SolidRun Bedrock R7000 Edge AI fanless computer combines an 8-core AMD Ryzen 7840HS/U Zen4 processor and up to three Hailo-8 AI accelerators for artificial intelligence applications in harsh environments with an industrial temperature range of -40ºC to 85ºC. The industrial embedded system comes with up to 64GB DDR5 memory, supports up to three M.2 NVMe SSD, and offers various interfaces such as dual 2.5GbE and four 4K-capable display interfaces using HDMI and DisplayPort. Just like the previous generation mode, the AMD Ryzen Embedded V3000-powered Bedrock V3000 fanless industrial computer, the BedRock R7000 is offered in three different form factors including the 30W and 60W dissipation model with integrated heatsink fins, and a tile variant designed to be fastened to a cold plate on a chassis. Bedrock R7000 Edge AI specifications: SoC – AMD Ryzen 7 7840HS or 7840U octa-core Zen4 processor clocked at 3.8 GHz / 5.1GHz (Turbo) with Radeon […]
Toshiba “MH3 Group (2)” Arm Cortex-M3 MCU supports firmware updates without interrupting operation
Toshiba “MH3 Group (2)” Arm Cortex-M3 microcontrollers come with a 1MB flash memory partitioned into two 512KB partitions to enable firmware updates without interrupting microcontroller operation using an area swap function to rotate to the new firmware seamlessly. The new M3H Group (2) builds upon the M3H Group(1) by expanding the code flash memory up to 1MB, and the RAM capacity from 66KB to 130KB. Both are part of the “TXZ+ Family Advanced Class” manufactured with a 40nm process, and equipped with a 120 MHz Arm Cortex-M3 core as well as various interface and motor control options such as UART, I2C, Advanced Encoder Input Circuit, and Advanced Programmable Motor Control Circuit. Toshiba MH3 Group 2 key features and specifications: CPU core – Arm Cortex-M3 @ 120 MHz with memory protection unit (MPU) Internal oscillator – 10MHz (+/-1%) Internal memory Code flash memory – 512KB to 1024KB (program/erase cycles: up to […]
CompuLab UCM-iMX93 – A miniature NXP i.MX 93 module with WiFi 5 & Bluetooth 5.3
CompuLab UCM-iMX93 is a miniature system-on-module powered by the new NXP i.MX93 Cortex-A55 AI processor family with up to 2GB RAM and 64GB eMMC flash. The tiny 38x28mm features a Gigabit Ethernet PHY, a WiFi 5 and Bluetooth 5.3 wireless modules, and plenty of multimedia, communication, and peripheral interfaces through two 100-pin high-density connectors including display and camera interfaces, USB ports, CAN FD, and up to 79 GPIOs. UCM-iMX93 specifications: SoC – NXP i.MX9352 or i.MX9331 dual-core/single-core Arm Cortex-A55 @ 1.5 GHz (industrial) / 1.7 GHz (commercial) with Arm Cortex-M33 real-time core @ 250 MHz, Arm Ethos U65 microNPU System Memory – 512MB to 2GB LPDDR4 Storage – 8GB to 64GB eMMC flash Networking Gigabit Ethernet PHY Certified WiFi 5 (802.11ac) and Bluetooth 5.3 BLE module (NXP 88W8997) 2x 100-pin 0.4mm pitch high-density UCM connectors Display 4-lane MIPI-DSI up to 1920 x 1080 @ 60Hz 4-lane LVDS up to 1366 […]
UP Squared i12 is a compact Alder Lake-P single board computer
AAEON’s UP Squared i12 is a single board computer with the same dimensions as the UP Squared (Apollo Lake) and UP Squared V2 (Elkhart Lake) boards, and mostly the same ports layout, but powered by a more powerful 12th generation Intel Alder Lake-P processor from a Celeron 7305E up to an Intel Core i7-1270PE. The board comes with up to 8 or 16GB LPDDR5 memory, SATA and NVMe storage support, triple 4K display support through HDMI, DisplayPort and USB-C interfaces, dual Gigabit Ethernet, a few USB boards, and some wafers and headers such as a Raspberry Pi-compatible GPIO header. UP Squared i12 specifications: 12th generation Alder Lake-P SoC: Intel Core i7-1270PE 12-core/16-thread processor @ 3.30GHz / 4.50GHz (Turbo) with 96EU Intel Xe graphics – PBP: 28W, up to 64W MTP Intel Core i5-1250PE 12-core/16-thread processor @ 3.20GHz / 4.40GHz (Turbo) with 80EU Intel Xe graphics – PBP: 28W, up to […]
NXP i.MX 91 single-core Cortex-A55 SoC to power Linux-based cost-optimized edge devices
