I first heard about in 2010, but fast forward to 2017, I’m not using any such apps myself, with the most popular AR app possibly being Pokemon Go game launched last year, and apps like the upcoming AR Measure look quite useful. Augmented reality normally works by holding your phone into your hands and the camera, but Mira Prism will change that it’s meant to be worn like a virtual reality headset and relies on a phone (iPhone only for now) to mix both worlds right in front of your […]

June 28, 2017 by Jean-Luc Aufranc (CNXSoft) - No Comments

Qualcomm Snapdragon Wear 1200 Platform for Wearables Supports LTE Cat M1 and NB1 (NB-IoT)

After Snapdragon Wear 2100 and 1100 launched last year , Qualcomm has announced a new Snapdragon Wear 1200 platform still designed for wearables, but with lower power consumption, less processing power, a more compact package, and built-in support for LTE IoT communications standards such as LTE Cat M1 and LTE NB-IoT (Cat NB1). Qualcomm Snapdragon Wear 1200 key features and specifications: CPU – ARM Cortex A7 @ 1.3 GHz Memory / Storage – Support for discreet or MCP NAND and LPDDR2 Display – Support via SPI for simple UI and displays Modem Global multi-mode supporting Cat-M1 / NB1 / E-GPRS. Supports LTE FDD and TDD for Cat-M1 and E-GRPS and FDD only for Cat-NB1 Up to 300 kbps downlink and 350 kbps uplink for Cat-M1 10 kbps download and 60 kbps upload speeds for Cat-NB1 Integrated voice support for VoLTE Other Connectivity – Pre-integrated support for Qualcomm 11ac Wi-Fi […]

June 9, 2017 by Jean-Luc Aufranc (CNXSoft) - No Comments

Samsung S-Patch3 Wearable Health Tracker Based on Samsung Bio-Processor Hits the FCC

At the end of 2015, Samsung unveiled their S3FBP5A Bio-Processor comprised of an ARM Cortex-M4 MCU, a DSP, and sensors for PPG, ECG (electrocardiography), Skin temperature, BIA, and GSR to have a single package to design tracker able to monitor your health condition. The company demonstrated an early prototype called S-Patch at CES 2016 (See embedded video at the end of this post), and now S-Patch3 wearable health monitoring system has just hit the FCC. The system has two round shapes case connected via a cable, with one for the battery compartment, and the other containing the Bio Processors, and meant to be placed on your chest. The device can then synchronize the data with your smartphone in real-time over Bluetooth. People with heart conditions may benefit from the system, as if they wish to do so, they could share the data with their doctor. Few documents are publicly available […]

May 8, 2017 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Think Silicon Ultra Low Power NEMA GPUs are Designed for Wearables and IoT Applications

When you have to purchase a wearable device, let’s say a smartwatch or fitness tracker, you have to make trade offs between user interface and battery life. For example, a fitness tracker such as Xiaomi Mi Band 2 will last about 2 weeks per charge with a limited display, while Android smartwatches with a much better interface need to be recharged every 1 or 2 days. Think Silicon aims to improve battery life of the devices with nicer user interfaces thanks to their ultra-low power NEMA 2D, 3D, and GP GPU that can be integrated into SoCs with ARM Cortex-M and Cortex-A cores. The company has three family of GPUs: NEMA|p pico 2D GPU with one core 4bpp framebuffer, 6bpp texture with/out alpha Fill Rate – 1pixel/cycle Silicon Area – 0.07 mm2 with 28nm process Power Consumption – leakage power GPU consumption of 0.06mW; with compression (TSFSc): 0.03 mW NEMA|t […]

April 27, 2017 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Intrinsyc Introduces Open-Q 2100 SoM and Devkit Powered by Qualcomm Snapdragon Wear 2100 SoC for Wearables

Qualcomm unveiled Snapdragon Wear 2100 SoC for wearables early last year, and since then a few smartwatches powered by the processor – such as LG Watch Style and Watch Sport – have been launched, and Intrinsyc has now unveiled one of the first module based on the processor with Open-Q 2100 system-on-module, and a corresponding Nano-ITX baseboard. Open-Q 2100 SoM specifications: SoC – Qualcomm Snapdragon Wear 2100 (APQ8009W) quad core ARM Cortex A7 processor @ up to 1.094 GHz with Adreno 304 GPU System Memory – 512 MB LPDDR3 Storage – 4GB eMMC flash Connectivity – 802.11 b/g/n WiFi (WCN2320), Bluetooth 4.1 LE, Gen 8C GNSS (GPS/GLONASS) with on-board u.FL connector (WGR7640) Audio – Integrated Codec/PMIC (PM8916-1) with optional support for Fluence HD, Snapdragon Voice Activation, and Snapdragon Voice+ 2x 100-pin board-to-board connectors with USB 2.0, I2S, GPIO, MIPI DSI up to 720p @ 60 Hz, 2-lane MIPI CSI, SDC2/microSD […]