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October 8, 2021October 8, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

GPU-less NXP i.MX 8XLite Cortex-A35/M4 SoC is aimed at IIoT & V2X applications

NXP i.MX 8XLite SoC is a cost-optimized version of NXP i.MX 8X automotive processor with up to two Cortex-A35 cores, one Cortex-M4F real-time core, and in a GPU-less configuration since it lacks the Vivante GPU found in i.MX 8X family. The headless processor also comes with dedicated Hardware Security Modules (HSM) to enable telematics solutions, vehicle-to-everything (V2X) applications including vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) solutions, road infrastructure connectivity, as well as IIoT applications such as industrial equipment and building automation. NXP i.MX 8XLite key features and specifications: Processor complex 1x or 2x Arm Cortex-A35 cores @ up to 1.2 GHz with 256KB L2 cache with ECC 1x Arm Cortex-M4F core for real-time processing Memory I/F – 16-bit DDR3L-1866 and LPDDR4-2400 with ECC protection Storage I/F 1x FlexSPI for fast boot from SPI NOR flash 2x SD 3.0 card interfaces 1x eMMC5.1/SD3.0 NAND (62-bit ECC support) Networking – 1x Gigabit Ethernet […]

September 4, 2021May 4, 2022 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

NXP i.MX RT500 Cortex-M33 Crossover MCU integrates DSP, 2D GPU for wearables and IoT devices

NXP i.MX RT500 is the second Cortex-M33 Crossover MCU following the NXP i.MX RT600 Series announced in 2018, and optimized for low-power HMI applications such as wearables and Smart Home & IoT devices. NXP Crossover MCUs are typically clocked at 600 MHz or more, but NXP i.MX RT500 Cortex-M33 is limited to 200 MHz, and combined with 200 MHz Tensilica Fusion F1 DSP as well as a 2D GPU, and power optimizations that enable long battery life of up to 40 days on a charge for wearables like smartwatches. NXP i.MX RT500 key features and specifications: MCU Core – Cortex-M33 @ up to 200 MHz with Arm TrustZone, M33 built-in Memory Protection Unit (MPU), PowerQuad hardware accelerator for DSP functions, CASPER crypto coprocessor for asymmetric cryptographic algorithms DSP Core – Cadence Tensilica Fusion F1 DSP @ up to 200 MHz On-Chip Memory Up to 5 MB of system SRAM accessible […]

July 17, 2021September 16, 2021 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

The first Arm SystemReady IR certified platforms – NXP i.MX 8M Mini EVK & Compulab IOT-GATE-IMX8 gateway

A few months ago, we noted SolidRun HoneyComb LX2K became a certified Arm SystemReady ES platform. SystemReady is a certification program by Arm that ensures systems just work with generic operating systems like in the x86 world. When we looked at the details of the program in the article, we noted there were different categories including SystemReady ES for embedded servers and SystemReady IR for IoT Edge applications. The first SystemReady IR platform – NXP i.MX 8 Mini evaluation kit Arm has just announced the first SystemReady IR platform had just been certified. That device is the NXP i.MX 8M Mini EVK, and that means that anyone that uses the i.MX 8M family of devices with the associated Board Support Package (BSP) can build platforms that will pass the same certification process and boot compliant Linux distributions with minimal integration effort. We can see more details about the certifications on Arm developer’s website. NXP i.MX 8M Mini EVK achieved certification with NXP 2021 Q2 pre-release ﬁrmware, version LF […]

June 8, 2021June 8, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP’s Ultra-Wideband (UWB) evaluation kits work with Apple U1 chip

The Fira Consortium was established in 2019 to provide an Ultra Wide-Band (UWB) ecosystem for real-time centimeter accuracy indoor positioning with companies such as NXP Semiconductors and Samsung Electronics on board. More companies have joined since then including Apple which designed its own UWB chip – the Apple U1 – found in recent iPhone 11 & 12 smartphones, as well as Apple Watch Series 6 to enable “Nearby Interaction“. If you’d like to develop UWB-enabled IoT applications, NXP has announced two beta UWB evaluation kits – developed with partners – compatible with Apple U1: Murata Type2BP EVK and MobileKnowledge’s UWB Kit Mobile Edition. Murata Type2BP EVK Specifications: Wireless chips/modules Murata’s Type2BP ultra-small UWB module based on NXP Trimension SR150 Arm Cortex-M chip for IoT devices. 802.15.4z compatible and supports 3D AoA (Angle-of-Arrival) for extra precision. NXP QN9090 Arm Cortex-M4 Bluetooth 5.0 LE SoC with 640 KB flash, 152 KB RAM, […]

