iWave Sytems iW-RainboW-G50M is an NXP i.MX 93 OSM-L compliant LGA module with up to 2GB RAM, WiFi 5 and Bluetooth 5.2 module that is found in the company’s iW-RainboW-G50S Pico-ITX SBC designed for industrial applications. The NXP i.MX 93 single and dual-core Cortex-A55 processor with an Ethos U65 microNPU was announced in November 2021, but we had yet to see any hardware based on the new NXP i.MX 9 processor family. The iW-RainboW-G50M and iW-RainboW-G50S change that with a system-on-module and single board computer. iW-RainboW-G50M NXP i.MX 93 system-on-module Specifications: SoC (one or the other) NXP i.MX 9352 dual-core Cortex-A55 processor @ up to 1.7 GHz with Arm Cortex-M33 @ 250 MHz, 0.5 TOPS NPU NXP i.MX 9351 single-core Cortex-A55 processor @ up to 1.7 GHz with Arm Cortex-M33 @ 250 MHz, 0.5 TOPS NPU NXP i.MX 9332 dual-core Cortex-A55 processor @ up to 1.7 GHz Arm Cortex-M33 @ […]
Sipeed LM4A – T-Head TH1520 RISC-V module to power Raspberry Pi 4 competitor and cluster board
Sipeed LM4A is a quad-core RISC-V system-on-module based on the T-Head TH1520 SoC found in the ROMA laptop and destinated to be found in a Raspberry Pi SBC competitor as well as a cluster board. The LM4A, which stands for Lichee Module 4 Model A, comes with 4GB to 16GB RAM, and up to 64GB flash, and connects to the carrier board through a 260-pin SO-DIMM connector. The TH1520 is one of the rare RISC-V SoCs with a 3D GPU, and the SBC based on LM4A has been shown to outperform the Raspberry Pi 4 in benchmarks as we’ll see below. Sipeed LM4A specifications: SoC – Alibaba T-Head TH1520 quad-core RISC-V Xuantie C910 (RV64GCV) processor @ 2.5 GHz, Xuantie C906 audio DSP @ 800 MHz, low power Xuantie E902 core, 50 GFLOPS Imagination 3D GPU, and 4 TOPS NPU System Memory – 4GB, 8GB, or 16GB RAM Storage – Optional […]
Rockchip RK3588 system-on-module exposes 400 pins through high-density connectors
Forlinx FET3588-C is a relatively compact Rockchip RK3588 system-on-module measuring 68x50mm and exposing many of the processor’s I/Os through four 100-pin high-density connectors. The module ships with up to 8GB LPDDR4x and 64GB eMMC flash, and the company also provides the OK3588-C development board for evaluation with HDMI output and input, two MIPI DSI interfaces, five camera connectors, dual Gigabit Ethernet, M.2 sockets for WiFi and 4G/5G cellular connectivity, and more. Forlinx FET3588-C RK3588 system-on-module Specifications: SoC – Rockchip RK3588 octa-core processor with 4x Arm Cortex-A76 cores @ up to 2.4 GHz, 4x Arm Cortex-A55 cores, Arm Mali-G610 MP4 GPU with support for OpenGL ES3.2, OpenCL 2.2, Vulkan1.1, 6 TOPS NPU, 48MP ISP, 8Kp60 video decoding, 8Kp30 video encoding System Memory – 4GB or 8GB LPDDR4x (16GB planned) Storage – 32GB or 64GB eMMC 5.1 flash (128GB planned) Carrier board interface – 4x high-density 100-pin board-to-board connectors Storage – Up […]
Raspberry Pi availability improves, “unlimited supplies” expected by H2 2023
The Raspberry Pi SBCs have been in short supply for a couple of years, especially for individual buyers since Raspberry Pi Trading prioritizes commercial customers, but Eben Upton has just announced some good news with over 100,000 boards comprised of a mix of Raspberry Pi Zero W, Pi 3A+, and Raspberry Pi 4 2GB and 4GB variants being made available for single-unit sales through approved resellers. Eben however notes there’s more to do, and recommends buying from an approved reseller to get the boards at the recommended retail price (RRP), checking rpilocator to check for availability, and potentially considering switching to the Raspberry Pi Pico or Pico W if the project allows it as there’s plenty of stock for the MCU boards. Industrial and enterprise customers who still have issues can get in touch with the company by email using business <at> raspberrypi.com. But based on some feedback I received, […]
