Intrinsyc announced their own NXP i.MX 8M system-on-module, as well as a corresponding development kit back in February 2018 for Embedded World 2018. Somehow I missed it until today when the company tweeted about the kit unboxing video, so let’s have a look, starting with the module itself.Open-X 8M SoM specifications: SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ up to 1.5 GHz, Arm Cortex-M4 core with 256 KB tightly coupled memory (TCM), Vivante GC7000Lite GPU System Memory – 3GB LPDDR4 RAM Storage – 16GB eMMC Flash Video – 4Kp60 HEVC/H.265 main, and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30 AVC/H.264 decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder On-module Connectivity – WiFi 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1 pre-certified module 3x 100 pin board to board connectors exposing: Display Interfaces HDMI 2.0a up to 4096 x 2160 at 60 Hz 4-lane MIPI […]
SudoProc is a Tiny LGA System-on-Module Based on Rockchip RK3288 SoC
Most systems-on-module are designed to be inserted into a baseboard thanks to an edge connectors or one or more board-to-board connectors, although I’ve also seen some with castellated pins allowing them to be soldered to the carrier board. The guys at Sudo Systems LLC have taken a different approach as they went with a custom designed 210-pin LGA (Land grid array) module instead, which is based on Rockchip RK3288 processor, and extremely compact at 65 x 40 x 4.3 mm. SudoProc module specifications: SoC – Rockchip RK3288 quad core Cortex-A17 processor @ up to 1.8 GHz with Arm Mali-T764 GPU System Memory – 4GB LPDDR3 (Samsung) @ 1066MHz; 2 x 32 bit, dual channel Video Decoding – H.264 decoder @ 2160p@24fps, H.265 decoder @2160p@30fps, and H.264/MVC/VP8 encoder 1080p@30fps Storage – 32GB, 64GB, 128GB, 256GB or 512GB eMMC 4.5 flash LGA package with 210 pins exposing: Storage I/F – 8-bit NAND […]
Firefly AIO-3399J All-in-One Industrial Board is Powered by Rockchip RK3399 Processor, Supports M.2 SSDs, 4G LTE Modems, and More
Firefly-RK3399 was the very first Rockchip RK3399 development board when it launched in late 2016, and it mostly stayed that way until others joined in late 2017, early 2018 with products like Orange Pi RK3399, ODROID-N1, Rock960, or Pine64 RockPro64 among others. Firefly team has now unveiled another higher end “all-in-board industrial board” with their Firefly AIO-3399J board featuring their RK3399 CoreBoard module, and a baseboard exposing plenty of I/O and connector, including support for M.2 drives, and 4G LTE mini PCIe cards. Firefly AIO-3399J specifications: SoM – RK3399 CoreBoard: SoC – Rockchip RK3399 hexa-core big.LITTLE processor with dual core ARM Cortex A72 up to 2.0 GHz and quad core Cortex A53 processor, ARM Mali-T860 MP4 GPU with OpenGL 1.1 to 3.1 support, OpenVG1.1, OpenCL and DX 11 support System Memory – 2GB or 4GB DDR3-1333 Storage – 16GB eMMC 5.1 flash (other capacities also available on demand up to […]
Qualcomm Snapdragon 820E based Geniatech Developer Board 8 Runs Debian, Follows 96Boards CE Extended Form Factor
Qualcomm Snapdragon 820E processor was recently launched a version of Snapdragon 820 without LTE modem, easier to source, and targeting the embedded market. The long expected DragonBoard 820c is the first board to feature the new processor, but Geniatech has also been working on their own Developer Board 8 that follows 96Boards CE Extended form factor, and is very similar to DragonBoard 820c. Developer Board 8 (DB8) specifications: SoC – Qualcomm Snapdragon 820E quad core Kryo processor up to 2.35 GHz with Adreno 530 GPU System Memory – 3 GB LPDDR4-1866 (PoP) Storage – 32 GB UFS Flash + micro SD 3.0 (UHS-I) slot Video Output – HDMI 2.0 up to 4K @ 60 Hz Audio – Via HDMI, 3.5mm audio jack Connectivity – Gigabit Ethernet, 802.11 b/g/n/ac WiFi, Bluetooth 4.2, GPS (TBC) USB – 2x USB 3.0 ports, 1x micro USB 2.0 device port Camera – Support for up […]