March 8, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

NXP unveils i.MX 8ULP Cortex-A35/M33 secure processors with optional Azure Sphere certification

NXP may have just unveiled plans for i.MX 9 processor family with Arm Ethos U65 microNPU, and advanced security using the company’s EdgeLock enclave, but NXP also introduced new members to its popular i.MX 8 series with i.MX 8ULP and i.MX 8ULP-CS (Cloud Secured) processors. Both processors come with a mix of Cortex-A35 application processor(s) and Cortex-M33 real-time core, as well as Energy Flex low-power architecture and EdgeLock secure enclave, but i.MX 8ULP-CS includes Microsoft Pluton for secure cloud connectivity and lacks 2D/3D graphics and the HiFi 4 audio DSP. NXP i.MX 8ULP and 8ULP-CS key features and specifications: CPU i.MX 8ULP – Up to two Arm Cortex-A35 @ 1.0 GHz and Arm Cortex-M33 @ 216 MHz, i.MX 8ULP-CS – One Arm Cortex-A35 @ 1.0 GHz and Arm Cortex-M33 @ 216 MHz GPU (i.MX 8ULP only) – 2D GPU, and 3D GPU with support for OpenGL ES 3.1, OpenCLTM, Vulkan […]

March 5, 2021March 8, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 9 processors to integrate Arm Ethos U-65 microNPU, EdgeLock secure enclave

NXP i.MX 6 and i.MX 8 processors are widely used in industrial boards and systems-on-module, and the company has now teased a new family with i.MX 9 processors integrating Arm Ethos-U65 1 TOPS microNPU, as well as the company’s EdgeLock secure enclave for increased security. The company did not provide that many technical details, so we still don’t know which CPU cores, GPU, and exact peripherals will be found in the processor. But we do know the i.MX 9 processors will be manufactured with a 16/12nm FinFET class of process technology optimized for low power, and features the “Energy Flex” architecture that combines “heterogeneous domain processing (independent applications processor and real-time domains with a separate low-power multi-media domain), design techniques, and process technology to maximize performance efficiency”. That means most blocks of the processor can be turned off for low power audio or CAN networking use cases, and other industrial […]

November 24, 2020November 24, 2020 by Abhishek Jadhav - 7 Comments

Hantro H1 hardware accelerated video encoding support in mainline Linux

With the increasing need for video encoding, there are some breakthrough developments in hardware-accelerated video encoding for Linux. Bootlin has been working on the implementation of Hantro H1 hardware accelerated video encoding to support H.264 encoding on Linux which follows the company’s work on the previously-released open-source VPU driver for Allwinner processors. Hantro H1 Hardware Hantro H1 is a common hardware H.264 encoder, it can also do VP8 and JPEG. It is found in a few ARM SoCs including a lot of Rockchip (RK3288, RK3328, RK3399, PX30, RK1808) and NXP (i.MX 8M Mini). Depending on the version, it can support up to 1080p at 30 or 60 fps. Here we can see different blocks used for encoding. Hantro H1 is a stateless hardware implementation which means it has no microcontroller or firmware running. As can be seen in the diagram, it has a pre-processor that can do things like cropping, […]

October 10, 2020October 10, 2020 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

NXP IW620 2×2 Wi-Fi 6 & Bluetooth 5.1 Chip Targets Gaming, Audio, Industrial and IoT Markets

NXP has announced the IW62X WiFi 6 & Bluetooth 5.1 family of chips designed for high-end gaming, audio, industrial and IoT markets. The family currently consists of IW620 and IW620S parts with respectively PCIe and SDIO host interfaces. Both chips integrate dual-band Power Amplifiers (PAs), Low Noise Amplifiers (LNAs), and switches in order to reduce the board-level BOM (Bill of Materials). IW62X key features and specifications: Wi-Fi 6 (802.11ax) 2×2 Wi-Fi 6 DB (802.11ax) 1024 QAM, 80MHz Peak Throughput: 1.2 Gbps Improved wideband noise & MU-MIMO performance Advanced active channel scanning 802.11s, EasyMesh 802.11mc Bluetooth & Bluetooth Low Energy 5.1 BLE 2Mbps + Long Range BLE direction finding with Angle of Arrival (AoA) and Angle of Departure (AoD) BLE Mesh Antenna support 2×2 5G 1×1 2.4G + BT Multimode energy-efficient support (TWT, Micro AP, TX Power Control, Wi-Fi Direct, BT5.1) Host Interfaces IW620 – PCIe 1.0 IW620S – SDIO 3.0 […]