At the end of last month, there was a lot of buzz about Bouffalo BL602, one of the first RISC-V SoC with built-in wireless connectivity, namely WiFi 4 and Bluetooth 5.0 LE. We should expect more and more of those types of solutions, and Telink & Andes jointly introduced TLSR9-series of wireless audio chips for hearables, wearables, and other high-performance IoT applications. The chips are powered by an Andes D25F RISC-V 5-stage core that happens to be the first core to integrate RISC-V DSP/SIMD P-extension and offer Bluetooth 5.2, Zigbee 3.0, HomeKit, 6LoWPAN, Thread, and/or 2.4 GHz proprietary protocol. The press release focuses on the Andes core, but an article in Chinese allows use to find more about Telink TLSR9 family’s key features: CPU – Andes D25F 32-bit RISC-V 5-stage core @ up to 96 MHz (2.59 DMIPS/MHz and 3.54 CoreMark/MHz) with RISC-V DSP/SIMD P-extension Optional NNU – AI engine […]
Telink TLSR9 Wireless Audio & IoT RISC-V SoC integrates RISC-V DSP/SIMD P-extension
