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Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Renesas RA2A2 Arm Cortex-M23 microcontroller offers high-resolution 24-bit ADC, up to 512KB dual-bank flash

Renesas RA2A2 Arm Cortex-M23 microcontroller offers high-resolution 24-bit ADC, up to 512KB dual-bank flash

Renesas EK-RA2A2 evaluation board

Renesas Electronics RA2A2 Arm Cortex-M23 microcontroller (MCU) group offers a 7-channel high-resolution 24-bit Sigma-Delta ADC, as well as dual-bank flash and bank swap function for an easier implementation of firmware over-the-air (FOTA) updates. The 48MHz MCU also comes with 48KB SRAM, up to 512KB code flash, various interfaces, and safety and security features that make it suitable for smart energy management, building automation, medical devices, consumer electronics, and other IoT applications that can benefit from high-resolution analog inputs and firmware updates. Renesas RA2A2 specifications: MCU core – Arm Cortex-M23 Armv8-M core clocked at up to 48 MHz Arm Memory Protection Unit (Arm MPU) with 8 regions Memory 48 KB SRAM Memory Protection Units (MPU) Memory Mirror Function (MMF) Storage Up to 512 KB code flash memory in dual bank (256 KB × 2 banks); bank swap support 8 KB data flash memory (100,000 program/erase (P/E) cycles) Peripheral interfaces Segment LCD […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Efinix Titanium Ti375 FPGA offers quad-core hardened RISC-V block, PCIe Gen 4, 10GbE

Efinix Titanium Ti375 FPGA offers quad-core hardened RISC-V block, PCIe Gen 4, 10GbE

Efinix Titanium Ti375 RISC-V FPGA SoC

Efinix Titanium Ti375 SoC combines high-density, low-power Quantum compute fabric with a quad-core hardened 32-bit RISC-V block and features a LPDDR4 DRAM controller, a MIPI D-PHY for displays or cameras, and 16 Gbps transceivers enabling PCIe Gen 4 and 10GbE interfaces. The Titanium Ti375 also comes with 370K logic elements, 1.344 DSP blocks, 2,688 10-Kbit SRAM blocks, and 27,53 Mbits embedded memory, as well as DSP blocks optimized for computing and AI workloads, and XLR (eXchangeable Logic and Routing) cells for logic and routing. Efinix Titanium Ti375 specifications: FPGA compute fabric 370,137 logic elements (LEs) 362,880 eXchangeable Logic and Routing (XLR) cells 27,53 Mbits embedded memory 2,688 10-Kbit SRAM blocks 1,344 embedded DSP blocks for multiplication, addition, subtraction, accumulation, and up to 15-bit variable-right-shifting Memory – 10-kbit high-speed, embedded SRAM, configurable as single-port RAM, simple dual-port RAM, true dual-port RAM, or ROM FPGA interface blocks 32-bit quad-core hardened RISC-V block […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on STMicro announces ultra-low-power STM32U0 MCU, unveils 18nm FD-SOI process for STM32 microcontrollers

STMicro announces ultra-low-power STM32U0 MCU, unveils 18nm FD-SOI process for STM32 microcontrollers

STMicro STM32U0 ultra-low-power MCU

STMicro has announced the ultra-low-power STM32U0 Arm Cortex-M0+ microcontroller family running up to 56 MHz that reduces energy consumption by up to 50% compared to previous product generations such as STM32C0 or STM32L0 while targetting SESIP Level 3, PSA-Certified Level 1, and NIST certifications. Separately, the company also introduced a new 18nm FD-SOI manufacturing process for STM32 microcontrollers that will replace the 40nm process currently used. STMicro STM32U0 Cortex-M0+ MCU STMicro STM32U0 key features and specifications: MCU Core – Cortex-M0+ up to 54 MHz with ART accelerator Memory / Storage STM32U031x – 12KB SRAM, 16 to 64KB flash STM32U073x – 40 KB SRAM, 16 to 256 KB flash STM32U083x – 40 KB SRAM, 256 KB flash Display – LCD controller for 8×48 or 4×52 segment displays (STM32U073, STM32U083) Peripherals 3x I2C, 2x SPI, 4x USART, 2x low-power UART. Up to 21x capacitive sensing channels USB – 1x USB 2.0 device […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on Remi Pi is a compact, low-cost SBC powered by a Renesas RZ/G2L Cortex-A55/M33 SoC

Remi Pi is a compact, low-cost SBC powered by a Renesas RZ/G2L Cortex-A55/M33 SoC

Remi Pi SBC

MYiR Tech Remi Pi is a low-cost SBC based on the company’s MYC-YG2LX CPU module featuring a Renesas RZ/G2L Arm Cortex-A55/M33 processor, 1GB RAM,  8GB eMMC flash, and plenty of ports and interfaces. Those include two gigabit Ethernet ports, a wireless module with dual-band WiFi 4 and Bluetooth 4.2 connectivity, HDMI and LVDS display interfaces, MIPI CSI camera input, a 3.5mm audio jack, a few USB ports, and a 40-pin GPIO header compatible with the one on the popular Raspberry Pi SBCs. Remi Pi specifications: System-on-Module – MYiR MYC-YG2L23 module with SoC – Renesas RZ/G2L processor (R9A07G044L23GBG) CPU 1.2 GHz dual-core Arm Cortex-A55 processor 200 MHz Arm Cortex-M33 real-time core GPU – Arm Mali-G31 3D GPU VPU – H.264 decoding/encoding System Memory – 1GB DDR4 Storage – 8GB eMMC flash, 32KB EEPROM PMIC – Renesas RAA215300 power management IC Storage – MicroSD card slot Display interfaces HDMI video output LVDS […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on Allwinner T527 System-on-Module features octa-core Cortex-A55 CPU, 2 TOPS AI accelerator