BalenaFin is an Industrial Carrier Board for Raspberry Pi CM3L Module Designed for Fleets of Connected Devices
[Update January 2019: Resin.io Project Fin has been renamed to BalenaFin, I have not changed the rest of the article] Resin.io is a both a company and a software platform that includes device, server, and client software to get code securely deployed to a fleet of devices. Devices are setup to run ResinOS, and to deploy you app, you just need to push the code to resin.io build servers, where it will be packaged into containers and delivered to your fleet of boards. So far, resin.io relied on existing hardware platforms like Raspberry Pi 3, BeagleBone Black, or Intel NUCs, but they’ve now decided to launch their first hardware with Project Fin that takes a Raspberry Pi Compute Module 3 Lite, is hardened for field deployment use cases, and adds some of most commonly requested hardware features such as variable supply voltage support, RTC, and cellular connectivity (via mPCIe card). […]
PHYTEC Introduces phyCORE SoMs & Devkits Based on NXP i.MX8, i.MX 8M, or i.MX 8X Processors
PHYTEC, an embedded systems company headquartered in Germany with global offices, has updated their phyCORE systems-on-module family with 3 sub-families of modules based on NXP i.MX 8, i.MX 8X, or i.MX 8M dual or quad core processors for a total of 9 modules. phyCORE-i.MX 8 Specifications: SoC – NXP i.MX 8Quad, i.MX 8QuadPlus or i.MX 8QuadMax Arm Cortex-A72/A53/M4F processor @ up to 1.6 GHz with Tensilica HiFi 4 DSP @ 666 MHz, 2x Vivante GC7000XSVX GPUs System Memory – 1 to 8GB LPDDR4 RAM Storage – 64MB to 256MB Octal SPI/DualSPI SPI NOR Flash, 4 GB to 128 GB eMMC flash, 4kB EEPROM Connectivity – 2x Gigabit Ethernet PHY 4x 120-pin Board-to-board connectors with: Display – 2x LVDS, 2x MIPI DSI, 1x HDMI Video Input / Camera – 1x HDMI, 2x MIPI CSI Audio – 2x ESAI, up to 4x SAI Networking – 2x 10/100/1000 Mbit/s Ethernet USB – 1x […]
iWave Systems iW-RainboW-G27M SMARC 2.0 SoM Features NXP i.MX8 QuadMax Processor
We’ve previously seen SECO will soon launch SM-C12 SMARC 2.0 SoM powered by NXP i.MX 8M processor, but there’s not the only company working on a SMARC 2.0 compliant system-on-module powered by the latest NXP 64-bit Arm processor, as iWave Systems iW-RainboW-G27M module should be coming up soon with a more powerful NXP i.MX 8QuadMax Arm Cortex A72/A53/M4 processor coupled with 4GB LPDDR4 RAM by default. The i.MX8QuadMax SMARC System-on-Module targets “complex embedded application of consumer, medical and industrial embedded computing applications”. iWave Systems iW-RainboW-G27M specifications: SoC – NXP i.MX8 QuadMax processor with 2x Cortex-A72 @ 1.8 GHz, 4x Cortex-A53 @ 1.2 GHz,2 x Cortex-M4F @ 266 MHz, 2x Vivante GC7000XSVX GPUs, and a 4K H.265 decode & 1080p h.264 enc/dec capable VPU System Memory – 4GB LPDDR4 (Expandable) On-module Storage – 16GB eMMC Flash (Expandable), micro SD slot, optional 256MB QSPI Flash On-module Connectivity – 2x Gigabit Ethernet PHY, […]
Emcraft Introduces NXP i.MX 8M SoM and $299 Starter Kit
I first discovered Emcraft Systems in 2011 through their work porting uCLinux to Arm Cortex M3/M4 microcontrollers, and since then the company has kept on working microcontroller software and hardware, but also moved to Arm Cortex A class solutions. Like most embedded systems companies, Emcraft engineers have also designed their own NXP i.MX 8M system-on-module, but while many have still not announced pricing, and/or show “in development” or “early product announcement” in their product page, Emcraft has started taking pre-order for their i.MX 8M SoM Starter Kit for $299, with shipping scheduled for May 21, 2018 or before. Let’s check out SOM-IMX8M specifications first: SoC – NXP i.MX8M Quad processor with 4x Cortex A53 cores, 1x Cortex-M4F core, and a Vivante GC7000Lite GPU System Memory – 512MB to 4GB DDR3L/LPDDR4 SDRAM Storage – 4 to 64GB eMMC flash Connectivity – Wireless module supporting 802.11 a/b/g/n/ac 2×2 MIMO WiFi, Bluetooth 4.2, […]