STMicro STM32WBA6 2.4 GHz wireless MCU gets up to 2MB flash, 512KB SRAM, USB OTG, and more

STM32WBA6 block diagram

STMicro had two announcements yesterday. I’ve already covered the launch of the ultra-low-power STM32U3 microcontroller family, so today, I’ll check the new 100 MHz STM32WBA6 Cortex-M33 wireless MCU family with 2.4GHz radios for Bluetooth LE 6.0, Zigbee, Thread, and Matter designed for wearables, smart home devices, remote weather sensors, and more. The STM32WBA6 is an evolution of the STM32WBA family introduced last year, especially of the STM32WBA54 and STM32WBA55 with many of the same features SESIP (Security Evaluation Standard for IoT Platforms) Level 3 security certification, but gets more memory and flash with up to 512KB of SRAM and up to 2MB of flash. The new  STM32WBA6 family also gains a High-Speed USB OTG interface and extra digital interfaces such as three SPI ports, four I2C ports, three USARTs, and one LPUART. STMicro STM32WBA6 key features and specifications: MCU core – Arm Cortex-M33 at 100MHz with FPU and DSP Memory […]

ESP32-C6-based Wi-Fi relay board features six 10A relays, supports Home Assistant, 3D printed enclosure

ESP32 C6 Wi Fi relay board

Seeed Studio’s XIAO 6-Channel Wi-Fi 5V DC Relay is a compact ESP32-C6 Wi-Fi relay board built around the XIAO ESP32C6 module which supports Wi-Fi 6, BLE 5.0, Zigbee, and Thread connectivity. Designed for remote control and automation, the device comes with pre-installed ESPHome firmware and features six independent relay channels, each supporting 10A at 30V DC or 250V AC, making it ideal for simultaneously controlling multiple DC or AC devices. The board also has two grove ports for sensors and actuators, making it suitable for home automation, industrial control, energy management, smart agriculture, and other applications. XIAO 6-Channel Wi-Fi 5V DC Relay Board Specifications Main module – XIAO ESP32C6 SoC – ESP32-C6  CPU Single-core 32-bit RISC-V clocked up to 160 MHz Low-power RISC-V core @ up to 20 MHz Memory – 512KB SRAM, 16KB low power SRAM Storage – 320KB ROM, and 4MB flash Wireless – 2.4 GHz WiFi 6, Bluetooth […]

Ceva-Waves Links200 IP supports Bluetooth LE High Data Throughput (HDT) up to 7.5 Mbps, 802.15.4 for Zigbee, Thread and Matter

Ceva-Waves Links200 IP Bluetooth LE HDT

Ceva has recently unveiled the Ceva-Waves Links200 multi-protocol platform IP with support for Bluetooth LE High Data Throughput (HDT) technology up to 7.5 Mbps and IEEE 802.15.4 for Zigbee, Thread, and Matter designed for TSMC’s low-power 12nm process. Released in 2016, Bluetooth 5 upgraded Low Energy implementation with four times the range and twice the speed of Bluetooth 4.0 LE transmission which meant up to 2 Mbps over BLE, and even the latest Bluetooth 6.0 specification does not change that. There’s just a new LE 2M 2BT physical layer for Bluetooth Channel Sounding. So I was intrigued when the press release of the Links200 further read: Addressing the rising market demand for faster, more efficient Bluetooth connectivity, particularly for low-power audio and latency-sensitive IoT applications, the breakthrough High Data Throughput mode more than doubles the speed of traditional Bluetooth, delivering a data rate of up to 7.5 Mbps. For this […]

CrowPanel Advance: ESP32-S3 displays with replaceable WiFi 6, Thread, Zigbee, LoRa, and 2.4GHz wireless modules

CrowPanel Advance: ESP32-S3 display with replaceable wireless modules

Elecrow’s CrowPanel Advance is a family of 2.8-inch to 7-inch ESP32-S3 WiFi and BLE displays that supports replaceable modules for Thread/Zigbee/Matter, WiFi 6, 2.4GHz, and LoRa (Meshtastic) connectivity. Those are updates of the CrowPanel (Basic) displays introduced last year. They feature an ESP32-S3-WROOM-1-N16R8 module soldered on the back plus headers taking ESP32-H2, ESP32-C6, SX1262 LoRa transceiver, or nRF2401 2.4GHz wireless MCU. CrowPanel Advance 7-inch specifications: Wireless Module – ESP32-S3-WROOM-1-N16R8 SoC – ESP32-S3 CPU – Dual-core LX7 processor with up to 240MHz Memory – 512KB SRAM, 8MP PSRAM Storage – 384KH ROM Wireless – WiFi 4 and Bluetooth 5.0 with BLE Storage – 16MB flash PCB antenna Storage – MicroSD card slot Display 7.0-inch IPS capacitive touchscreen display with 800×480 resolution (SC7277 driver) Viewing Angle: 178° Brightness: 400 cd/m²(Typ.) Color Depth – 16-bit Active Area – 156 x 87mm Audio Built-in microphone Speaker connector Wireless Expansion ESP32-H2 module with 802.15.4 radio […]

