Congatec conga-TCR8 AMD Ryzen Embedded 8000 COM Express computer-on-module series delivers up to 39 TOPS of AI performance

conga-TCR8 COM Express Compact module

Congatec has released a new line of Ryzen Embedded 8000-powered COM Express Type 6 Compact computer-on-modules with the conga-TCR8 module series offering up to 39 tera operations per second (TOPS) for AI inference and 128GB of DDR5-5600 memory with error correction code (ECC) for data-sensitive and data-critical applications. The Ryzen Embedded 8000 processor series comes with either six or eight ‘Zen 4’ cores, an integrated XDNA neural processing unit (16 TOPS), and the AMD Radeon RDNA 3 graphics unit which can be used as a general-purpose graphics processing unit with up to 12 compute units (adding up to 39 TOPS for the SoC). Graphics output is supported by four displays with up to 8K resolution, and peripheral options include six PCIe Gen 4 slots, four USB 3.2 Gen 2 ports, four USB 2.0 ports, and three DisplayPort interfaces. The conga-TCR8 Type 6 modules are intended for high-volume applications that require […]

MYiR Tech MYC-LD25X – A compact STM32MP25 system-on-module running Debian 12

MYD LD25X development board

MYiR Tech’s MYC-LD25X is a compact 39x37mm system-on-module built around the STMicro STM32MP25 dual-core Cortex-A35 SoC running at 1.5GHz with a Cortex-M33 core, and an NPU capable of 1.35 TOPS. The module comes with up to 2GB LPDDR4 RAM, 8GB eMMC storage, and a range of connectivity options, including Gigabit Ethernet, USB, CAN FD, UART, and SPI. Designed for industrial HMI, edge computing, energy systems, and automation, the MYC-LD25X is suitable for high-performance applications in these fields. Previously, we covered other development boards from MYiR, including the MYD-J7A100T, MYD-YG2UL, MYD-YG2LX, and MYD-J1028X. We also wrote about other STM32MP25-based system-in-package and system-on-module namely the Digi ConnectCore MP25 and Octavo OSD32MP2. Feel free to check them out if you’re interested. MYC-LD25X STM32MP25-based System-On-Module MYC-LD25X specifications: SoC – STMicro STM32MP257D processor CPU – Dual-core Arm Cortex-A35 64-bit RISC core operating at up to 1.5 GHz MPU – 32-bit Arm Cortex-M33 RISC core clocked at […]

Turing Pi 2.5 mini-ITX cluster board for system-on-modules launched along with a mini-ITX enclosure

Turing Pi 2.5

The Turing Pi 2.5 is a mini-ITX motherboard designed for clusters of system-on-modules such as Raspberry Pi CM4, NVIDIA Jetson modules, or the company’s own RK1 SoM powered by a Rockchip RK3588 AI SoC. A mini-ITX case compatible with both the Turing Pi 2 and 2.5 boards is also available. The Turing Pi 2.5 is an upgrade to the earlier Turing Pi 2 with the main key features, but some updates related to USB, HDMI output, new 8-pin connectors for I2C, audio, and GPIO pins, and BMC upgrades. While the company has just announced the start of Turing Pi 2.5 and the mini-ITX case pre-order, documentation and photos on the store and documentation website have not been updated. Everything is still about the Turing Pi 2 except for the information in the announcement. I won’t go through the specs since they are not available for the latest version, but the […]

Banana Pi BPI-CM5 Pro – A Rockchip RK3576-powered Raspberry Pi CM4 alternative with up to 16GB RAM, 128GB flash, a 6 TOPS NPU

Banana Pi BPI-CM5 Pro

Banana Pi BPI-CM5 Pro, also called ArmSoM-CM5, is a Rockchip RK3576 system-on-module electrically and mechanically compatible with the Raspberry Pi CM4 while offering up to 16GB LPDDR5 memory, 128GB eMMC flash, and a 6 TOPS AI accelerator embedded into the RK3576 SoC. It comes with a WiFi 6 and Bluetooth 5.3 wireless module, a PMIC for power management, and two 100-pin connectors mostly compatible with the pinout of the Raspberry Pi Compute Module 4. ArmSoM also provides a CM5-IO carrier board to make use of the extra USB 3.0 and PCIe interfaces, and the company told CNX Software they tested the module successfully with the official Raspberry Pi CM4 IO board. Banana Pi BPI-CM5 Pro specifications: SoC – Rockchip RK3576 CPU – 4x Cortex-A72 cores at 2.2GHz, 4x Cortex-A53 cores at 1.8GHz GPU – Arm Mali-G52 MC3 GPU with support for OpenGL ES 1.1, 2.0, and 3.2, OpenCL up to 2.0, […]

