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November 13, 2024November 13, 2024 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Graperain G3562 – A Rockchip RK3562 system-on-module and development board

Graperain G3562 is a Rockchip RK3562 quad-core Cortex-A53 system-on-module (SoM) with up to 8GB LPDDR4, up to 128GB eMMC flash suitable for Edge AI, IoT, automation, and consumer electronic applications. The company also provides the G3562 development board for the SoM with an M.2 socket for NVMe SSD, dual Ethernet, WiFi 5 and Bluetooth 5.0, and optional 4G LTE/3G cellular connectivity, plus a MIPI DSI/LVDS display connector, two MIPI CSI camera connectors, three USB 2.0 ports, audio interfaces, and expansion through a 30-pin GPIO header and UART connector. Graperain G3562 SoM GrapeRain G3562 specifications: SoC – Rockchip RK3562 CPU – Quad-core Arm Cortex-A53 quad-core @ 2.0 GHz GPU – Mali-G52-2EE with support for OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.0/1.1 AI accelerator – 1 TOPS (INT8) NPU VPU Encoder – H.264 1920×1080 @ 60fps Decoder – H.265/VP9 4096×2304 @ 30fps; H.264 1920×1080 @ 60fps RAM – 2GB LPDDR4 by default […]

November 7, 2024November 10, 2024 by Sponsored Post - No Comments

Compex Systems Unveils Wi-Fi 7 Modules with Smart Connectors, Enabling Seamless Multi-Link Operation (MLO) Integration on Conventional CPU Platforms (Sponsored)

Compex Systems (Compex), a global leader in wireless communication technology, is taking Wi-Fi 7 to new heights with an innovative connector design for Multi-Link Operation (MLO). This breakthrough enables seamless deployment of MLO across off-the-shelf platforms, including those with Intel x86 and ARM processors (e.g. NXP and Marvell), eliminating the need for custom-made host boards and unlocking the full potential of Wi-Fi 7 features for a wider range of users and applications. Multi-Link Operation (MLO) is a key performance advantage of Wi-Fi 7 (802.11be), setting it apart by allowing the routing and aggregation of throughput across multiple radio links in different frequency bands. It enables data to be routed through the least congested links, improving overall latency and reliability. MLO can also aggregate bandwidths from more than one wireless link, enhancing throughput and network performance. It is ideal for bandwidth-intensive and real-time applications such as 4K/8K video streaming, cloud gaming, […]

November 5, 2024November 5, 2024 by Tomisin Olujinmi - No Comments

M5Stack releases AX630C-powered offline “Module LLM” for local smart home and AI applications

The M5Stack Module LLM is yet another box-shaped device from the company that provides artificially intelligent control without internet access. It is described as an “integrated offline Large Language Model (LLM) inference module” which can be used to implement local LLM-based solutions in smart homes, voice assistants, and industrial control. Module LLM is powered by the AX630C SoC, equipped with 4GB LPDDR4 memory, 32GB storage, and a 3.2 TOPS (INT8) or 12.8 TOPS (INT4) NPU. M5Stack says the main chip has an average runtime power consumption of 1.5W, making it suitable for long-term operation. It has a built-in microphone, speaker, microSD card slot, and USB OTG. The USB port can connect peripherals such as cameras and debuggers, and the microSD card slot supports cold and hot firmware updates. The M5Stack Module LLM joins the list of other offline, on-device LLM-based solutions, such as the SenseCAP Watcher, Useful Sensors’ AI in […]

November 2, 2024 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Seeed Studio’s XIAO MG24 and XIAO MG24 Sense boards target battery-powered Matter and BLE applications

Seeed Studio has added two members to its XIAO family of tiny MCU boards with the XIAO MG24 and XIAO MG24 Sense boards based on Silicon Labs EFR32MG24 multi-protocol wireless SoC and designed for battery-powered Matter over Thread and Bluetooth LE 5.3 applications. Both 21×17.8 mm USB-C boards feature a 78MHz Silabs MG24 Cortex-M33 microcontroller with 256kB SRAM and 1536KB flash, an additional 4MB SPI flash on-board, and 22 pins and pads for GPIO pins, analog inputs, and power signals, plus a reset button and two LEDs. The “Sense” model adds an analog microphone and a 6-axis IMU sensor. XIAO MG24/MG24 Sense specifications: SoC – Silicon Labs EFR32MG24 (EFR32MG24B220F1536IM48-B) MCU cores Arm Cortex-M33 @ 78.0 MHz with DSP instruction and floating-point unit for user application Arm Cortex-M0+ core for wireless Memory – 256 KB RAM Storage – 1536 KB flash Wireless protocols – Matter, OpenThread, Zigbee, Bluetooth Low Energy 5.3, […]

