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February 21, 2017February 21, 2017 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Trenz Electronic TE0808 UltraSOM+ is a Xilinx Zynq Ultrascale+ ZU9EG System-on-Module

Xilinx Zynq Ultrascale+ ARM Cortex A53 + FPGA SoC have now started to show up in boards such as AXIOM Board based on Zynq Ultrascale+ ZU9EG. Price for the board has not been announced, and while a similar Xilinx development kit goes for close to $3,000, some people are expecting the board to sell for $400 to $600. Since the price of FPGA vary a lot from a few dollars to $40,000 for the top end chips, I decided to find pricing info about Xilinx Zynq Ultrascale+ MPSoCs which lead me to Trenz Electronic TE0808 system-on-module, which was unveiled in May last year, and I’ll cover in the second part of this post, after – hopefully quickly – describing Zynq Ultrascale+ family and nomenclature, and addressing the price “issue”. First, there are three sub-families within Zynq Ultrascale+ MPSoC portfolio: CG models with 2x Cortex A53, 2x Cortex R5, FPGA fabric […]

February 17, 2017February 17, 2017 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

9Tripod X3399 SoM and Development Board are Powered by Rockchip RK3399 Hexa Core Processor

9Tripod (九鼎创展) has just launched X3399 system-on-module powered by Rockchip RK3399 hexa-core Cortex A72/A53 processor, and as well as a corresponding development board for people wanted to get started quickly before designing their own baseboard. X3399 core board preliminary specifications: SoC – Rockchip RK3399 hexa-core big.LITTLE processor with two ARM Cortex A72 cores up to 2.0 GHz, four Cortex A53 cores, and a ARM Mali-T860 MP4 GPU with OpenGL 1.1 to 3.1 support, OpenVG1.1, OpenCL and DX 11 support System Memory – 2GB LPDDR3 (2x Samsung K4E8E304EE-EGCF) Storage – 8GB eMMC 5.0 flash (Samsung KLM8G1GEND-B031) IOs – 204-pin to be soldered on baseboard PMIC – Rockchip RK808-D Dimensions – 55×55 mm 9Tripod does have a forum in English, but the company provides most of the information in Chinese. I could not find details about Linux or Android images and source code, except a few mentions of Linux Qt, Ubuntu, and […]

February 16, 2017 by Jean-Luc Aufranc (CNXSoft) - No Comments

MYD-C437x-PRU Development Board Leverages TI Sitara AM437x Programmable Real-time Unit

MYIR Technologies launched MYC-C437x system-on-module based on TI Sitara AM437X processor, and the corresponding MYD-C437x development board at the end of 2015, but the latter did not make use of the processor’s PRU-ICSS (Programmable Real-Time Unit Subsystem and Industrial Communication SubSystem) block. The company has now released a new version of the baseboard called MYC-C437x-PRU which exposes I/Os pins to leverage the PRU-ICSS and enable implementation of protocols like EtherCAT and Profibus.MYD-C437x-PRU industrial development board specifications: System-on-Module – MYC-C437x module with SoC – Texas Instruments AM437x ARM Cortex A9 processor @ up to 1GHz with PowerVR SGX530 GPU (AM4378/AM4379 only) System Memory – 256 or 512MB (default) DDR3 SDRAM Storage – 4GB eMMC Flash (reserved 256/512MB Nand Flash design), 16MB QSPI Flash (unpopulated by default), 32KB EEPROM Connectivity – Gigabit Ethernet PHY Storage – 1x micro SD slot Serial ports – 1x 3-wire RS232 debug serial port, 2x 5-wire RS232 serial […]

February 9, 2017March 23, 2018 by Jean-Luc Aufranc (CNXSoft) - No Comments

Samsung Introduces Artik 530 IoT Module & Development Kit with WiFi, BLE, and Zigbee/Thread

Samsung unveiled Artik 1, Artik 5, and Artik 10 IoT modules & development board families in 2015, but since then they dropped the Artik 1 family, and instead launched Artik 0, Artik 5, and Artik 7 modules and boards late last year. More recently the company canceled the more powerful Artik 1020 development board, but the Artik project is still going on, as they’ve just added Artik 530 module & development kit to their Artik 5 family. Samsung ARTIK 530 module specifications: SoC – Unnamed Quad core ARM Cortex A9 processor @ 1.2 GHz with a 3D graphics accelerator System Memory – 512 MB DDR3 Storage – 4GB eMMC v4.5 flash Connectivity – Dual band SISO 802.11 a/b/g/n WiFi, Bluetooth 4.2 LE + Classic, 802.15.4/Zigbee/Thread, 10/100/1000M MAC (external PHY required) Other Interfaces and peripherals Camera – 4-lane MIPI CSI up to 5MP (1920×1080 @ 30fps) Display – 4-lane MIPI DSI […]

