The Forlinx FET3562J-C is a Rockchip RK3562/RK3562J powered System-on-Module (SoM) built with a 22nm process and features four high-performance ARM Cortex-A53 cores running at up to 2GHz. It also can support up to 2GB LPDDR4 RAM and can be configured with up to 16GB eMMC storage. Additionally, it has 1 TOPS NPU and standard peripherals like Ethernet, Wifi, Bluetooth, LVDS, MIPI DSI, and much more. All these features make this SoM useful for IoT, automation, and consumer electronic applications. Previously, we have seen Forlinx launch similar SoM with development boards such as the Forlinx RZ/G2L, the FET-MX9352-C, the OK335xS-II and much more feel free to check those out if you are interested in the topic. Forlinx FET3562J-C SoM and carrier board specifications SoM Specifications SoC (one or the other) Rockchip RK3562J – ARM Cortex-A53 quad-core @ 1.8GHz Rockchip RK3562 ARM Cortex-A53 quad-core @ 2.0 GHz NPU – 1 TOPS INT8 […]
Sipeed Tang Mega 138K Dock is a lower-cost GOWIN GW5AST FPGA + RISC-V development board
The Sipeed Tang Mega 138K Dock is a low-cost version of the Tang Mega 138K Pro development board launched last year with the GOWIN GW5AST FPGA + RISC-V SoC, two SPF+ cages, a PCIe 3.0 x4 interface, and DVI Rx and Tx ports. The new Tang Mega 138K Dock keeps a GW5AST FPGA SoC but with a 484-ball package that fits on a smaller system-on-module, and does without the SPF+ cages, replaces the PCIe 3.0 x4 interface with a PCIe 2.0 x4 interface, and only uses a single HDMI port for DVI Rx or Tx. Sipeed Tang Mega 138K system-on-module Let’s first have a look at the specifications of the SoM itself: SoC FPGA – GOWIN GW5AST-LV138FPG484A with 138,240 LUT4 1,080 Kb Shadow SRAM (SSRAM) 6,120 Kb Block SRAM (BSRAM) Number of BSRAM – 340 298x DSP slices 12x PLLs 16x global clocks 24x HCLK 8x transceivers at 270Mbps to […]
AAEON uCOM-ADN SMARC SoM features Intel Processor N97, Core i3-N305, or Atom x7425E CPU
AAEON uCOM-ADN is a SMARC-compliant system-on-module (SoM) based on an Intel Core i3-N305, Intel Atom x7425E, or Intel Processor N97 Alder Lake-N SoC and mainly designed for the digital signage and smart kiosk markets. The module is equipped with up to 8GB LPDDR5, up to 64GB eMMC flash, two 2.5GbE controllers, and offers a range of interfaces through a standard 314-pin MXM 3.0 connector such as SATA III, three PCIe Gen3 x1, DP++ and eDP video outputs, MIPI CSI camera input, and more. uCOM-ADN SMARC module specifications: Alder Lake N-series SoC (one or the other) Intel Atom x7425E quad-core processor up to 3.4 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.00 GHz; TDP: 12W Intel Processor N97 quad-core processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.20 GHz; TDP: 12W Intel Core i3-N305 octa-core processor up to 3.8 GHz with 6MB cache, 32EU […]
LattePanda Mu review – Part 1: an Intel N100 Compute Module tested with Windows 11, carrier boards with PCIe slots
Last April, DFRobot launched the LattePanda Mu x86 Compute Module powered by an Intel N100 Alder-Lake processor with 8GB RAM and a 64GB eMMC flash along with Lite and Full function carrier boards for evaluation. End customers will typically design their own carrier board without having to take of high-speed signals for the LPDDR5 memory and other complexities during the PCB layout. DFRobot has sent us the LattePanda Mu module for review along with the Lite and Full Function carrier boards, a heatsink for passive cooling, and an active cooler so we can compare both cooling solutions. Let’s have a look at the LattePanda Mu module and accessories before testing the kit with the Windows 11 operating system, including the PCIe x4 slot. LattePanda Mu kit unboxing The parcel included three retail boxes. The smallest box housed the LattePanda Mu Compute Module, a heatsink, and an active cooler. The second […]
NiCE5340 SoM packs Nordic nRF5340 MCU, Lattice iCE40 FPGA, and 11 sensors into a tiny 29x16mm form factor
Stefano Viola’s NiCE5340 SoM is built around a Nordic Semi nRF5340 Bluetooth SoC, an iCE40 FPGA, 11 sensors, a battery charger, and various other peripherals in a 29×16 mm form factor. The nRF5340 used in the SoM is a low-power, dual-core Arm Cortex-M33 SoC with Bluetooth 5.4, Bluetooth LE (BLE), Thread, Zigbee, and other proprietary protocols. Meanwhile, the Lattice iCE40 FPGA features 3520 logic cells, 80 Kbits of embedded Block RAM, I2C, and SPI blocks, and many other features that make it suitable for applications like environmental monitoring, health tracking, and others. Previously, we have written about Unexpected Maker NANOS3, TinyS3, FeatherS3, and ProS3 boards, and ESP32-S3 4G dev board which all fall under the tiny and compact board category but this is the first time we have seen an MCU board with so many features built into a module of that size. Stefano Viola’s NiCE5340 SoM Specification ICs Nordic […]
MYiR Tech launches AMD XC7A100T Artix-7 FPGA system-on-module and development board with PCIe, SFP+ cages, dual GbE
MYIR MYC-J7A100T is a System-On-Module (SoM) powered by an AMD/Xilinx Artix-7 XC7A100T FPGA with up to 101,440 logic cells, 512MB DDR3 memory, 32MB QSPI FLASH, 32KB EEPROM, DC-DC power management, and other integral circuits in a compact 69.6 x 40mm form factor. The module exposes up to 178 FPGA I/Os, four pairs of GTP high-speed transceiver interfaces, and a JTAG interface through its 260-pin edge connector. MYiR also provides a development board for the MYC-J7A100T module which looks like a PCIe 2.0 card and comes with SFP+ cages, HDMI input and output ports, dual GbE, and a GPIO expansion header. MYIR MYC-J7A100T system-on-module Specifications: FPGA – AMD/Xilinx XC7A100T Artix-7 FPGA (XC7A100T-2FGG484I) with 101,440 logic cells 4,860 Kb of Block RAM 240 DSP slices 8 GTP transceivers capable of reaching speeds up to 6.6Gb/s PCIe Gen2 x4 interface Up to 300x single-ended I/Os System Memory – 512MB DDR3 Storage – 32MB […]
High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)
Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]
Ochin V2 tiny Raspberry Pi CM4 robotics carrier board gets micro HDMI port, Fast Ethernet support
Ochin V2 is an update to the tiny Ochin Raspberry Pi CM4 carrier board for robotics applications and drones that adds a micro HDMI port, support for Fast Ethernet through pads or a GHS connector (no RJ45 connector), two user LEDs, and a few other changes. The form factor remains the same at just 55 x 40 x 4.7mm, or about the size of a Raspberry Pi Compute Module 4, which in combination with a range of USB, UART, I2C, and SPI interfaces, makes it an ideal candidate for space-constrained applications such as robotics system or UAVs. Ochin V2 specifications (differences against Ochin v1 shown in bold or strikethrough): Supported modules – Raspberry Pi CM4 with Broadcom BCM2711 quad-core Cortex-A72 processor, up to 8GB RAM, up to 32GB eMMC flash (the CM4 Lite is not supported since there’s no microSD card on the board), 4Kp60 H.265 decode, 1080p30 H.264 encode, […]