LicheePi 3A – A SpacemIT K1 RISC-V development board with SoM and carrier board

LicheePi 3A development board

Sipeed LicheePi 3A is a development board comprised of the LM3A system-on-module based on SpacemIT K1 octa-core RISC-V SoC and the same baseboard as found in the earlier LicheePi 4A equipped with a T-Head TH1520 quad-core RISC-V “LM4A” system-on-module instead. The LicheePi 3A is currently offered with a 32GB eMMC flash and 8GB or 16GB LPDDR4x memory. The carrier board provides a microSD card, two M.2 PCIe sockets for storage or other expansion, two gigabit Ethernet ports, a WiFi 6 and Bluetooth 5.2 module, HDMI and MIPI DSI display interfaces, two MIPI CSI camera interfaces, four USB 3.0 ports, and a 20-pin GPIO header for expansion. Sipeed LicheePi 3A specifications: Sipeed LM3A SoM SoC – SpacemiT K1 CPU – 8-core X60 RISC-V processor @ 1.6 GHz GPU – Imagination IMG BXE-2-32 with support for OpenGL ES3.2, Vulkan 1.2, OpenCL 3.0; 20 GFLOPS VPU – H.265 and H.264 1080p60 decoding/encoding NPU […]

Nuvoton NuMicro MA35D1-powered industrial SoM and dev board features dual GbE ports, cellular connectivity, and more

MYC LMA35 Development Board

MYIR has recently introduced MYC-LMA35 industrial SoM and its associated development board built around the Nuvoton NuMicro MA35D1 microprocessor with two Arm Cortex-A35 cores and one Arm Cortex-M4 real-time core for processing. The SoM comes in a BGA package with connectivity options such as dual Gigabit Ethernet, cellular connectivity, Wi-Fi/Bluetooth, and various other interfaces like RS232, RS485, USB, CAN, ADC, GPIO, and more. All these features make this SoM and its associated dev board useful for demanding edge IIoT applications like industrial automation, energy management systems, smart city infrastructure, and remote monitoring solutions. Previously we have seen MYIR introduce various SoM and development boards like the MYC-LR3568 Edge AI SoM, and the MYC-YF13X SoM and we have also written about similar industrial dev boards such as the Firefly ROC-RK3576-PC, the Nuvoton NuMicro M2L31 development board, and many more. Feel free to check those out if you are interested in the topic. […]

Geniatech SOM-3576 – A Rockchip RK3576 system-on-module with a 314-pin MXM 3.0 edge connector

Rockchip RK3576 system-on-module 314-pin MXM 3.0 edge connector

Geniatech SOM-3576 is another system-on-module (SoM) powered by Rockchip RK3576 octa-core Cortex-A72/A53 AI SoC but with a 314-pin MXM 3.0 edge connector to expose I/Os. It follows other RK3576 SoMs like the Boardcon CM3576 with castellated edges and the Forlinx FET3576-C with board-to-board connectors. The SOM-3576 module supports up to 16GB RAM, and 256GB eMMC flash, and comes with a Rockchip PMIC. I can also see a footprint for 512GB or 1TB UFS storage as Firefly did on the Firefly ROC-RK3576-PC single board computer. Geniatech SOM-3576 specifications: SoC – Rockchip RK3576 CPU 4x Cortex-A72 cores at 2.3 GHz, 4x Cortex-A53 cores at 2.2 GHz Arm Cortex-M0 MCU at 400MHz GPU – ARM Mali-G52 MC3 GPU with support for OpenGL ES 1.1, 2.0, and 3.2, OpenCL up to 2.0, and Vulkan 1.1 NPU – 6 TOPS (INT8) AI accelerator with support for INT4/INT8/INT16/BF16/TF32 mixed operations. VPU Video Decoder – H.264, H.265, VP9, […]

SMARC 2.2 specification adds support for Soundwire, PCIe Gen4, and more

SMARC 2.2 specification

SGET (Standardization Groups for Embedded Technologies) has announced the release of the SMARC 2.2 specification with various improvements including support for Soundwire, PCIe Gen4, and severa; other changes related to pinout definitions and signal descriptions, as well as various bug fixes and corrections. SMARC (“Smart Mobility ARChitecture”) is one of the many standards for systems-on-module designed to enable interoperability between vendors that offer modules compliant with the standard. SMARC features a 314-pin MXM 3.0 connector and is available in two form factors, either 82×50 mm or 82×80 mm, with the former being more common. SMARC 2.2 changes since SMARC 2.1 (April 2020): Removed wrong AC coupling comment in section 3.5.1 HDMI (SMARC 2.1.1 update) Added Soundwire as an alternative function for I2S2 Added SERDES reset signal as an alternative function of PCIe reset signal Added SERDES interrupt signals as dual-function on GPIO[7:8] Updated supported Ethernet speed and renamed the LINK […]

Exit mobile version
EmbeddedTS embedded systems design