What comes after Qualcomm Robotics RB3, RB5, and RB6 platforms? Apparently, it’s Qualcomm Robotics RB1 and RB2 platforms powered by Qualcomm QRB2210 and Qualcomm QRB4210 processors respectively and optimized for cheaper, smaller robots with lower power consumption. But Qualcomm is one of the lamest companies known to man, so they did not include any photos when announcing the Robotics RB1 and RB2 platforms, so I’ll focus this post on Lantronix Open-Q 2210RB and 4210RB system-in-packages (SiP) based on the same processors, as well as the Open-Q RB1/RB2 development kit. Open-Q 2210RB and 4210RB SiP The new system-in-packages are very similar to the earlier Open-Q 2290CS and 4290CS SIPs for industrial IoT and machine vision applications, with the only difference being the Qualcomm processor used, so I invite you to read the earlier post for the full details, and I’ll just provide summaries here. Open-Q 2210RB key features: SoC – Qualcomm […]
Qualcomm-based Open-Q 2290CS and 4290CS SIPs target industrial IoT and machine vision applications
Lantronix has just unveiled two new System-in-Packages (SiP) with the entry-level Open-Q 2290CS SIP based on Qualcomm QCS2290 quad-core Cortex-A53 processor designed for industrial IoT applications and safety vehicle equipment control, and the pin-compatible, mid-range Open-Q 4290CS SIP based on Qualcomm QCS4290 octa-core Kryo 260 CPU for applications requiring artificial intelligence and machine learning capabilities. The Open-Q 2290CS module comes with 2GB LPDDR4, 16GB eMMC flash, WiFi 5 and Bluetooth 5.0 connectivity, while the Open-Q 4290CS module is equipped with up to 6GB LPDDR4, up to 256GB eMMC flash., and Wi-Fi 5 with some Wi-Fi 6 features (TWT & 8SS), and Bluetooth 5.1. Lantronix also offers the Open-Q AL2 development kit supporting either both SIP modules for evaluation and rapid prototyping. Open-Q 2290CS – Qualcomm QCS2290 SiP Specifications: SoC – Qualcomm QCS2290 quad-core Cortex-A53 processor at up to 2.0 GHz with Adreno 702 GPU at 845 MHz with support for […]
Qualcomm Snapdragon 8 Gen 2 SoC gets upstream Linux support
Qualcomm unveiled the Snapdragon 8 Gen 2 mobile platform just a few days ago, but Linaro has just announced that Linux was already upstreamed to the premium mobile SoC featuring a 3.2 GHz Arm Cortex-X3 “Prime” core, four performance cores at up to 2.8 GHz, and three Efficiency cores clocked at up to 2.0 GHz. Most of the work was done by Linaro Engineers Abel Vesa and Neil Armstrong with initial support posted on November 16th on the Linux kernel mailing list, and with the set of patches released so far, it is even possible to boot a minimal AOSP image on a Snapdragon 8 Gen 2 development kit shown below which should be manufactured by Lantronix, if history is any guide. The following features are enabled in mainline Linux for the Qualcomm 8 Gen 2 processor, codenamed SM8550: Qualcomm Kryo CPUs with DVFS and Power Control support System – […]
Lantronix G520 cellular gateways target industrial communication, cybersecurity, and transportation
Lantronix G520-series 4G LTE Cat 4 and 5G cellular gateways are designed to address challenges in Industry 4.0, security, and transportation markets with three/four separate gateways all based on an unnamed ARM926EJ-S-based CPU running at 600 MHz that’s most likely Microchip SAM9X60 processor introduced in 2020. All gateways are from the same base with variation for specific markets: G526 Industrial Gateway with LTE Cat 4 Ethernet, Serial, I/O, Fieldbus conversion, and other industrial protocols G527/G528 Security Gateway with LTE Cat 13 or 5G, built-in cryptographic secure element and PSE-PoE G528 Transportation Gateway (coming soon) with LTE Cat 4, GNSS, accelerometer, CAN Bus reading, and other tracking features Lantronix G520-series specifications: SoC – ARM926EJ-S-based processor running at 600 MHz with 32 KB instruction cache and 32KB data cache System Memory – 256MB DDR2 SDRAM Storage – 8MB SPI flash for OS, 256MB parallel NAND flash, MicroSD slot, or USB flash drive […]
