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May 21, 2024May 21, 2024 by Debashis Das - 1 Comment

Avnet AI Vision Development Kit features Qualcomm QCS6490 SoC, dual camera, GbE, and USB-C PD

Just last month at Embedded World 2024, Qualcomm announced its RB3 Gen 2 Platform based on the QCS6490 processor with Cortex-A78 and A55 processing cores and 12 TOPS of AI power. Building on this, Avnet has recently launched the Avnet AI Vision Development Kit, also based on the QCS6490 SoC. The kit includes a dual camera setup, Gigabit Ethernet connectivity, USB-C Power Delivery, and a host of other features for applications like inventory and asset monitoring, drone/UAV/other mobile vision-AI edge compute applications, and multi-camera security systems with recognition. Previously we have written about similar AI dev kits including Allwinner V853 100ASK-V853-Pro, Sipeed Maix-III devkit, RZBoard V2L, and many other AI vision development boards feel free to check those out if you are interested in the topic. Avnet AI Vision Development Kit specifications SM2S-QCS6490 SMARC Compute Module: CPU – 4x Arm Cortex-A78 (up to 2.7 GHz), 4x Arm Cortex-A55 (up to […]

May 21, 2024May 20, 2024 by Debashis Das - 3 Comments

NetBurner SOMRT1061 – A stamp-sized dual Ethernet SoM powered by NXP’s i.MX RT1061 crossover processor

i.MX RT1061 Embedded System on Module SOMRT1061

The NetBurner SOMRT1061 is a System-on-Module (SoM) that comes in a very compact stamp-sized footprint that measures just 25.4mm x 25.4mm, yet boasts a rugged design and 67 usable GPIO pins with edge connectors. These features make this SoM ideal for a wide range of medical, industrial, and robotics applications. The SoM is built around the NXP’s i.MX RT1061 Arm Cortex M7 SoC, and features 1MB of internal SRAM, 32MB of external RAM, and 8MB of flash storage. It also features dual 10/100M Ethernet with PTP, an on-die temperature sensor, three FlexIO modules, two USB OTG 2.0 controllers, I2C, SPI, ADC, SD Card, CAN, UART, and many more. NetBurner SOMRT1061 System-on-Module (SOM) Specifications SoC – NXP i.MX RT1061 Arm Cortex-M7 @ 528MHz. Memory 1MB SRAM on the processor 32MB of external RAM Storage Flash – 1MB boot, 8MB application SDHC – Flash card interface Ethernet Up to two 10/100 Ethernet […]

May 15, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 95 SMARC 2.1 system-on-modules – ADLINK LEC-IMX95 and iWave iW-RainboW-G61M

Several companies have unveiled SMARC 2.1 compliant system-on-modules powered by the NXP i.MX 95 AI SoC, and today we’ll look at the ADLINK LEC-IMX95 and iWave Systems iW-RainboW-G61M and related development/evaluation kits. The NXP i.MX 95 SoC was first unveiled at CES 2023 with up to six Cortex-A55 application cores, a Cortex-M33 real-time core, and a low-power Cortex-M7 core, as well as an eIQ Neutron NPU for machine learning applications. Since then a few companies have unveiled evaluation kits and system-on-modules such as the Toradex Titan evaluation kit or the Variscite DART-MX95 SoM, but none of those were compliant with a SoM standard, but at least two SMARC 2.1 system-on-modules equipped with the NXP i.MX 95 processor have been introduced. ADLINK LEC-IMX95 Specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 2.0 GHz with 32K I-cache and D-cache, 64KB L2 cache, and 512KB […]

May 13, 2024May 12, 2024 by Tomisin Olujinmi - 3 Comments

New NXP i.MX 93-based system-on-modules launched by MYiR, Variscite, and Compulab

We have covered announcements about early NXP i.MX 93-based system-on-modules such as the ADLINK OSM-IMX93 and Ka-Ro Electronics’ QS93, as well as products integrating the higher-end NXP i.MX 95 processor such as the Toradex Titan Evaluation kit. Three additional NXP i.MX 93 SoMs from Variscite, Dart, and Compulab are now available. Targeted at industrial, IoT, and automotive applications, the NXP i.MX 93 features a 64-bit dual-core Arm Cortex-A55 application processor running at up to 1.7GHz and a Cortex-M33 co-processor running at up to 250MHz. It integrates an Arm Ethos-U65 microNPU, providing up to 0.5TOPS of computing power, and supports EdgeLock secure enclave, NXP’s hardware-based security subsystem. The heterogeneous multicore processing architecture allows the device to run Linux on the main core and a real-time operating system on the Cortex-M33 core. The processor is designed for cost-effective and energy-efficient machine learning applications. It supports LVDS, MIPI-DS, and parallel RGB display protocols […]

May 5, 2024May 22, 2024 by Sponsored Post - 2 Comments

Save up to $75 on Rockchip RK3588-powered Mixtile Blade 3 SBC and Core 3588E module (Sponsored)