October 22, 2024October 22, 2024 by Tomisin Olujinmi - 1 Comment

Realtek Ameba RTL8730E Cortex-A32 audio streaming module offers a cost-effective solution for wireless audio applications

StreamUnlimited and Realtek Semiconductor Corp have collaborated on the Stream210 audio streaming module based on the Ameba Smart RTL8730E Arm Cortex-A32 chip from the Ameba E series, with support for Wi-Fi 6, Bluetooth 5.3, and Matter for edge computing and IoT solutions. We have looked at previous Ameba IoT products, such as the Ameba RTL8722DM development board, Ameba Arduino, Ameba RTL8195AM module, and the Ameba RTL8710BN. The Ameba Smart chip is the first entry in the series to feature a Cortex-A32 processor. The Stream210 module is aimed at various audio and IoT applications, including digital radios, streaming audio receivers, wireless speakers, smart speakers, home automation products, and Wi-Fi headphones. Other wireless audio modules we’ve covered in the past include the Up2Stream Pro HiFi board, TTGO T9, and 8devices’ Tobufi module. Stream210 specifications: SoC – Ameba Smart RTL8730E dual-core Arm Cortex-A32 processor @ 1.3GHz Memory – 2Gbit RAM Storage – 2Gbit […]

October 21, 2024October 21, 2024 by Debashis Das - No Comments

Quectel BG770A-SN industrial IoT module offers 5G, NB-IoT, and NTN satellite connectivity

Quectel has recently released the BG770A-SN industrial IoT module which comes in an ultra-compact form factor and supports both NTN and TN and features GNSS for positioning functionality. This 5G-ready module also supports iSIM and utilizes the GEO satellite constellation for worldwide coverage. Additionally, the module offers integrated security elements (ISE) and can operate in between the industrial temperature range of -40°C to +85°C. Previously we have written about the Quectel BG95-S5 5G NTN + LTE IoT module which supports NTN satellite (L-band and S-band) plus LTE Cat M1, Cat NB2, and eGPRS as fallback options, designed for applications where continuous connectivity is critical. We have also written about the Quectel CC660D-LS IoT-NTN module, which is an IoT NTN module designed specifically for Skylo’s satellite network. The new BG770A-SN module is a little different from the previous two because it supports LTE Cat M1, LTE Cat NB1/NB2, and NTN over […]

October 18, 2024 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

KAGA FEI ES4L15BA1 is an ultra-small Bluetooth LE 6.0 and 802.15.4 module based on Nordic nRF54L15 SoC

Japanese company KAGA FEI has recently unveiled the incredibly small ES5L15BA1 Bluetooth LE 6.0 and 802.15.4 module based on Nordic Semi nRF54L15 ultra-low-power Cortex-M33 wireless MCU. We had previously covered the u-Blox NORA-B2 which I already found pretty small at 14.3 x 10.4 x 1.9mm, but the ES5L15BA1 module goes a step further measuring just 8.55 x 3.25 x 1.00 mm with an integrated antenna which could make it the world’s smallest Bluetooth LE module. KAGA FEI ES4L15BA1 specifications: SoC – Nordic Semiconductor nRF54L15 MCU cores Arm Cortex-M33 with Arm TrustZone @ 128MHz RISC-V coprocessor for software-defined peripheral Memory – 256KB SRAM Storage – 1.5MB non-volatile memory Wireless Bluetooth 6.0 Data rates – 2Mbps, 1Mbps, 500kbps, 125kbps Features AoA / AoD Channel Sounding 802.15.4 radio for Thread / Zigbee / Matter Nordic Proprietary 2.4 GHz protocol up to 4 Mbps Frequency – 2402 to 2480 MHz +8dBm output power Antenna […]

October 17, 2024 by Sayantan Nandy - 2 Comments

XIAO ESP32S3 for Meshtastic & LoRa devkit features Wio-SX1262 LoRa module

The “XIAO ESP32S3 for Meshtastic & LoRa” is an ESP32-S3 LoRa dev kit that combines an XIAO ESP32S3 board with the tiny Wio-SX1262 LoRa module connected through a board-to-board connector. This compact devkit supports LoRa (862-930MHz), Wi-Fi (2.4GHz), and Bluetooth 5.0 (BLE), with a 5km range for LoRa and a 100m+ range for Wi-Fi/BLE. The kit also has a USB Type-C interface, a built-in power management chip, and multiple I/O options such as IIC, UART, and GPIO. It supports external LoRa antennas and can be extended with XIAO expansion boards for more complex setups. These features make this device suitable for projects such as LoRaWAN gateways, IoT sensors, Meshtastic nodes or routers, and applications where space is limited. XIAO ESP32S3 for Meshtastic & LoRa specifications: SoC – Espressif Systems ESP32 with dual-core Xtensa LX7 microcontroller up to 240MHz Wireless Connectivity LoRaWAN via Semtech LX1262 Output Power – Up to +22 […]