Murata Type 2FR is the world’s smallest tri-radio IoT module with Wi-Fi 6, Bluetooth 5.4, and Thread connectivity

2FR2FP tri radio IoT module

Murata has recently launched the world’s smallest tri-radio IoT modules, the Type 2FR/2FP series, as well as the Type 2KL/2LL series for hosted solutions. These compact modules feature tri-radio communication, including Wi-Fi 6, Bluetooth 5.4, and Thread, with Matter provisioning for interoperability. The 2FR/2FP series is considered the world’s smallest module (12.0 x 11.0 x 1.5mm) of this type with a built-in MCU, making it ideal for low-cost and highly integrated solutions. It prioritizes security with the latest cybersecurity standards and compatibility with the Matter ecosystem. On the other hand, the 2KL/2LL series is designed to work with high-performance processors running Linux or RTOS. These modules provide reliable tri-radio communication with advanced capabilities. Both series are designed for applications, including smart homes, buildings, industrial automation, healthcare, and more, with features like low-power operation, extended battery life, and reduced component count. Murata Type 2FR/2FP modules specifications: MCU – NXP RW610 or RW612 […]

Synaptics SYN20708 low-power IoT SoC features Bluetooth, Zigbee, Thread, Matter, and advanced coexistence

SYN20708 Dual Core Bluetooth & IEEE 802.15.4 SoC

Synaptics has recently introduced the SYN20708 low-power IoT SoC designed to handle simultaneous Bluetooth 5.4 Classic/Low Energy and IEEE 802.15.4 radios with Zigbee, Thread, and Matter protocols. The SoC integrates power and low-noise amplifiers and two separate radios enable simultaneous multiprotocol operations. The SoC is based on a 160 MHz Arm Cortex-M4 processor with user-accessible OTP memory for configuration. Built using a 16-nm FinFET process, it has very low power consumption, and advanced features like high-accuracy distance measurement (HADM), angle-of-arrival (AoA), and angle-of-departure (AoD). These features with versatile antenna support make this SoC suitable for industrial, consumer, and IoT applications. Synaptics SYN20708 specifications CPU – Arm Cortex-M4 processor @ 160 MHz Memory/Storage 544 KB System RAM 1664 KB Code RAM 1640 KB ROM 256 bytes OTP Connectivity Dual-radio Bluetooth 5.4 Bluetooth Classic, Bluetooth Low Energy Supports Bluetooth 6.0 features like HADM (high accuracy distance measurement) Bluetooth Class 1 and Class […]

STMicro ST67W611M1 IoT module features Qualcomm QCC743 SoC with Wi-Fi 6, BLE, and 802.15.4 radios

STMicro ST67W611M1 Wi Fi 6, Bluetooth, Matter module

ST Microelectronics has introduced the ST67W611M1 IoT module developed in partnership with Qualcomm and integrating the latter’s QCC743 multi-protocol connectivity chip with Wi-Fi 6, Bluetooth 5.3 Low Energy (BLE), Thread-compatible IEEE 802.15.4 connectivity, and support for Matter-over-Wi-Fi. Additionally, it features 4MB of flash storage and provides options for a PCB or external antenna via a uFL connector. The module is designed to connect with STMicro’s STM32 microcontroller and microprocessor families through SPI and/or UART, making it easy to add wireless connectivity to STM32-based projects, including those using the new STM32N6 chips with an in-house Neural-ART machine learning accelerator. These features make this chip suitable for smart home devices, industrial IoT systems, wearables, healthcare monitors, and connected appliances. ST67W611M1 specifications: Wireless Connectivity Wi-Fi 6 with up to 20 dBm output power Bluetooth Low Energy 5.3 with 2 Mbps throughput Thread support Supports Matter protocol over Wi-Fi for future-proof connectivity Storage – […]

u-blox MAYA-W4 tri-radio IoT module features NXP IW610 chipset with Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios

MAYA-W4 Wi Fi 6 Module

Last year, we covered the u-blox MAYA-W3 module, which was based on the Infineon AIROC CYW5551x chipset and utilized separate chipsets for 2.4 GHz, 5 GHz, and 6 GHz frequencies. Now, u-blox has introduced the MAYA-W4 series, a host-based Wi-Fi 6, Bluetooth 5.4, and 802.15.4 module built on the NXP IW610 chipset. Designed for industrial and commercial applications such as building automation, energy management, smart homes, and healthcare, the MAYA-W4 series supports SISO Wi-Fi 6 with a 20 MHz channel width, ensuring reliable performance in dense network environments. These modules can function as access points, stations, P2P devices, or in mixed modes. The MAYA-W4 modules are compatible with the Matter protocol over Thread and Wi-Fi, facilitating seamless integration across ecosystems. With a compact size of 10.4 x 14.3 mm, these modules rank among the smallest Wi-Fi 6 SMD modules and are available with integrated antennas or U.FL connectors. Rigorous testing […]

Youyeetoo X1 x86 SBC