Mixile has launched a promotion that could save you up to $75 on the company’s Rockchip RK3588-powered devices, namely the Mixtile Blade 3 SBC that can be used standalone or integrated into a cluster and Core 3588E SO-DIMM system-on-module that follows the NVIDIA Jetson Nano, TX2 NX, Xavier NX, and Orin Nano form factor and will work with most carrier boards designed for those. The first part of the “Lucky Offer” promotion is a $50 discount coupon code (cnx50off) applicable to the Mixtile Blade 3, Mixtile Blade 3 Case, and Mixtile Cluster Box. The Mixtile Blade 3 is a pico-ITX SBC powered by a Rockchip RK3588 octa-core Cortex-A76/A55 processor, with up to 32GB RAM, up to 256GB eMMC flash, three display interfaces, an HDMI input port, dual GbE, a 30-pin GPIO header, and a U.2 connector carrying 4-lane PCIe Gen3 and SATA 3.0 signals and specifically designed for cluster applications. […]

April 25, 2024April 25, 2024 by Debashis Das - No Comments

Raspberry Pi CM4S module gets 2GB, 4GB, and 8GB RAM variants for commercial products

Raspberry Pi Compute Module 4S with 2GB, 4GB, and 8GB variants

Raspberry Pi has announced three new versions of its Compute Module 4S (CM4S) offering 2GB, 4GB, and 8GB RAM options which is an upgrade from the 1GB variant introduced in 2022. These new modules feature the same Broadcom BCM2711 quad-core Cortex-A72 SoC used in Raspberry Pi 4 and Raspberry Pi CM4 and have a starting price of only $25. The main downside is that the modules can only be purchased in bulk (200-unit boxes) through Raspberry Pi Approved Resellers. Raspberry Pi Compute Module 4S (CM4S) specifications: SoC – Broadcom BCM2711 CPU – Quad-core 64-bit Cortex-A72 processor @ 1.5 GHz GPU – VideoCore VI GPU 3D Graphics: OpenGL ES 3.0 and Vulkan 1.1 Video H.265 (HEVC) (up to 4Kp60 decode) H.264 (up to 1080p60 decode, 1080p30 encode) Memory – 1GB, 2GB, 4GB, and 8GB LPDDR4-3200 SDRAM with ECC Storage – 8GB, 16GB, or 32GB eMMC flash; Option for 0GB eMMC Flash […]

April 25, 2024April 25, 2024 by Tomisin Olujinmi - No Comments

Ronetix launches NXP i.MX93 SoMs in SMARC and OSM-L form factors

Austrian embedded equipment manufacturer, Ronetix, has released two i.MX93 system-on-modules (SoMs): the RNX-iMX93-OSM that follows the Open Standard Module (OSM) form factor, and the RNX-iMX93-SMARC compliant with the SMARC 2.1 (smart mobility architecture) standard. Ronetix i.MX93 SoMs are powered by the NXP i.MX93 processor featuring a 64-bit dual-core Arm Cortex-A55 application processor running at 1.7GHz and a Cortex-M33 core running at 250MHz for low-latency and real-time tasks. The SoC supports up to 2GB LPDDR4 RAM and 512GB eMMC storage, and the integrated Arm Ethos-U65 microNPU offers up to 0.5 TOPS of computing power for machine vision applications and intelligent energy management (IEM). Applicable for industrial automation and IoT, the SoMs also feature two CAN and Ethernet interfaces to aid high-speed data transfer. Other hardware featuring the i.MX93 that we have covered recently include the ADLINK OSM-IMX93, MaaXBoard OSM93, and Ka-Ro Electronics’ QS93. The RNX-iMX93-SMARC system-on-module comes in 82 x 50mm […]

April 24, 2024April 24, 2024 by Debashis Das - 1 Comment

BIGTREETECH Pi 2 SBC and CB2 module for 3D printers now feature Rockchip RK3566 SoC with Gigabit Ethernet

BIGTREETECH Pi 2 and the BIGTREETECH CB2 Compute Modules

BIGTREETECH recently announced the release of the BIGTREETECH Pi 2 SBC and BIGTREETECH CB2 SoM, both powered by the Rockchip RK3566 SoC. These new modules are direct upgrades from the BIGTREETECH Pi v1.2 and BIGTREETECH CB1, which we covered and reviewed in our previous posts. Specially designed for 3D printers, these new modules have a similar form factor to that of a Raspberry Pi and the RPI CM4 module, and come with a set of upgraded features including support for GbE Ethernet, dual-band WiFi, up to 32GB of LPDDR4 RAM, eMMC storage, HDMI, USB, and more. BIGTREETECH Pi 2 Specifications SoC – Rockchip RK3566 CPU – Quad-core Arm Cortex-A55 processor @ 1.8 GHz GPU – Arm Mali G52-2EE GPU with support for OpenGL ES 1.1/2.0/3.2, Vulkan 1.1, OpenCL 2.0 NPU – 0.8 TOPS AI accelerator VPU – 4Kp60 H.265/H.264/VP9 video decoding, 1080p100f H.265/H.264 video encoding System Memory – 2GB LPDDR4 (Customizable – 1GB/2GB/4GB/8GB) […]