Variscite VAR-SOM-AM62P SoM features Texas Instruments Sitara AM62P5 SoC for cost-effective multimedia applications

VAR SOM AM62P development kit

Variscite VAR-SOM-AM62P is a system-on-module powered by Texas Instruments Sitara AM62P5 quad-core Cortex-A53 + Cortex-R5F SoC coupled with up to 8GB LPDDR4 RAM and 128GB eMMC flash, and designed for cost-effective multimedia applications. The SO-DIMM module offers high speed interfaces such as gigabit Ethernet and USB 2.0, a certified WiFi 6 and Bluetooth 5.4 module, and operating in the -40 to 85°C industrial range. As a VAR-SOM module, it’s pin-to-pin compatible with other modules from the family such as the VAR-SOM-6UL or VAR-SOM-IMX93. Variscite VAR-SOM-AM62P specifications: SoC – Texas Instruments Sitara AM62P5 CPU 4x Arm Cortex-A53 @ 1.4 GHz up to 12,880 DMIPS Arm Cortex-R5F real-time core up to @ 800 MHz GPU –  3D GPU with OpenGL ES 3.2 & Vulkan1.2 VPU – H.264/H.265 Video Encoder/Decoder No PRU System Memory – 1GB to 8GB LPDDR4 Storage – 8GB to 128GB eMMC flash Networking Gigabit Ethernet PHY (Analog Devices ADIN1300) […]

Thundercomm TurboX C6690 SoM runs Android 15 on Qualcomm DragonWing QCS6690 SoC for terminal equipment

Thundercomm CC6690 SoM

Unveiled at Embedded World 2025, Thundercomm’s TurboX C6690 is a SoM (System-on-Module) powered by a 4nm Qualcomm Dragonwing QCS6690 octa-core SoC, and designed for Android 15-based terminal equipment such as industrial handheld devices, industrial tablets, edge computing, and smart retail applications. The LGA system-on-module features a multi-chip package that combines 8GB LPDDR4x memory with 256GB UFS storage, and offers MIPI and DP (USB) display interfaces, four MIPI CSI camera interfaces, a USB 3.1 interface, a PCIe Gen2 interface, and various low-speed I/Os such GPIO, I2C, UART, and SPI. Thundercomm TurboX C6690 SoM specifications: SoC – Qualcomm Dragonwing QCS6690 CPU – Octa-core Qualcomm Kryo CPU 7-series (1x Kryo Prime core @ 2.9GHz, 3x Kryo Gold @ 2.7GHz, 4x Kryo Silver @ 2.0GHz) GPU – Qualcomm Adreno GPU 7-series DSP – Qualcomm Hexagon DSP with HVX and HMX ISP – Qualcomm Spectra ISP 665 image processing VPU Video Encode – Up to […]

Raspberry Pi Compute Module 4 adds industrial/extended temperature range from -40°C to +85°C

Raspberry Pi Compute Module 4 industrial temperature range

Some Raspberry Pi Compute Module 4 are now available in the industrial/extended temperature operating from -40°C to +85°C, suitable for outdoor applications in cold climates and (some) cold storage solutions that require sub -20°C temperature. When the Raspberry Pi Compute Module 4 was launched in 2020, Raspberry Pi did not provide an operating temperature range. Since then, the Raspberry CM4 has been qualified to operate in the -20°C to +85°C range, which is suitable for most applications but not all. Eben Upton has now announced the availability of Raspberry Pi Compute Module 4 variants with extended temperature range. Raspberry Pi Compute Module 4 specifications (as of March 2025): SoC – Broadcom BCM2711 quad-core Cortex-A72 processor @ 1.5 GHz with VideoCore VI GPU System Memory – 1GB, 2GB, 4GB, or 8GB LPDDR4-3200 SDRAM Storage – CM4: 4, 8, 16, or 32GB eMMC flash up to 100MB/s; CM4 Lite: No storage device […]

ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

OSM-MTK510

ADLINK OSM-MTK510 is an OSM Size-L compliant module powered by a MediaTek Genio 510 hexa-core Arm Cortex-A78/A55 SoC with a 3.2 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and 128GB eMMC flash. The OSM module supports HDMI 2.0, MIPI DSI, and eDP display interfaces, up to 30MP cameras, and I/O options such as gigabit Ethernet, USB 3.0, and PCIe Gen2 x1. The OSM-MTK512 is available in either commercial or industrial (-40°C to 85°C) temperature grades and the company offers at least a 10-year lifecycle for long-term use. ADLINK OSM-MTK510 specifications: SoC – MediaTek Genio 510 (MT8370) CPU – Hexa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU VPU for visual processing Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp60, AV1, VP9, HEVC, H.264 codecs supported AI […]

Boardcon SBC3576 – A feature-rich Rockchip RK3576 SBC with HDMI, mini DP, dual GbE, WiFi 6, optional 5G/4G LTE module, and more

Boardcon SBC3576 SBC

Boardcon SBC3576 is a feature-rich single board computer (SBC) based on the MINI3576 system-on-module powered by a Rockchip RK3576 AI SoC and equipped with two 100-pin and one 44-pin board-to-board connectors for interfacing with the carrier board. The carrier board is equipped with up to 8GB RAM, 128GB eMMC flash, two gigabit Ethernet ports, a WiFi 6 and Bluetooth 5.3 module, 4K-capable HDMI 2.1 and mini DP video outputs, a mini HDMI input port, a USB 3.0 Type-A port, RS485 and CAN Bus terminal block, and more. The Rockchip RK3576 SoC comes with the same 6 TOPS NPU found in the Rockchip RK3588/RK3588S SoC and can be used as a lower-cost alternative with less performance. Boardcon SBC3576 specifications: SoC – Rockchip RK3576 CPU 4x Cortex-A72 cores at 2.2GHz, four Cortex-A53 cores at 1.8GHz Arm Cortex-M0 MCU at 400MHz GPU – ARM Mali-G52 MC3 GPU clocked at 1GHz with support for OpenGL […]

iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iW-RainboW-G54S credit card-sized OSM SBC

iWave Systems iW-RainboW-G54S is a credit card-sized SBC fitted with an OSM Size-S (30x30mm) system-on-module based on STM32MP133 or STM32MP135 Cortex-A7 SoC with up to 1GB RAM, and up to 128GB flash. Interfaces include a Gigabit Ethernet port, a USB Type-A port, an 18-bit RGB LCD display interface, and three 100-pin high-density connectors for additional I/Os. The iW-RainboW-G54S SBC is designed for industrial applications with a temperature range of -40 to +85°C. While it’s fitted with an OSM Size-S module, we’ll also notice the carrier board has a footprint for OSM Size-M (45x30mm) and OSM Size-L (45x45mm) modules indicating it will be used with other OSM modules in the future. iWave Systems iW-RainboW-G54S specifications: System-on-Module – iW-RainboW-G54M SoC (one or the other) STMicro STM32MP133 single-core Cortex-A7 with or without Secure boot + Cryptography; for headless applications STMicro STM32MP135 single-core Cortex-A7 with or without Secure boot + Cryptography; supports LCD-TFT parallel […]

Chipsee introduces 7-inch and 10.1-inch industrial panel PCs powered by Raspberry Pi CM5

Raspberry Pi CM5 Panel PCs

Chipsee has introduced three new panel PCs powered by the Raspberry Pi Compute Module 5 (CM5), namely the EPC-CM5-070, PPC-CM5-070, and PPC-CM5-101, designed for automation, manufacturing, and industrial applications. The EPC-CM5-070 is a compact 7-inch open frame embedded panel PC with armored glass, the PPC-CM5-070 is also a 7-inch panel PC but with VESA/panel mounting and a rugged metal enclosure, and the PPC-CM5-101 features a 10.1-inch touchscreen display and support for an extended temperature range. Chipsee EPC-CM5-070 – A 7-inch open frame panel PC Specifications: SoM – Raspberry Pi CM5 with Broadcom BCM2712 quad-core Cortex-A76 SoC, 4GB or 8GB RAM, 32GB eMMC flash Storage MicroSD card slot M.2 M-Key 2230/2242 (PCIe Gen2 x1) socket for NVMe SSD Display – 7-inch display with 1024×600 resolution, 5-point capacitive touchscreen, 500 NIT brightness Video Output – HDMI port Audio 3.5mm audio out jack Internal 2W Speaker Buzzer Camera – Optional support Networking Gigabit […]

SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SOM SMARC QCS5430 SoM

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

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