iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iW-RainboW-G54S credit card-sized OSM SBC

iWave Systems iW-RainboW-G54S is a credit card-sized SBC fitted with an OSM Size-S (30x30mm) system-on-module based on STM32MP133 or STM32MP135 Cortex-A7 SoC with up to 1GB RAM, and up to 128GB flash. Interfaces include a Gigabit Ethernet port, a USB Type-A port, an 18-bit RGB LCD display interface, and three 100-pin high-density connectors for additional I/Os. The iW-RainboW-G54S SBC is designed for industrial applications with a temperature range of -40 to +85°C. While it’s fitted with an OSM Size-S module, we’ll also notice the carrier board has a footprint for OSM Size-M (45x30mm) and OSM Size-L (45x45mm) modules indicating it will be used with other OSM modules in the future. iWave Systems iW-RainboW-G54S specifications: System-on-Module – iW-RainboW-G54M SoC (one or the other) STMicro STM32MP133 single-core Cortex-A7 with or without Secure boot + Cryptography; for headless applications STMicro STM32MP135 single-core Cortex-A7 with or without Secure boot + Cryptography; supports LCD-TFT parallel […]

Chipsee introduces 7-inch and 10.1-inch industrial panel PCs powered by Raspberry Pi CM5

Raspberry Pi CM5 Panel PCs

Chipsee has introduced three new panel PCs powered by the Raspberry Pi Compute Module 5 (CM5), namely the EPC-CM5-070, PPC-CM5-070, and PPC-CM5-101, designed for automation, manufacturing, and industrial applications. The EPC-CM5-070 is a compact 7-inch open frame embedded panel PC with armored glass, the PPC-CM5-070 is also a 7-inch panel PC but with VESA/panel mounting and a rugged metal enclosure, and the PPC-CM5-101 features a 10.1-inch touchscreen display and support for an extended temperature range. Chipsee EPC-CM5-070 – A 7-inch open frame panel PC Specifications: SoM – Raspberry Pi CM5 with Broadcom BCM2712 quad-core Cortex-A76 SoC, 4GB or 8GB RAM, 32GB eMMC flash Storage MicroSD card slot M.2 M-Key 2230/2242 (PCIe Gen2 x1) socket for NVMe SSD Display – 7-inch display with 1024×600 resolution, 5-point capacitive touchscreen, 500 NIT brightness Video Output – HDMI port Audio 3.5mm audio out jack Internal 2W Speaker Buzzer Camera – Optional support Networking Gigabit […]

SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SOM SMARC QCS5430 SoM

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

Toradex launches its first SMARC modules with NXP SoCs for improved compatibility and supply chain

Toradex SMARC modules with NXP i.MX 8MPlus and i.MX 95

Toradex has introduced its first SMARC-compliant system-on-modules (SoMs) with the SMARC iMX8M Plus and SMARC iMX95 SoMs based on NXP i.MX 8M Plus and NXP i.MX 95 SoC respectively. The company has made proprietary system-on-modules for years with the Colibri, Apalis, Aquila, and Verdin families. Those typically are cost-optimized and use most or all I/Os from the selected SoC, but customers are tied to one supplier: Toradex. To offer more flexibility, the company decided to introduce its first standardized system-on-modules by selecting the SMARC 2.2 standard for compatibility with existing SMARC-compliant carrier boards and adding the Swiss company as an alternative supplier. Highlights of the SMARC iMX8M Plus module: SoC – NXP i.MX 8M Plus CPU Quad-core ARM Cortex-A53 application processor @ 1.6 GHz Arm Cortex-M7 real-time core @ 800 MHz GPU – Vivante GC380 2D GPU and GC7000UL 3D GPU VPU – 1080p60 video decoder & encoder AI accelerator […]

Solderable Rockchip RV1106 system-on-module features 112 castellated pins, offers WiFi 6 and Bluetooth 5.2 connectivity

Luckfox Core1106 Core Board

Luckfox has recently released the Core1106 Core Board Rockchip RV1106 system-on-module with a compact 30x30mm size, 112 castellated pins designed to be soldered on top of a PCB, and an optional WiFi 6 and Bluetooth 5.2 module and IPEX 1.0 antenna connector. The Rockchip RV1106 camera SoC integrates 128MB (G2 version) or 256MB (G3 version) DDR3L memory, a 4th-gen 1 TOPS NPU, and a 3rd-gen Image Signal Processor (ISP) that supports hardware video encoding (H.264/H.265). Other interfaces include MIPI CSI, RGB LCD, USB, Ethernet, GPIO, SPI, I2C, UART, and more. These features make this board suitable for applications like AI-driven image recognition, smart cameras, IoT devices, and edge computing. Luckfox RV1106 system-on-module specifications SoC – Rockchip RV1106G2/G3 CPU – Arm Cortex A7 @ 1.2GHz with an integrated RISC-V co-processor. NPU 4th-gen Rockchip NPU with hybrid quantization (int4, int8, int16) 0.5 TOPS (RV1106G2) or 1 TOPS (RV1106G3) ISP – 3rd-gen 5MP high-performance ISP, HDR, WDR, […]

Linux 6.13 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.13 Changelog

Linus Torvalds has just announced the release of Linux 6.13 on the Linux Kernel Mailing List: So nothing horrible or unexpected happened last week, so I’ve tagged and pushed out the final 6.13 release. It’s mostly some final driver fixes (gpu and networking dominating – normal), with some doc updates too. And various little stuff all over. The shortlog is appended for people who want to see the details (and, as always, it’s just the shortlog for the last week, the full 6.13 log is obviously much too big). With this, the merge window for 6.14 will obviously open tomorrow. I already have two dozen pull requests pending – thank you, you know who you are. Linus Release about two months ago, Linux 6.12 – the new LTS version – brought us real-time “PREEMPT_RT” support that had always required out-of-tree patchsets until now, the completion of the EEVDF (Earliest Eligible […]

conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-cBLS COM-HPC Intel Barlett Lake S module

Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others. The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers. Congatec conga-HPC/cBLS specifications: Bartlett Lake-S SoC Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / […]

The LattePanda Mu SoM is now available with Intel Core i3-N305 octa-core SoC

LattePanda Mu Intel Core i3-N305 CPU

Launched last year with an Intel Processor N100, the LattePanda Mu system-on-module is now available with an Intel Core i3-N305 octa-core processor delivering both higher single-core and multi-core performance, and faster 3D graphics acceleration. All interfaces are the same all exposed through a 260-pin SO-DIMM edge connector including up to 9x PCIe Gen3 lanes, two SATA, eDP, HDMI, and DisplayPort interfaces, twelve USB interfaces, and more.  The LattePanda Mu launched with 8GB RAM last year, but both the N100 and Core i3-N305 models are now available with up to 16GB LPDDR5 IBECC memory, while the eMMC flash capacity remains at 64GB for all variants. LattePanda Mu specifications: SoC (one or the other) Intel Processor N100 quad-core Alder Lake-N processor @ up to 3.4 GHz (Turbo) with 6MB cache, 24EU Intel HD graphics @ 750 MHz; TDP: 6W Intel Core i3-N305 octa-core Alder Lake-N processor @ up to 3.8 GHz (Turbo) […]

UP 7000 x86 SBC