With the Star64 and VisionFive 2 single board computers, we’ve already got two hardware platforms based on the StarFive JH7110 quad-core RISC-V processor, but somehow we did not get the detailed specifications of the new processor, and some details such as the presence of AI accelerators or exact PCIe specifications were lacking. Some documentation for the StarFive JH7110 processor has been released and answers some of those questions. It’s actually an SoC with six RISC-V cores, of which four 64-bit RISC-V cores run the main OS, plus a 64-bit RISC-V monitoring core, and a 32-bit RISC-V real-time core. The AI accelerators found in the JH7100 (Neural Network Engine and NVDLA) appear to be gone for good, and there are two 1-lane PCIe 2.0 interfaces up to 5 Gbps each. StarFive JH7110 specifications: CPU sub-system Quad-core 64-bit RISC-V SiFive U74 (RV64GC) processor @ up to 1.5 GHz with 32KB D-Cache, 32KB […]
Acromag XMC-7A50-AP323 – An XMC module based on AMD Xilinx Artix-7 FPGA
Acromag XMC-7A50-AP323 is an XMC (Switched Mezzanine Card) module based on a Xilinx Artix-7 FPGA with 48 TTL I/O channels plus a 16-bit ADC for 20 differential or 40 single-ended analog inputs. Designed for commercial off-the-shelf (COSTS) applications, Acromag XMC modules are RoHS compliant, and suitable for automation applications, scientific development labs, as well as aerospace and military applications. Acromag XMC-7A50-AP323 module specifications: FPGA – AMD Xilinx Artix-7 (XC7A050) FPGA with 52,160 logic cells, 65,200 Flip flops, 2,700 kb block RAM, 120 DSP slices Storage – 32Mbit QSPI flash memory FPGA Digital I/O 48x I/O channels controlled in groups of eight channels, 5V tolerant TTL, RS485, and LVDS interface options: Build Option A: 24x EIA-485/422 channels Build Option B: 24x TTL and 12x EIA-485/422 channels Build Option C: 24x LVDS channels Analog Input 20 differential or 40 single-ended inputs Flexible scan control 16-bit A/D resolution 8μs conversion time FIFO buffer […]
VESA compatible mini PC is powered by Vortex86DX3 x86 processor
ICOP EB-3362-I fanless mini PC powered by DM&P Vortex86DX3 x86 processor coupled with 2GB DDR3 of memory and designed to be mounted on the back of a VESA compatible display or monitor, a wall, or even a DIN rail through an adapter. The mini PC will be mostly useful for legacy x86 applications with features like VGA video output, multiple DB9 COM ports, as well as SATA storage. The wide 8V to 24V input voltage and -20 to 70C temperature range will also make it suitable for some industrial applications. ICOP EB-3362-I specfications: SoC – DM&P Vortex86DX3 dual-core x86 processor @ 1GHz System Memory – 2GB DDR3 Storage – SATA interface, SD card socket Display Output – VGA up to 1920 x 1080 @ 60 Hz Networking 10/100M Ethernet RJ45 port Optional additional Gigabit Ethernet RJ45 port Optional WiFi via USB 2.0 port, and external antenna USB – 3x USB […]
INNOTECH AX-1020 Atom x6000E Elkhart Lake SBC targets fanless equipment
Japan-based INNOTECH has announced the AX-1020 SBC based on Intel Atom x6000E Elkhart Lake processor designed for fanless industrial equipment, medical equipment, surveillance/security, and transportation applications. The board supports up to 16GB of RAM, SATA & NVMe storage, and is equipped with three display interfaces, two Gigabit Ethernet ports, six USB3.0/2.0 interfaces, one RS-485/422, and four RS-232C serial interfaces. INNOTECH AX-1020 specifications: Choice of Atom x6000E Elkhart Lake SoC Intel Atom x6425E quad-core processor @ 2.00 GHz / 3.0 GHz with 32 EU UHD graphics; 12W TDP Intel Atom x6413E quad-core processor @ 1.50 GHz / 3.0 GHz with 16 EU UHD graphics; 9W TDP Intel Atom x6211E dual-core processor @ 1.30 GHz / 3.0 GHz with 16 EU UHD graphics; 6W TDP System Memory – 4GB to 16GB DDR4 SO-DIMM (The company tells customers to contact them first when using 8GB or 16GB RAM) Storage – 1x SATA port, […]
Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules
Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)
congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]
COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor
We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]
Intel unveils Alder Lake desktop and mobile IoT processors
Intel introduced high-end Alder Lake Hybrid processor family for consumer devices a couple of months ago, with Pentium G7400 and Celeron G6900 leaking a few weeks later, and now the company has formally announced the Alder Lake-S and Alder Lake-H processor families for respectively desktop IoT and mobile IoT solutions, as well as more efficient U-series and P-series of 12th Gen Intel Core Alder Lake IoT processors with a TDP ranging from 15W to 28W. Alder Lake S-Series desktop processors for IoT Key features and specifications: CPU Up to 16 cores, up to 24 threads in IoT SKUs Up to 30 MB Intel Smart Cache TDP – 35W to 65W Real-time capability on select SKUs Graphics/Video Intel UHD Graphics 770 driven by Intel Xe architecture with up to 32 EUs Up to four independent displays up to 4K or one display at 8K resolution Up to two video decode boxes […]