Robustel industrial IoT gateways run Debian-based OS, offer 5G, 4G LTE, LoRaWAN connectivity

Robustel EG5120 industrial IoT gateway

Robustel has launched three Arm-based industrial IoT gateways namely the EG5100, EG5120, and LG5100 that offer 5G, 4G LTE, and/or LoRaWAN connectivity, and runs Debian 11-based RobustOS Pro Linux operating systems The edge gateways also feature two Ethernet ports, two RS232/RS485 ports for connection to industrial devices, digital inputs and outputs for simple monitoring and control, and support a wide 9 to 60V DC power input through a 2-pin terminal block. Robustel LG5100, EG5100, and EG5120 specifications: SoC/memory/storage LG5100 and EG5100 Unnamed quad-core Cortex-A7 processor @ 792 MHz (possibly NXP i.MX 7ULP) 512MB DDR3 8GB eMMC flash EG5120 Unnamed quad-core Cortex-A53 processor @ 1.6 GHz with 2.3 TOPS NPU (very likely NXP i.MX 8M Plus) 2GB DDR4 16GB eMMC flash, microSD card socket Connectivity LG5100 2x 10/100 Mbps Ethernet ports with support for 802.3af PD feature on eth0 LoRaWAN connectivity with 1x SMA antenna connector, support for EU868, AU915, CN470 […]

ASRock Industrial iEPF-9010S/iEP-9010E Edge AIoT platforms feature Alder Lake S CPU, up to 128GB RAM

ASRock Industrial iEPF-9010S & iEP-9010E Alder Lake S Edge AIoT platform

ASRock Industrial has released the iEPF-9010S and iEP-9010E high-end, rugged Edge AIoT platforms powered by 12th Gen Intel Alder Lake S processors, equipped with up to 128GB RAM, 4G LTE, 5G, Wi-Fi 6E, Bluetooth 5.2 connectivity, and real-time TSN/TCC networking. The I/O rich embedded computers are designed for highly demanding workloads and mission-critical industrial applications such as factory automation, machine automation, robotic control, AI-enabled AOI (automated optical inspection), autonomous vehicles, smart cities, and more. The ASRock iEPF-9010S Expandable AIoT Edge platforms come with the following specifications: SoC – Intel 12th Gen Core, Pentium or Celeron “Alder Lake S” hybrid processor with up to 16 cores and 24 threads, Intel Xe or UHD Graphics fitting in an LGA 1700 socket Chipset iEPF-9010S-EY4 model – Intel R680E iEPF-9012S-EY4 model – Intel H610 System Memory iEPF-9010S-EY4 model – 4x 260-pin SO-DIMM DDR4 3200MHz up to 128GB (32 GB per SO-DIMM) iEPF-9012S-EY4 model – […]

Morse Micro MM6104, MM6108 Wi-Fi HaLow SoCs support up to 32.5 Mbps data rate

Morse Micro MM61xx

Australian company Morse Micro MM6104 and MM6108 Wi-Fi HaLow SoCs should offer some competition to the Newracom NRC chips found in all 802.11ah WiFi HaLow boards and devices released so far. Both MM610x chips have similar features, but the MM6104 SoC supports 1/2/4 MHz channel bandwidth for up to 15 Mbps data rate – just like the Newracom NRC7292 chip – while the more powerful MM6108 can handle a data rate of up to 32.5 Mbps thanks to 1/2/4/8 MHz channel bandwidth. MM6104/MM6108 specifications: Optional 32-bit RISC-V Host Applications Processor (HAP) Single-Chip IEEE802.11ah Wi-Fi HaLow transceiver for low-power, long-reach IoT applications Worldwide Sub-1 GHz frequency bands (850MHz to 950MHz) On-chip power amplifier with support for external PA option MM6104 – 1/2/4 MHz channel bandwidth for up to 15 Mbps data rate (Note: the datasheet reads “single-stream max data rate up to 40 Mbps”, but it appears to be a mistake […]

