iBASE IB996 full-size PICMG 1.3 CPU card features Intel Q670E chipset, supports 12th to 14th Gen Intel Core desktop processors

iBASE IB996 CPU Card

The iBASE IB996 full-size PICMG 1.3 CPU card, built on the Intel Q670E chipset, supports 12th to 14th Gen Intel Core desktop processors. It is designed for industrial and embedded applications with dual 2.5GbE LAN, DDR5 support, and extensive I/O options including PCI and PCIe x16 interfaces. We haven’t covered this type of card on CNX Software before, so some basic explanations are needed. PICMG 1.3, or SHB Express, is an industrial standard for System Host Boards (SHBs) supporting PCIe, PCI, and PCI-X interfaces first ratified in 2005 (PCIMG 1.0). It uses a backplane to separate the processing unit from I/O, enabling modular design and easy integration. Commonly used in industrial automation, medical systems, and embedded computing, it ensures compatibility and scalability for high-performance applications. iBASE IB996 CPU card specifications: Supported SoC – 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 desktop processors (LGA1700 socket) based on the Raptor Lake-S […]

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

COM-HPC Mini Academy

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]

Credit card-sized COM-HPC Mini modules to support PCIe Gen4 and Gen5 interfaces

COM-HPC Mini

PICMG has announced that the COM-HPC Mini form factor’s pinout and dimensions definitions were finalized, with the tiny credit card-sized modules able to handle PCIe Gen4 and Gen5 interfaces, of course, depending on whether the selected CPU supports those. The COM-HPC “High-Performance Computing” form factor was created a few years ago due to the lack of interfaces on the COM Express form factor with “only” 440 pins and potential issues to handle PCIe Gen 4 clock speeds and throughputs. So far, we had COM-HPC Client Type modules from 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules with either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 70 mm) credit card-sized form factor to the COM-HPC standard. The way they cut the size of the COM-HPC Size A form factor by half […]

UP 7000 x86 SBC