February 2, 2017April 25, 2018 by Jean-Luc Aufranc (CNXSoft) - No Comments

F&S Elektronik Introduces efus A53LS NXP QorIQ LS1012A System-on-Module for Communication & Networking Applications

NXP QorIQ LS1012A is a single core Cortex A53 communication processor that offers a 64-bit update to LS1021A dual core Cortex A7 processors found in gateways such as NXP LS1021A-IOTA IoT gateway reference design, and F&S Elektronik System has just launched efus A53LS system-on-module powered by the processor with up to 1GB RAM, up to 64SQPI NOR, access to the communication interfaces and peripherals from the processor via an efus compliant edge connector, and long term availability until 2030. efus A53LS COM specifications: Processor – NXP QorIQ Layerscape LS1012A single core ARM Cortex-A53 @ up to 800MHz System Memory – 512MB DDR3 by default, supports up to 1GB DDR3 RAM Storage – Up to 64MB QSPI NOR flash on-module, I/Os for SATA and SD card on edge connector Connectivity – 2x Realtek RTL8211F(N) Gigabit Ethernet transceiver chips, optional wireless module with dual WiFi IEEE802.11b/g/n/ac and Bluetooth 4.0 LE efus edge […]

January 17, 2017August 5, 2019 by Jean-Luc Aufranc (CNXSoft) - 29 Comments

PINE64 Introduces SOPINE A64 Allwinner A64 SoM and SOPINE “Model A” Baseboard

Following yesterday’s Raspberry Pi Compute Module 3 launch, we have a new development board turned into system-on-module (SoM) today with PINE64 launching SOPINE A64 SO-DIMM module based on Allwinner A64 processor with 2GB RAM together with SOPINE “Model A” baseboard. SOPINE A64 CPU module specifications: SoC – Allwinner A64 quad core Cortex A53 processor @ 1.2 GHz with Mali-400MP2 GPU System Memory – 2GB LPDDR3 Storage – 128 Mbit SPI flash, micro SD slot (on the back) I/Os via 204-pin SO-DIMM edge connector Video Output / Display – HDMI + CEC, MIPI DSI Audio – I2S, HP, headphone, microphone 2x USB 1x Gigabit Ethernet (RGMII) UART, I2C, PWM, GPIOs, etc… Power Supply – AXP803 PMIC Dimensions – 67.9 x 31.0 mm (DDR3 SO-DIMM form factor) SOPINE A64 will basically run the same firmware as used for PINE A64+ development board, except for some modifications for LPDDR3 RAM support. Support operating […]

January 16, 2017January 17, 2017 by Jean-Luc Aufranc (CNXSoft) - 14 Comments

Raspberry Pi 3 Compute Modules CM3 and CM3L Launched for $30 and $25

We all knew Raspberry Pi Compute Module 3 were about to be launched soon, as the Raspberry Pi foundation announced a partnership with NEC displays last October, and the datasheet for two version of the Broadcom BCM2837 based system-on-module, CM3 and CM3L (Light), was released shortly after. The good news is that the modules have officially been launched for $30 and $25 for respectively Compute Module 3 with 4GB flash, and Compute Module 3 Light with the SD card signals exposed via the SO-DIMM connector. The foundation has also lowered the original compute module price to $25. Here are Compute Module 3 specifications as a reminder: SoC – Broadcom BCM2837 quad core Cortex A53 processor @ 1.2 GHz with Videocore IV GPU System Memory – 1GB LPDDR2 Storage CM3L – SD card signals through SO-DIMM connector CM3 – 4GB eMMC flash 200-pin edge connector with: 48x GPIO 2x I2C, 2x SPI, […]

January 3, 2017 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Tiny Intrinsyc Open-Q 820 SoM Features Snapdragon 820 Processor, WiFi and Bluetooth

Intrinsyc has unveiled a new smaller version of their Snapdragon 820 based Open-Q 820 system-on-module, simply called Open-Q 820 µSOM bringing the module size from 82 x 42mm to 50 x 25mm, while keeping many of the features of the large SoM with 3GB LPDDR4, 32GB UFS 2.0 flash, 802.11ac WiFi, and Bluetooth 4.1. It competes with other small Snapdragon 820 modules such as Inforce 6601 micro SoM. Open-Q 820 µSOM specifications: SoC – Qualcomm Snapdragon 820 quad core Kryo cores with 2x cores @ up to 2.2GHz, and 2x cores @ up to 1.6GHz, Adreno 530 GPU, Hexagon 680 DSP System Memory – 3 GB LPDDR4 @ 1866 MHz Storage – 32 GB UFS 2.0 1-lane gear3 flash Connectivity – 802.11 b/g/n/ac 2×2 MU-MIMO, Bluetooth 4.1, Qualcomm IZat Gen 8C GPS 3x board-to-board connectors with the following interfaces: Display 2x MIPI-DSI 4-lane, 60fps, up to 2560×1600 (single port), 4096×2160 (dual port) […]