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May 10, 2016May 10, 2016 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

OSD3358 SiP Integrates TI Sitara AM3358 SoC, Memory, PMIC, LDO and Passive Components into a Single BGA System-in-Package

Octavo Systems has created a BeagleBone Black reference design that’s exactly like the original board, except for one detail: It’s based on the company’s OSD3358 system-in-package (SiP) that combine Texas Instruments AM3358 Cortex A8 processor with up to 1GB RAM, TI LDO and PMIC, and over 140 passive components into a single 400-ball BGA package. The only three other main components on the reference design are the eMMC flash, Ethernet transceiver and HDMI framer. Key specs of OSD3358 SiP: Texas Instruments AM335x (AM3358 or AM3352) Cortex A8 processor @ 1 GHz 256MB, 512 MB or 1GB DDR3 memory Texas Instruments TPS62217C PMIC Texas Instruments TL5209 LDO Over 140 passive components Package – 400 1.27mm pitch BGA – 27 x 27 mm package size Temperature Range – Base version: 0 to 85°C; Industrial version: -40° to 85° C Some of the advantages of a SiP package over using multiple chips include faster […]

January 5, 2016May 10, 2016 by Jean-Luc Aufranc (CNXSoft) - No Comments

Mediatek Unveils MT2523 SiP for GPS Enabled, Bluetooth LE Wearables

Silicon manufacturers are starting to launch ever more integrated solutions specifically designed for wearables, and after Samsung S3FBP5A bio-processor unveiled a few days ago, MediaTek has launched MT2623 ARM Cortex M4 System-in-Package (SiP) with GPS, Bluetooth LE, and a MIPI DSI interface. Other details are sparse but here’s what the company disclosed for MT2523: MCU core – ARM Cortex M4 GPU – 2D accelerator supporting true colors, per-pixel alpha channel, anti-aliasing fonts, and 1-bit index color to save memory. Connectivity – Dual-mode Bluetooth Low Energy and GPS Display – MIPI DSI and serial interfaces Integrated PMU Battery Life – More than a week (typical) The SiP’s printed circuit board area is said to be 41% percent smaller than competitors’ solutions. MT2523 will be available to manufacturers in H1 2016, and found in active and fitness smartwatches a little later. Thanks to Nanik for the tip. Jean-Luc Aufranc (CNXSoft)Jean-Luc started CNX Software […]

December 7, 2015May 10, 2016 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Renesas R-Car H3 Deca-Core Processor and Driverless Car Roadmap

Renesas has recently unveiled R-Car H3 deca-core processor for automotive applications with four Cortex A57 cores, four Cortex A5 cores, and two Cortex-R7 “dual-lock step” cores for real-time processor, and has part the releases showed the expected roadmap for the implementation of driverless / autonomous cars. Let’s start with the processor (R8A77950) and SiP module (R8J77950) specifications: CPU cores – quad core ARM Cortex-A57, quad core ARM Cortex-A53, and dual lock-step ARM Cortex-R7 cores with respectively 48KB/32KB, 32KB/32KB, and 32KB/32KB L1 instructions/operand cache. GPU – IMG PowerVR Series6XT GX6650 External memory – LPDDR4-SDRAM up to 1600 MHz, data bus width: 32 bits x 4 ch (12.8GB/s x 4) Expansion bus – 2 ch PCI Express2.0 (1 lane) Video Out – 3x display output Input / camera – 8x video inputs Video codec module (H.265, H.264/AVC, MPEG-4, VC-1, etc.) IP conversion module 2x TS Interfaces Stream and Security Processor Video image […]