Allwinner T527 System-on-Module features octa-core Cortex-A55 CPU, 2 TOPS AI accelerator

Allwinner T527 system-on-module

MYiR MYC-LT527 is a compact System-on-Module (SoM) based on Allwinner T527 octa-core Arm Cortex-A55 SoC with a 2 TOPS AI accelerator, up to 4GB RAM, 32GB flash, and a land grid array (LGA) comprised of 381 pads with a range of interfaces for displays and cameras, networking, USB, and PCIe, and more. The company also introduced the MYD-LT527 development board to showcase the capabilities of the Allwinner T527 CPU module suitable for a range of applications such as industrial robots, energy and power management, medical equipment, display and controller machines, edge AI boxes and boards, automotive dashboards, and embedded devices that require media and AI functionalities. MYC-LT527 Allwinner T527 System-on-Module MYC-LT527 specifications: SoC – Allwinner T527 CPU Octa-core Arm Cortex-A55 processor with four cores @ 1.80 GHz and four cores @ 1.42GHz E906 RISC-V core up to 200 MHz DSP – 600MHz HIFI4 Audio DSP GPU – Arm Mali-G57 MC1 […]

Posted on by Debashis Das - No Comments on Avnet MSC C10M-ALN – A COM Express Type 10 Mini Module with Intel Alder Lake-N CPU, LPDDR5 memory

Avnet MSC C10M-ALN – A COM Express Type 10 Mini Module with Intel Alder Lake-N CPU, LPDDR5 memory

MSC C10M ALN COM Express Type 10 Module

Avnet MSC C10M-ALN is a COM Express Type 10 module powered by the Alder Lake-N family of processors including the Intel Core i3, Intel Atom x7000E, and Intel Processor N-Series. The design allows for easy adaptation of applications between various Intel CPU models, ensuring compatibility across different performance and power needs. The module supports up to 16GB LPDDR5 memory with optional In-Band Error Correcting Code(IBECC), eMMC 5.1 storage, and features an Intel i226 2.5GbE controller. It can handle up to two 4K displays through DDI and eDP video outputs, ten USB ports including USB 3.2 Gen 2, and four PCI Express Gen 3 x1 slots for expanded connectivity options. Avnet MSC C10M-ALN Com Express Module Specification: Alder Lake-N SoC (one or the other) Intel Core i3-N305, eight-core, 1.0GHz/1.8GHz, 32EU Intel UHD Graphics, 9/15W, PUC (PC Client Use Conditions) Intel Atom x7425E, four-core, 1.5GHz, 24EU Intel UHD Graphics, TCC, 12W, EUC […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Sapphire Edge+ VPR-4616-MB mini-ITX motherboard features “AMD Embedded+” architecture with Ryzen R2314 & Versal VE2302

Sapphire Edge+ VPR-4616-MB mini-ITX motherboard features “AMD Embedded+” architecture with Ryzen R2314 & Versal VE2302

AMD Embedded+ mini-ITX motherboard

Sapphire Edge+ VPR-4616-MB is a new mini-ITX motherboard on the “new” AMD Embedded+ “architecture” comprised of an AMD Ryzen Embedded R2314 processor and an AMD Versal AI Edge VE2302 adaptive SoC (also called FPGA SoC…). The motherboard supports up to 64GB ECC/non-ECC DDR4 memory for the CPU, 8GB of memory for the adaptive SoC, supports SATA and NVMe storage, dual video output, 2.5GbE networking, and offers a range of USB ports and M.2 sockets for expansion. AMD Embedded+ solutions target sensor fusion, AI inferencing, industrial networking, control, and visualization applications. SAPPHIRE Edge+ VPR-4616-MB specifications: AMD Embedded+ Architecture Adaptive SoC Subsystem Main IC – AMD Versal AI Edge VE2302 with dual Arm Cortex-A72 core processor @ up to 1.6 GHz, dual-core Arm Cortex-R5F, 23 TOPS AI engine, FPGA fabric, etc… System Memory – 2x 4GB LPDDR4 Storage 1Gbit OSPI NOR flash for local boot 64 Kbit EEPROM for Board-ID Expansion 160-pin […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on SAPPHIRE EDGE IPC-FP6 mini-ITX motherboard supports 10GbE networking

SAPPHIRE EDGE IPC-FP6 mini-ITX motherboard supports 10GbE networking

SAPPHIRE IPC-FP6 mini ITX motherboard 10GbE

SAPPHIRE EDGE IPC-FP6 is a mini-ITX motherboard powered by an AMD Ryzen Embedded V2000 SoC with support for 10GbE networking and designed for gaming machines, medical imaging equipment, digital signage, thin clients, or POS terminals. The motherboard also comes with four 4K-capable DisplayPort video outputs, M.2 sockets for storage and wireless, two SATA ports for mass storage, up to eight USB interfaces, a PCIe x8 slot for expansion,  and a combo audio jack. SAPPHIRE EDGE IPC-FP6 specifications: SoC – AMD Ryzen Embedded V2000 AMD Ryzen Embedded V2516 hexa-core/12-thread processor @ 2.1 GHz / 3.95 GHz (Turbo) with 3MB L2 cache, 6 CUs Radeon RX Vega 6 GPU @ 1.5 GHz; TDP: 10-25W TDP (15W default) AMD Ryzen Embedded V2546 hexa-core/12-thread processor @ 3.0 GHz / 3.95 GHz (turbo) with 3 MB L2 cache, 6 CUs Radeon RX Vega 6 GPU @ 1.5 GHz; TDP: 35-54W TDP (45W default) AMD Ryzen […]