Credit card-sized COM-HPC Mini modules to support PCIe Gen4 and Gen5 interfaces
PICMG has announced that the COM-HPC Mini form factor’s pinout and dimensions definitions were finalized, with the tiny credit card-sized modules able to handle PCIe Gen4 and Gen5 interfaces, of course, depending on whether the selected CPU supports those. The COM-HPC “High-Performance Computing” form factor was created a few years ago due to the lack of interfaces on the COM Express form factor with “only” 440 pins and potential issues to handle PCIe Gen 4 clock speeds and throughputs. So far, we had COM-HPC Client Type modules from 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules with either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 70 mm) credit card-sized form factor to the COM-HPC standard. The way they cut the size of the COM-HPC Size A form factor by half […]
Allwinner T3 automotive-grade processor powers industrial-grade SoM
Allwinner T3 is a quad-core Cortex-A7 automotive-grade processor that supports a wide industrial temperature range of -40°C to +85°C. After comparing the specifications of Allwinner T3, I think it is the same as Allwinner A40i, as Allwinner has different business units and the T-series is for the automotive-grade market, while the A-series has historically been for the tablet market, but is now also used in the industrial-grade market. Tronlong SOM-TLT3 and SOM-TLT3-B are Allwinner T3 system-on-modules (SoM) of Allwinner T3. Both modules have basically the same specifications but the SOM-TLT3 comes with castellated holes for soldering to the carrier board, while the SOM-TLT3-B features board-to-board connectors. Tronlong SOM-TLT3 / SOM-TLT3-B specifications: CPU – Allwinner T3 quad-core Arm Cortex-A7 @ 1.2 GHz with 32KB L1 I-cache + 32KB L1 D-cache, 512KB L2 cache. GPU – Arm Mali-400 MP2 with support for OpenGL ES 1.1/2.0, Open VG 1.1 Memory – 1/2GByte DDR3 […]
DongshanPI-D1s – An Allwinner D1s RISC-V development board designed to teach programming
The DongshanPI-D1s development board is comprised of a soldered-on Allwinner D1s RISC-V system-on-module board (SoM) and a carrier board with two 40-pin headers and a 2.0mm dedicated header. This development board is specifically designed to teach programming with a focus on the RISC-V architecture. The development board was designed by 100ask. They previously designed the Dongshan NeZha STU a development board based on the Allwinner D1. The main difference between the two is that 100ask did not include the Ethernet and HDMI interfaces on the DongshanPI-D1s board. The pinout of the headers is also slightly different because they opted to make the headers compatible with the widely used 40-pin GPIO from Raspberry Pi single board computers. DongshanPI-D1s preliminary specifications: D1s Core Lite SoC – Allwinner D1s single-core XuanTie C906 64-bit RISC-V processor @ 1.0 GHz with with 32 KB I-cache + 32 KB D-cache Memory – 64 MB DDR2 (SIP) […]
System-on-module combines NXP i.MX 8M Mini Arm CPU and Xilinx Artix-7 FPGA
MYIR Tech has launched the MYC-JX8MMA7 system-on-module combining an NXP i.MX 8M Mini quad-core Arm Cortex-A53 processor with an AMD Xilinx XC7A25T Artix-7 FPGA. The 82 x 45mm CPU module comes with 2GB LPDDR4, 8GB eMMC flash, and 32MB QSPI Flash for the Arm processor and 256MB DDR3 and 32MB QSPI Flash for FPGA. It exposes I/Os through an MXM 3.0 edge connector and can operate in the industrial temperature range (-40 to 85°C). MYC-JX8MMA7 CPU module specifications: SoC – NXP i.MX 8M Mini with quad-core Cortex-A53 processor @ up to 1.6 (industrial) or 1.8 GHz, Cortex-M4F real-time core @ 400 MHz, Vivante GC320 and Vivante GCNanoUltra 3D/2D GPUs, 1080p60 H.265, H.264, VP8, VP9 video decoder, 1080p60 H.264 & VP8 video encoder FPGA – AMD Xilinx Artix-7 XC7A25T-2CSG325 with 23,360 logic cells, 3x GTP System Memory and Storage SoC – 2GB LPDDR4, 8GB eMMC flash, and 32MB QSPI Flash FPGA […]