802.11ax WiFi Aims to Deliver Higher Throughput (Up to 10 Gbps), Better Handle High Density Scenarios

802.11ax WiFi, also known as High-Efficiency Wireless (HEW), aims to improve the average throughput per user by a factor of at least 4 times in dense user environments, with a total bandwidth of 10 Gbps over 2.4 and 5.0 GHz . The new standard is still work in progress and is expected to be published in 2019. 802.11ax WiFi key features include: Backwards compatible with 802.11a/b/g/n/ac Increase 4x the average throughput per user in high-density scenarios, such as train stations, airports and stadiums. Data rates and channel widths similar to 802.11ac, with the exception of new Modulation and Coding Sets (MCS 10 and 11) with 1024-QAM. Specified for downlink and uplink multi-user operation by means of MU-MIMO and Orthogonal Frequency Division Multiple Access (OFDMA) technology. Larger OFDM FFT sizes (4x larger), narrower subcarrier spacing (4x closer), and longer symbol time (4x) for improved robustness and performance in multipath fading environments […]

LabVIEW Now Supports Raspberry Pi 2 & 3, BeagleBone Black with LINX 3.0 Release

LabView is a system-design platform and development environment with a graphical programming syntax that “makes it simple to visualize, create, and code engineering systems”.  It’s often used with National Instruments hardware such as myRIO, but LabView Makerclub has also developed LINX to bring support to Arduino and chipKIT, and with the latest LINX 3.0, support for BeagleBone Black, and Raspberry Pi boards has been added. You’ll need Labview 2014 (Windows only) or greater to work with LINX 3.0, as well as one of the supported development boards. Complete Labview 2014 + board kits are also sold with the  BeagleBone Black Physical Computing Kit and Raspberry Pi 2 Physical Computing Kit both going for $89 on Digilent. LabView files are save in VI format, and the same file can be used on Arduino, BeagleBone Black, and Raspberry Pi board with minor modifications (e.g. GPIO pin number) as shown in the blink […]

National Instruments Introduces NI sbRIO-9651 SoM Based on Xilinx Zynq SoC Running Linux Real-time OS

National Instruments has recently announced NI sbRIO-9651 System on Module (SoM) powered by Xilinx Zynq-7020 dual core Cortex A9 + FPGA SoC, based on LabVIEW RIO architecture used in products such as myRIO, and coming with a complete middleware solution as well as NI Linux Real-Time OS. NI sbRIO-9651 hardware specifications: SoC – Xilinx Zynq-7020 with two ARM Cortex-A9 cores @ 667MHz and Artix-7 FPGA with 85K Logic Cells System Memory – 512MB DRAM Storage – 512MB flash Dedicated processor I/O: Gigabit Ethernet USB 2.0 Host, USB 2.0 Host/Device RS232 (TX/RX) SHDC FPGA I/O: 160 single-ended FPGA I/O Configurable peripherals: Gigabit Ethernet, 3x RS232, 2x RS485, 2x CAN Power Consumption – 3 to 5 Watts (typical) Dimensions – 50.8 x 78.2 mm Temperature range – -40 to 85 °C NI SoM is said to integrate a validated board support package (BSP) and device drivers with the MI Linux Real-time OS. […]

NI myRIO is an Education Platform Powered by Xilinx Zynq-Z7010

National Instruments has been working on a device called NI myRIO, an hardware & software platform that aims at giving engineering students the ability to design real systems quickly for automation, robotics, data logging or embedded systems. The hardware is based on Xilinx Zynq-7010 with a dual-core ARM Cortex-A9 processor and an FPGA with 28,000 programmable logic cells, and features 10 analog inputs, 6 analog outputs, audio I/O channels, and up to 40 lines of digital input/output (DIO). NI myRIO Hardware  Specifications: SoC – Xilinx Zynq-7010 with a dual core Cortex A9 processor and FPGA with 28,000 cells System Memory – Unknown Storage – Unknown Expansion Ports: myRIO exPansion Ports (MXP) – Two identical ports (MXP A and MXP B) with 4 analog inputs, 6 digital inputs/outputs, 2 analog outputs, 1 quad encoder, 3 PWMs, 1 UART, 1 I2C and 1 SPI by default. Ports configuration is customizable with Labview […]

Embedded Systems Outlook and Trends for 2012

National Instruments has recently published a report entitled “Embedded Systems Outlook 2012 – Key Technologies and Methodologies Impacting the Embedded Systems Market” which lists technology and business trends for the development of embedded systems. Here are the key findings: Technologies & Architectures: Embedded Platforms Technology providers are developing components, modules, or even complete embedded platforms (software + hardware) with higher levels of integration and increased functionality to speed up time to market. System-on-Chip (SoC) and System-on-Module (SoM) benefit from this trend and some also embed a FPGA. Reconfigurable Computing Previously, designers chose between low-cost microcontroller or high performance CPU based on the expected performance needs of the embedded system. As cost decreases and performance increases, low cost devices such as control and monitoring systems now often come with more features thanks to the use of programmable logic. This type of flexibility can be achieved by adding an FPGA to the MCU […]

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