NXP has just unveiled the NXP i.MX 91 single-core Cortex-A55 processor following the introduction of the i.MX 93 in 2021, and designed for cost-optimized edge devices running Linux. The NXP i.MX 93 processor comes with up to two Cortex-A55 cores, a Cortex-M33 real-time core, and an Ethos U65 microNPU, but targeting entry-level Linux systems, the NXP i.MX 91 processor does without the real-time core and the AI acceleration, while still integrating NXP EdgeLock Secure Enclave, and the company highlights support for multiple wireless connectivity options through companion chips such as the IW612 that supports Wi-Fi 6, Bluetooth 5.2, 802.15.4, and the new Matter protocol. NXP i.MX 91 specifications: CPU – Arm Cortex-A55 running at up to 1.4GHz with 256KB L2 cache System Memory – Up to 2.4GT/s x16 LPDDR4 with Inline ECC Storage 3x SD 3.0, SDIO 3.0, eMMC 5.1 1x Octal SPI including support for SPI NOR and SPI […]
AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications
iWave Systems iW-Rainbow-G57M is a system-on-module (SoM) based on the AMD (Xilinx) Versal AI Edge series of Cortex-A72/R5 SoC FPGAs designed to deliver AI acceleration at relatively low power for demanding applications such as ADAS, robotics, and medical imaging. The module comes with up to 8GB 64-bit LPDDR4, 16GB eMMC Flash, 256MB QSPI Flash, delivers up to 45 TOPS of AI performance, and features eight transceivers that can be used for high-speed Ethernet, PCIe, MIPI DSI/CSI interfaces, and/or others as required by the customer’s specific project. iW-Rainbow-G57M specifications: FPGA SoC – AMD Xilinx Versal AI Edge/Prime SFVA784 package (VE2302, VE2202, VE2102, or VE2002) with Dual Arm Cortex-A72 core processor @ up to 1.6 GHz Dual-core Arm Cortex-R5F Up to 328K Logic cells & 150K LUTs Programmable Network on Chip (NoC) Up to 45 TOPS (INT4) AI compute 8x GTYP Transceivers @ 28.21 Gbps (VE2302 & VE2202 only) Memory – Up […]
The world’s smallest Bluetooth SoC: InPlay NanoBeacon SoC IN100 in 2.0×1.1mm WLCSP package
InPlay has just announced a Wafer Level Chip Scale Package (WLCSP) for its NanoBeacon SoC IN100, making it the world’s smallest Bluetooth System-on-a-Chip (SoC) at just 2.0 x 1.1 x 0.35mm. The NanoBeacon IN100 is not new per se, and we covered the still tiny Bluetooth SoC when writing about Sparkfun NanoBeacon Bluetooth 5.3 module based on the DFN8 package measuring 2.5×2.5mm. The highlights include its low-code/no-code interface and an ultra-low power consumption of below 1 uW. InPlay NanoBeacon SoC IN100 specifications: Memory – 4 KB SRAM + 4 Kbit OTP memory Bluetooth 5.3 compliant Beacon Modes: Proprietary, BT, Google Eddystone, and Apple iBeacon compliant 2.4GHz RF frequency band, MedRadio band (2.36GHz) Programming-free and firmware-less design Long-range transmission: up to several hundred meters Security Authentication of beacon ID Privacy of advertising payload Supply voltage range – 1.1V ~ 3.6V (Single 1.5V coin battery support) Power consumption Sub-uW power consumption for […]
EPIC-ADS7-PUC Alder Lake-S embedded system is made for robotics, automation, healthcare imaging
AAEON EPIC-ADS7-PUC is an embedded system based on an up to 12th Gen Intel Core i7-12700E Alder Lake-S processor and designed for robotics, automation, and healthcare imaging applications. The embedded computer supports up to 32GB DDR5 and two SATA III storage devices, offers three 4K video outputs via HDMI and DisplayPort connectors, one 2.5GbE and three Gigabit Ethernet ports, along with Intel TCC support, up to six USB 3.2 Gen 2 ports, two RS232/422/4485 COM ports, and some SKUs support Intel Time Coordinated Computing (TCC) for real-time control. Key Features: SoC – Intel Core Alder Lake-S processor, up to the 12-core (8P+4E) Core i7-12700E processor clocked at up to 4.8 GHz with Intel UHD Graphics 770; TDP: 65W Chipset – Intel 600 Series Desktop Chipset (R680E/Q670E/H610E) System Memory – Up to 32GB DDR5 4800 via 2x SODIMM socket (16GB max each) Storage – 2x SATA 3 with +5V onboard SATA […]