Linux News - Page 124 of 457 - CNX Software

January 11, 2022May 31, 2022 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

i.MX 8M Plus solderable LGA module follows OSM Size-L standard

SGET Open Standard Module (OSM) specification was ratified in November 2020. It defined specifications for solderable LGA system-on-modules, and we first noticed it though through the launch of F&S Elektronik “FS 8MM OSM-SF” module powered by an NXP i.MX 8M Mini processor, and following OSM Size-S standard (30x30mm). As we noted in our introduction about the Open Standard Module, SGET defined four sizes from Size-0 (30x15mm) to Size-L (45x45mm), and there’s now at least one “Large” OSM module courtesy of iWave Systems, and their iW-RainboW-G40M module equipped with an NXP i.MX 8M Plus processor for AI applications. iW-RainboW-G40M specifications: SoC- NXP i.MX 8M Plus Q/QL/D quad-/dual-core Cortex-A53 processor up to 2.0 GHz, with Arm Cortex-M7 real-time core @ 800 MHz, Vivante GC7000UL 3D GPU, Vivante GC520L 2D GPU, 2.3 TOPS NPU System Memory – Up to 8GB LPDDR4 Memory Storage – Up to 256GB eMMC flash Wireless – 802.11a/b/g/n/ac/ax Wi-Fi […]

January 11, 2022January 11, 2022 by Jean-Luc Aufranc (CNXSoft) - No Comments

Rockchip RK3568 SBC to power 4G/5G, WiFI 6 connected smart displays, features an optional tuner

Geniatech is back with another Rockchip RK3568 SBC. The K3-3568 single board computer is designed specifically for smart displays with 4G LTE, 5G, or WiFi 6 connectivity, and follows last year’s “Geniatech RK3568 development board” (aka DB3568) offered as a full-featured development kit for Rockchip RK3568 SoC. K3-3568 SBC ships with up to 8GB RAM, up to 64GB eMMC flash, and offers multiple display interfaces with HDMI, MIPI DSI, LVDS, eDP, plus and an internal HDMI input connector, as well as support for an optional DVB-T2, ISDB-T, DMBT, or ATSC digital tuner. Geniatech K3-3568 specifications: SoC – Rockchip RK3568 quad-core Cortex-A55 processor up to 1.5/2.0 GHz with Arm Mali-G52 GPU supporting OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, 0.8 TOPS NPU for AI acceleration System Memory – 2GB, 4GB, or 8GB LPDDR4 Storage 16GB, 32GB, or 64GB eMMC 5.1 flash MicroSD card slot M.2 socket for NVMe SSD (See expansion […]

January 10, 2022February 1, 2022 by Jean-Luc Aufranc (CNXSoft) - No Comments

Linux 5.16 Release – Main Changes, Arm, RISC-V and MIPS architectures

Linus Torvalds has just announced the release of Linux 5.16: Not a lot here since -rc8, which is not unexpected. We had that extra week due to the holidays, and it’s not like we had lots of last-minute things that needed to be sorted out. So this mainly contains some driver fixes (mainly networking and rdma), a cgroup credential use fix, a few core networking fixes, a couple of last-minute reverts, and some other random noise. The appended shortlog is so small that you might as well scroll through it. This obviously means that the merge window for 5.17 opens tomorrow, and I’m happy to say I already have several pending early pull requests. I wish I had even more, because this merge window is going to be somewhat painful due to unfortunate travel for family reasons. So I’ll be doing most of it on the road on a laptop […]

January 7, 2022 by Sponsored Post - No Comments

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

January 7, 2022January 25, 2022 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Horizon X3 AI development board is powered by Sunrise 3 AI Edge Arm processor

Horizon X3 AI development board is powered by Horizon Robotics Sunrise 3 (aka X3) quad-core Cortex-A53 processor with a 5 TOPS NPU, and multiple camera support with the chip apparently designed for the automotive industry. [Update January 25, 2022: A third-party company, Finsbury Glover Hering, claiming to represent Horizon Robotics informed CNX Software the chip is not designed for the automotive market, and that Horizon’s AIoT business is actually limited to the domestic China market and not overseas.] The devkit is comprised of a Sunrise 3 system-on-module with 1GB LPDDR4 & 16GB EMMC memory, as well as a baseboard with Gigabit Ethernet and WiFi, HDMI up to 1080p60 and MIPI DSI interface, a camera interface, and a 40-pin header for expansion. Horizon X3 AI development board specifications: SoC – Horizon Robotics Sunrise 3 quad-core Cortex-A53 processor @ 1.2 GHz, one Cortex-R5 core, a 5 TOPS NPU (2x “Bernoulli” BPU) System […]

January 5, 2022February 18, 2023 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

January 4, 2022 by Jean-Luc Aufranc (CNXSoft) - 15 Comments

The Linux kernel could soon be 50 to 80% faster to build

The Linux kernel takes around 5 minutes (without modules) to build on an Intel Core i5 Jasper Lake mini PC with 16 GB RAM and a fast SSD based on our recent review of Beelink GTi 11 mini PC. Kernel developers may have to build for different targets and configurations, plus all modules so the build times may add up. While it is always possible to throw more hardware to quicken the builds, it would be good if significantly faster builts could be achieved with software optimizations. That’s exactly what Ingo Molnar has been working on since late 2020 with his “Fast Kernel Headers” project aiming to eliminate the Linux kernel’s “Dependency Hell”. At the time he aimed for a 20% speedup, but a little over one year later, the results are much more impressive with 50 to 80% faster builds depending on the target platform (x86-64, arm64, etc…) and […]

December 31, 2021December 31, 2022 by Jean-Luc Aufranc (CNXSoft) - 16 Comments

Year 2021 in review – Top 10 posts and statistics

As per tradition, we’ll look back at what happened during the year in the last post, and see what 2022 may have in store, plus the usual statistics from CNX Software website. The biggest story of 2021 has to be the worsening of semiconductors shortages with extremely long lead times, prices of some components going up multiple folds, constant complaints on Twitter about availability and prices. I think I even saw a website, hopefully misconfigured, showing an estimated availability of a specific STM32 MCU in 2037. This also gave rise to opportunities and board redesigns, with MotorComm Ethernet chips replacing some Realtek chips in SBCs such as NanoPi R2C and Orange Pi R1S Plus LTS, and CH9102F showing up as a replacement for CP2104 in some IoT boards. We also got some interesting Arm processors, but sadly the high-expected Rockchip RK3588 got delayed by another year, although it’s getting really […]