While typically taking place in Brussels, Belgium, FOSDEM 2022 will take place online just like FOSDEM 2021 due to COVID-19 restrictions. The good news is that it means anybody can attend it live from anywhere in the world, and makes it more like “FOSDIM”, replacing European with International, in “Free and Open Source Developers’ European Meeting”. FOSDEM 2022 will take place on February 5-6 with 637 speakers, 718 events, and 103 tracks. I’ve made my own little virtual schedule below mostly with sessions from the Embedded, Mobile and Automotive devroom, but also other devrooms including “Computer Aided Modeling and Design”, “FOSS on Mobile Devices”, “Libre-Open VLSI and FPGA”, and others. Saturday, February 5, 2022 12:30 – 13:00 – Five mysteries in Embedded Linux by Josef Holzmayr Once you start out in embedded Linux, there is a lot to do. Some things are obvious, some less so. First and foremost, […]
PB-03 – A Bluetooth LE 5.2 module for the Smart Home, wearables, IoT, etc… (Sponsored)
What changes does Bluetooth LE 5.2 (BLE 5.2) bring? Maybe PB-03 module can tell you. PB-03 is a BLE module developed by Shenzhen Ai-Thinker Technology based on PHY+ PHY6252 32-bit microcontroller (see PDF datasheet) that offers high integration and low power consumption down to 0.3uA in OFF mode, and is well suited to various applications such as IoT, mobile devices, wearable electronic devices, and smart homes. PB-03 module’s highlights Ai-Thinker PB-03 provides an upgrade to earlier PB-01/02 modules with the following highlights: MCU – PHY6252 microcontroller with 256KB flash, 64KB SRAM Supports BLE 5.2 and Bluetooth Mesh Equipped with an on-board PCB antenna Up to 2 Mbps data rate I/Os – UART, PWM, ADC, I2C, SPI, PDM, DMA, and up to 19 IOs. Security – AES-128 encryption hardware Power consumption (PHY6252) 0.3uA @ OFF Mode (IO wake up only) 1uA @ Sleep Mode with 32KHz RTC 3.5uA @ Sleep Mode […]
Wiliot Starter Kit for retailers features a smart coffee cup tracking temperature, fill level, location, etc…
Wiliot Starter Kit aims to demonstrate the ability of the Wioliot’s self-powered IoT Pixel and cloud services to retailers with a kit including a Coffee cup that’s capable of tracking liquid temperatures, fill level, motion, location changes, humidity, and proximity. The kit was previously only available to larger retailers through a “controlled release model”, but the company has now switched to an “open model” so that any retailers can use the technology to track products and packages. Let’s what’s included inside the start kit, and try to understand how the Wiliot solution works. Wiliot Starter Kit includes the following hardware: 1 x IoT Pixel-ready Coffee Cup 5 x Single-Band IoT Pixels mounted on cardboards 5 x Dual-Band IoT Pixels mounted on cardboards 1 x Single-Band Bridge Device 1 x Dual-Band Bridge Device You’ll also get 6 months of Wiliot Cloud Services, access to the Wiliot community forum & support Portal, […]
5-minute Cybersecurity Survey for IoT Device Manufacturers (Sponsored)
Calling all software developers, hardware designers, product security engineers, QA, engineering managers, and executives in the field to participate in a global, industry-wide survey. With nearly 50 new CVEs found every day in 2021, 90% of hospitals hacked, and cybersecurity attacks constantly in the headlines, it’s time to take stock of security preparedness in IoT. Timesys, an industry pioneer in embedded software and cybersecurity for embedded, is taking on that challenge. And to get a better understanding of where IoT device manufacturers are in their cybersecurity journey, Timesys has launched a global, industry-wide survey. The entire survey is only ten questions and should take under five minutes to answer. The survey includes driving factors for security, security processes being implemented, specific technologies being used, security challenges companies are facing, and more. It’s designed to be a broad survey, geared toward developers, security teams, and engineering managers. Take the survey here. […]
OnLogic unveils Karbon 800 Series Alder Lake-S embedded computers
We’ve already seen the newly announced Intel Alder Lake-S desktop IoT processors in some COM Express and COM HPC modules, and quickly mentioned Vecow ECX-3000 rugged computer, and now, OnLogic has just announced the Karbon 800 Series, a family of Alder Lake-S embedded computers. There will be four Karbon 800 models at launch, equipped with up to an Intel Core i9 16-core processor, 64 GB of DDR4 ECC or non-ECC memory, as well as single and dual PCIe Gen 4 slots, and optional “ModBay” hot-swappable bays to add connectivity and storage option up to a six 2.5-inch SSD RAID array or 14 Ethernet ports. All four Karbon 800 embedded computer supports the same processor and memory options, and mostly differ in their storage and expansion options: Karbon 801 Storage – Support for NVME Storage Expansion – 4G Cellular, Wi-Fi, Bluetooth Karbon 802 Storage – 2x 2.5-inch SSD with optional Hot […]
A comparison of ESP32-S3, ESP32-C3 and ESP8266 modules
The ESP32-S3 chip is equipped with an Xtensa 32-bit LX7 dual-core processor clocked at up to 240 MHz, supports 2.4 GHz Wi-Fi and Bluetooth 5 LE, and boasts AI instructions, as well as a reliable security encryption engine, specially built for the AIoT market. Modules based on the ESP32-S3 processor bring many benefits to designers with support for Bluetooth Long Range mode, plenty of resources with 512 KB SRAM (TCM), 45 programmable GPIO pins, and rich communication interfaces. They can also handle high-speed Octal SPI flash with higher capacities, as well as off-chip PSRAM. So, what are the differences between the new ESP32-S3 modules, and typical ESP32-C3 and ESP8266 modules? Let’s find out. Jean-Luc Aufranc (CNXSoft)Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011. www.cnx-software.com
Wi-Fi 6 Release 2 adds support for uplink multi-user MIMO, improves power management
The Wi-Fi Alliance has just announced Wi-Fi 6 CERTIFIED Release 2 with new features that support increasing device and traffic density, and improve power management with Wi-Fi devices and applications. There are two main changes to the standard: Support for uplink multi-user multiple input, multiple output (multi-user MIMO) which will help with video conferencing, faster uploads, more reliable gaming, and IoT use cases. Power management features that will mostly provide benefit smart home, smart city, and Industrial IoT (IIoT) environments Broadcast target wake time (TWT) Extended sleep time Dynamic multi-user spatial multiplexing power save (SMPS) That means there are now three Wi-Fi 6 standards with the original WiFi 6, WiFi 6E, and the new WiFi 6 Release 2. The good news is that the new Release appears to be backward compatible with both WiFI 6 and WiFi 6E and several companies provided quotes for the press release saying how grateful […]
Intel unveils Alder Lake desktop and mobile IoT processors
Intel introduced high-end Alder Lake Hybrid processor family for consumer devices a couple of months ago, with Pentium G7400 and Celeron G6900 leaking a few weeks later, and now the company has formally announced the Alder Lake-S and Alder Lake-H processor families for respectively desktop IoT and mobile IoT solutions, as well as more efficient U-series and P-series of 12th Gen Intel Core Alder Lake IoT processors with a TDP ranging from 15W to 28W. Alder Lake S-Series desktop processors for IoT Key features and specifications: CPU Up to 16 cores, up to 24 threads in IoT SKUs Up to 30 MB Intel Smart Cache TDP – 35W to 65W Real-time capability on select SKUs Graphics/Video Intel UHD Graphics 770 driven by Intel Xe architecture with up to 32 EUs Up to four independent displays up to 4K or one display at 8K resolution Up to two video decode boxes […]