TurboX C7230 SOM integrates Qualcomm QCS7230 SoC for WiFi 6 & 5G 8K AI cameras

8K WiFi 6 AI camera development kit

Thundercomm TurboX C7230 SOM is a system-on-module powered by the just-announced Qualcomm QCS7230 hexa-core processor with 7 TOPS of AI performance and designed for WiFi 6 and 5G connected smart cameras with up to 8K resolution. The TurboX C7230 module comes with 8GB LPDDR5 (PoP), 128GB UFS storage, six MIPI CSI camera interfaces, two MIPI DSI display interfaces, as well as a QCA6391 chip for WiFi 6 and Bluetooth 5.1 connectivity, plus optional 5G cellular connectivity through an optional Snapdragon X55 module that connects to the TurboX C7230 development kit. TurboX C7230 SOM system-on-module specifications: SoC – Qualcomm Snapdragon QCS7230 hexa-core processor with 1x Kryo 585 Gold (Cortex-A77) core @ 2.84 GHz, 3x Kryo 585 Gold cores @ 2.4 GHz, and two Kryo 585 Silver (Cortex-A55) cores @ 1.8 GHz, 4 MB L3 cache, Adreno 650 GPU, Adreno 665 VPU, Adreno 995 DPU, Hexagon DSP with dual-HVX,  and Spectra 480 […]

Ai-Thinker Ra-08 LoRaWAN module features ASR6601 chip (Sponsored)

Ai Thinker Ra-08 LoRaWAN Module

Ai-Thinker Ra-08/08H are new LoRaWAN modules based on ASR Microelectronics ASR6601 module featuring a 48MHz ARM Cortex M4 microcontroller and Semtech SX1262 transceiver allowing long-range, low power communication for the Internet of Things. Both LoRaWAN modules share most of the same specifications, but the Ra-08 module operates in the 410-525MHz frequency band, while the Ra-08H module works in the widely used 803MHz to 930MHz band. Ai-Thinker also provides a development kit for each module. Ai-Thinker Ra-08/Rs-08H key features and specifications: Programmable embedded Arm Cortex-M4 MCU with 128 KB of Flash and 16 KB of SRAM LoRa radio Sensitivity – -138 dBm @ SF12/125KHz Tx power – Up to +22dBm Frequencies Ra-08 – 410 MHz to 525 MHz Ra-07H – 803 MHz to 930 MHz Spread spectrum factor – SF5, SF6, SF7, SF8, SF9, SF10, SF11, SF12 LoRa, (G)FSK, BPSK, and (G)MSK modulation Bit rate up to 62.5 Kbps in LoRa […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

Arduino Portenta gets an LTE Cat. M1/NB IoT GNSS shield

Arduino Portenta LTE Cat-M1 NB-IoT GNSS shield

Arduino PRO Portenta family of industrial boards is getting a new LTE Cat. M1/NB-IoT GNSS shield that adds global connectivity and positioning capabilities through the Cinterion TX62-W LPWAN IoT module by Thales. The shield works with the Portenta H7 board as well as its lower-cost variants and Arduino MKR boards and will power industry 4.0 and edge computing solutions such as positioning, asset tracking, and remote monitoring applications at the factory, in agriculture, public utilities, and smart cities. Portenta CatM1 shield specifications: Cinterion TX62-W module with: 3GPP Rel.14 Cat.M1, Cat.NB1, Cat.NB2 Global coverage with a single SKU FDD-LTE Bands – 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 71, 85 LTE Cat. M1 – DL: max. 300 kbps, UL: max. 1.1 Mbps LTE Cat. NB1 – DL: max. 27 kbps, UL: max. 63 kbps LTE Cat. NB2 – DL: max. 124 kbps, […]

Bluetooth LE 5.0 module enables batteryless sensors thanks to Renesas RE01B MCU

RELOC RM-BE1 BLE 5.0 module energy harvesting

RELOC RM-BE1 Bluetooth 5.0 module with embedded energy harvesting capabilities for batteryless sensors adds to the list of energy harvesting news we’ve written about since the beginning of the year, with UEI chip for remote controls, a devkit with a smart coffee cup,  and Atmosic ATM33 BLE 5.3 chip. The RM-BE1 module is powered by Renesas RE01B Arm Cortex-M0+ Bluetooth microcontroller that leverages Renesas’ SOTB (Silicon on Thin Buried Oxide) process technology enabling ultra-low power. We’ve been told the chip can run at 35uA/Mhz with internal LDOs and <20uA/Mhz with additional external DCDCs, as well as around 600nA in standby mode. RELOC RM-BE1 module key features and specifications: MCU – Renesas RE01B Arm Cortex-M0+ microcontroller @ 64 MHz with 1.5MB flash, 256KB SRAM Connectivity Bluetooth LE 5.0 with Long Range (up to 400 m) and high data throughput (2 Mbps) support RF output power – Up to +4 dBm Receiver […]

UP 7000 x86 SBC