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January 5, 2015January 5, 2015 by Jean-Luc Aufranc (CNXSoft) - No Comments

LinkIt A-Core Packs Mediatek MT2502A SoC into a Tiny Module for Wearables

LinkIt ONE is a development board based on Meditak MT2502A SoC for wearables, and developed by SeeedStudio. With GPS, Wi-Fi, and GSM/GPRS connectivity, and a LiPo battery, it’s great to experiment IoT or wearable applications, but if you plan to launch an actual product, it could be nice to have a module, and built a baseboard around it. That’s exactly what SeeedStudio is working with LinkIt A-Core module. LinkIT A-Core module specifications: SoC – Mediatek MT2502AV ARM7 SoC @ 260 MHz with 32MB PSRAM and 32MB Flash on-chip. External Storage – 16M external Flash (MX25U12835F) Cellular Connectivity – GSM/GPRS quad-band 850/900/1800/1900MHz with RF7198 RF transmitter. Connectivity – Bluetooth 2.0 / 2.0 EDR / 4.0, GPS compatible GPS/GNSS (requires external GPS module) Expansion – 48 general purpose digital I/O Power supply: DC 3V~4.2V Power Consumption – > 3mA Dimensions – 19x23x2 mm The module is still in development, and the company welcomes […]

December 4, 2014May 1, 2016 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

e-con Systems Unveils eSOMiMX6 SoM based on μQ7 Form Factor, and Ankaa Development Kit

QSeven is one of the many standards for system-on-modules, and it defines both Qseven (Q7) 70x70mm modules, and smaller μQSeven (μQ7) 70x40mm modules. While there are quite a few SoMs following the larger form factor, few modules are based on micro Q7, and e-con Systems eSOMiMX6 has just launched one of these tiny modules with eSOMiMX6 system-on-module powered by Freescale i.MX6 processors, as well the corresponding Ankaa development kit comprised of the SoM and a baseboard. eSOMiMX6 module specifications: SoC – Freescale i.MX6 single, dual or quad Cortex A9 processor @ 800MHz to 1.2 GHz with Vivante GPUs System Memory – 256MB/512MB (Solo only), 1GB (default), or 2GB (dual/quad only) LVDDR3 RAM Storage – 4GB (default) to 64GB eMMC flash, 2MB SPI NOR flash, and SD/MMC + SATA II interfaces via MXM connector Display / Video Output: HDMI up to 1920 x 1080 Dual channel 24-bit LVDS 24-bit LCD RGB MIPI […]

November 28, 2014 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Intrinsyc Introduces Snapdragon 810 Powered Mobile and Tablet MDPs, DragonBoard Development Kit

Intrinsyc has recently announced availability for three development platforms based on Qualcomm Snapdragon 810 ARM Cortex A53/A57 processor, namely a smartphone Mobile Development Platform (MDP), a tablet MDP, and a DragonBoard development kit integration Open-Q 8094 system-on-module, making these one of the first ARM64 development platforms available to individual developers, or at least small software development companies (approved by Qualcomm). All three platforms will run Android 5.0 Lollipop. Intrinsyc Snapdragon 810 MDP Smartphone Intrinsyc MDP/S specifications: SoC – Qualcomm Snapdragon 810 (8994) 64-bit octa-core processor with 4x Cortex A57 cores, 4x Cortex A53 cores, Adreno 430 GPU, and Hexagon V56 DSP System Memory – 3 GB LP-DDR4 Storage – 32 GB eMMC 5.0 micro SD slot (under battery door) Display – 6.17” QHD (2560×1600) 490ppi, 10-finger multi-touch capacitive touchscreen Video Output – micro HDMI type D Audio Headset jack with ANC support 8 microphones (2 analog/ 6 digital) with support […]

November 14, 2014 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Avionic Design to Introduce Embedded Nvidia Tegra K1 Processor Module

Avionic Design, a German company specializing in the development and production of electronic components for the embedded, avionics, and healthcare market, has been working on an Nvidia Tegra K1 system-on-module (SoM) , using the quad core version of the processor, with 2GB RAM, and 16GB eMMC, putting most features found in Jetson TK1 development board into a 70×50 mm module. Nvidia Tegra K1 CPU module specifications: SoC – Nvidia Tegra K1 quad core Cortex A15 processor up to 2.2 GHz with Nvidia Kepler GPU with 192 cores up to 450 MHz System Memory – 2 GB DDR3 (1833 MHz) Storage – 16GB eMMC + SATA & SD/MMC via SoM connectors Interfaces: Video In – 2x 4-lane CSI Video Out – HDMI 1.4b, eDP, two 4-lane DSI Audio – 2x I2S, S/PDIF In and Out High Speed I/O PCIe 2.0 1x, PCIe 2.0 4x 2x USB 3.0, 2x USB 2.0 host, […]