Qualcomm QRB5165 system-on-module is made for robotics applications
Lantronix Open-Q 5165RB is a tiny System-on-Module (SoM) based on the same Qualcomm QRB5165 octa-core IoT processor we’ve just seen in Qualcomm Flight RB5 5G Platform high-end drone reference design. The ultra-compact (50x29mm) module comes with 8GB LPDDR5, 128GB UFS flash, multiple MIPI camera and display ports, WiFi 6 and Bluetooth 5.1, and various I/Os. Lantronix Open-Q 5165RB module specifications: SoC – Qualcomm QRB5165 SoC built on 7nm technology with Octa-core CPU with 1x Kryo Gold prime @ 2.84 GHz, 3x Kryo Gold @ 2.42 GHz, 4x Kryo Silver @ 1.81 GHz Hexagon 698 DSP with quad Hexagon Vector eXtensions Adreno™ 650 GPU @ up to 587 MHz Spectra 480 Image Signal Processor Adreno 665 Video Processing unit – Decode up to 4K240/8K60, Encode up to 4K120/8K30, Concurrent 4K60 decode & 4K30 encode for wireless display NPU230 Neural Processing unit SPU240 Secure Processing unit Up to 15 TOPS of combined […]
Snapdragon 888 Mobile Hardware Development Kit ships with 12GB RAM, 256GB UFS storage
Snapdragon 888 is the latest premium mobile SoC from Qualcomm with the octa-core processor combining one Cortex-X1 core, three Cortex-A78 cores, and four low-power Cortex-A55 cores, with Adreno 660 GPU and Snapdragon X60 5G modem. The processor will likely most be found in smartphones, but Qualcomm partnered with Lantronix to launch the Snapdragon 888 Mobile Hardware Development Kit designed for Android app developers, hardware vendors, and original equipment manufacturers (OEMs). Snapdragon 888 development board specifications: SoC – Qualcomm Snapdragon 888 (SM8350) octa-core Qualcomm Kryo 680 CPU with 1x Cortex-X1 core @ 2.84 GHz, 3x Cortex-A78 cores @ 2.42 GHz, and 4x Cortex-A55 cores @ 1.80 GHz, Adreno 660 GPU with support for OpenCL 2.0 FP, OpenGL ES 3.2, Vulkan 1.1, DX12, and up to 8K 360 VR video playback, Hexagon 780 DSP System Memory – 12GB LPDDR5 PoP memory Storage – 256GB UFS 3.0 flash, 1x MicroSD/UFS card Display HDMI […]
Qualcomm QCS610 micro SoM and devkit to power AI and ML smart cameras
Last July, we missed Qualcomm’s announcement of QCS410 and QCS610 processors designed to bring “premium camera technology, including powerful artificial intelligence and machine learning features formerly only available to high-end devices, into mid-tier camera segments”. The new SoC’s were recently brought to our attention by Lantronix as they have just introduced a new Open-Q 610 micro system-on-module (μSOM) based on Qualcomm QCS610 processor, as well as a development kit designed to bring such smart cameras to market. I first got a bit confused by the product name, but this goes without saying that it is completely unrelated to Qualcomm Snapdragon 610 announced over six years ago. Open-Q 610 micro system-on-module Open-Q 610 specifications: SoC – Qualcomm QCS610 CPU – Octa-core processor with 2x Kryo 460 Gold cores @ 2.2 GHz (Cortex-A76 class), and 6x Kryo 430 Silver low-power cores @ 1.8GHz (Cortex-A55 class) GPU – Qualcomm Adreno 612 GPU @ […]
Lantronix Open-Q 865XR SoM Brings Snapdragon XR2 Processor Beyond Virtual Reality
Qualcomm Snapdragon XR2 (SXR2130P) is the latest and most powerful virtual & extended reality processor from the company and Facebook recently announced it would be found in their Oculus Quest 2 standalone VR headset. But it now looks like the processor will be used well beyond virtual reality applications as Lantronix has unveiled a Snapdragon XR2 SoM with Open-Q 865XR system-on-module designed for AI boxes, video conference systems, multi-camera systems, machine vision platforms, advanced high-resolution multi-display systems, medical imaging, and handheld data collectors. Open-Q 865XR SoM Open-Q 865XR SoM specifications: SoC – Qualcomm SXR2130P (Snapdragon XR2) Octa-core processor with 1x Kryo Gold prime @ 2.84 GHz + 3x Kryo Gold @ 2.42 GHz + 4x Kryo Silver @ 1.81 GHz Adreno 650 GPU @ up to 587 MHz Hexagon 698 DSP with quad Hexagon Vector eXtensions Spectra 480 Image Signal Processor Adreno 665 Video Processing unit for decode up to […]