November 14, 2014November 14, 2014 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Variscite VAR-SOM-SOLO is a Tiny System-on-Module Based on Freescale i.MX6 Solo Processor

Freescale will soon announce i.MX6 SoloX dual core processor with ARM Cortex A9 and M4 cores, and dual-port gigabit Ethernet, but companies still design and manufacture new Freescale i.MX6 Solo/Dual/Quad based hardware for their mostly industrial customers. Variscite has recently launched a smaller version of their VAR-SOM-MX6 system-on-module called VAR-SOM-SOLO powerd by Freescale i.MX6 Solo processor with up to 1GB RAM, up to 512MB NAND flash for boot code, up to 64GB eMMC flash for storage, and TI WiLink8 module with Wi-Fi and Bluetooth Smart. Variscite VAR-SOM-SOLO technical specifications: SoC – Freescale i.MX6 single core ARM Cortex-A9 core @ 1.0GHz with Vivante GC 880 + Vivante GC 320 GPU, and VPU supporting 1080p30 H.264 encode and decode. System Memory – 256MB to 1GB DDR3 RAM Storage – 128MB to 512MB NAND flash for boot code, 4GB to 64GB eMMC flash, and SD/MMC via edge connector Video Output / Display Interfaces: […]

November 5, 2014November 5, 2014 by Jean-Luc Aufranc (CNXSoft) - No Comments

TI Sitara based GOEMBED Systems-on-Module and Single Board Computers with BeagleBone Capes Support

GOEMBED is a startup funded by engineers previously working for Embest Shenzhen, based in Longhua district in Shenzhen, and specialized in embedded boards and modules. They currently have board and modules based on Freescale i.MX6 and Texas Instruments Sitara processors, but I’ll focus on the TI products in this post, including one of their single board computers that supports BeagleBone capes. CM3352 and CM3358 Systems-on-Module CM335x Series modules specifications: SoC – Texas Instruments Sitara Cortex A8 AM3352 @ 800 Mhz or AM3358 @ 1.0 GHz System Memory – 512 MB Micron DDR3 chip Storage – 2 to 4 GB eMMC depending on model PMU – TI TPS65910A3 Dimensions – 67.5 x 36.5 mm Temperature Range – Commercial: 0° to 70° C or Industrial: -40° to 85° C The modules are said to support Linux 3.x, Android 4.x, Ubuntu, Angstrom, Debian, WinCE 6.0/7.0, and uCOS operating systems. SBC335x Single Board Computers […]

November 5, 2014March 25, 2015 by Jean-Luc Aufranc (CNXSoft) - 9 Comments

Radxa Rock 2 Development Board Pictures and Specifications

Radxa Rock 2 is an upcoming development board based on Rockchip RK3288 quad core Cortex A12/A17 processor, which will run Android, and I would expect it to have better support for Linux desktop distributions than the original Radxa Rock board thanks to the current work done by Rockchip and Google on Chromium OS, which could bring 2D/3D graphics, and hardware video decoding to the platform. The board is not available for purchase yet, but pictures have been published, and specifications released. So the new board is comprised of a baseboard and a system-on-module (SoM), which should help Radxa’s customers design their own products, while using Radxa SoM, and doing early development on Radxa Rock 2 board. Radxa SoM specifications: SoC – Rockchip RK3288 quad core ARM Cortex-A17 processor@1.8Ghz with ARM Mali-T764 GPU with support for OpenGL ES1.1/2.0/3.0, OpenCL 1.1, DirectX 11 System memory – 2GB (4GB optional), 64bit DDR3@800Mhz Storage […]

October 7, 2014June 18, 2018 by Jean-Luc Aufranc (CNXSoft) - No Comments

F&S Elektronik Systeme Introduces eFus A9 Industrial Computer Modules Powered by Freescale i.MX6 SoC

F&S Elektronik Systeme, a German embedded systems company, has announced their efus A9 Computers-on-Module (CoM) based on Freescale i.MX6, are now in mass production. The CPU comes in two variants A9V2 for i.MX6 Solo, and A9V3 with i.MX6 DualLite, both of which are certified for automotive and industrial applications, and support commercial, extended, and industrial temperature ranges. eFuse A9 computer-on-module specifications: SoC – CPU Freescale i.MX6 Solo (eFus A9V2) or DualLite (eFus A9V3) @ up to 1.2 GHz + Vivante 2D and 3D GPUs System Memory – 512MB (Up to 1GB RAM) Storage – 256 MB NAND flash (Up to 1GB), 2 GB eMMC (eFus A9V3 only. up to 32GB), optional SPI NOR, optional I2C EEPROM Display I/F – 18-bit RGB, 2x 24-bit LVDS, and DVI Other interfaces available via 230 pins MXM-2 edge connector: 2x SD card I/F 1x Gigabit Ethernet 1x USB Host, 1x USB Device 2x CAN […]