intrinsyc News - CNX Software - Embedded Systems News

February 25, 2020 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Lantronix Snapdragon 865 Development Kit to Support Android 11

If you ever wanted to develop applications for the latest Qualcomm Snapdragon processor, Intrinsyc is always the first company to provide Snapdragon hardware development kits and we’ve covered many over the years including Open-Q 845 HDK and Open-Q 855 HDK. The company has recently been bought by Lantronix, a provider of solutions for the Internet of Things (IoT) and Out of Band Management (OOBM), and we covered one of their products – an RJ45 connector running Linux – over 6 years ago. Lantronix Snapdragon 865 Mobile Hardware Development Kit is the first devkit announced since the acquisition. The board is powered by the latest Snapdragon 865 (SM8250) processor combined with 6GB LPDDR5 RAM, 128GB UFS 3.0 storage. The development kit currently supports Android 10, but it will be one of the first hardware to officially run Android 11 just previewed by Google. Snapdragon 865 Mobile HDK specifications: SoC – Qualcomm […]

June 12, 2019 by Jean-Luc Aufranc (CNXSoft) - No Comments

Intrinsyc Open-Q 820Pro SoM Comes with a Faster Snapdragon 820E Processor, 4GB RAM

Intrinsyc Open-Q 820 system-on-module was introduced in 2017 with a Qualcomm Snapdragon 820 processor, 3GB RAM, and a built-in wireless module for 802.11ac WiFi 5, and Bluetooth 4.1 connectivity. The company has now announced an almost identical ultra-compact module but based on Qualcomm Snapdragon 820E and featuring 4GB RAM. Open-Q 820Pro μSoM is a drop-in replacement for Open-Q820 requiring only some software changes. Snapdragon 820E is said to deliver 9% faster CPU and 5% faster GPU speeds at the same power consumption compared to Snapdragon 820. Open-Q 820Pro μSoM specifications: SoC – Qualcomm Snapdragon 820E (APQ8096SG) Embedded Platform with four Kryo cores including 2x cores @ up to 2.342GHz, and 2x cores @ up to 1.6GHz, Adreno 530 GPU @ 652.8 MHz, Hexagon 680 DSP @ 825 MHz System Memory – Dual-channel 4 GB LPDDR4 @ 1866 MHz (PoP) Storage – 32 GB UFS 2.0 1-lane gear3 flash Connectivity Pre-certified […]

May 29, 2019 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Intrinsyc Launches Open-Q 212A SoM & Qualcomm Home Hub 300 Development Kit

Intrinsyc has just announced the availability of the Open-Q 212A system-on-module and Home Hub Development Kit based on Qualcomm Home Hub 300 Platform powered by the Qualcomm APQ8009 SoC better known as Snapdragon 212. The module supports multi-mic beamforming, audio canceling, HiFi audio, as well as WiFi 5 and Bluetooth connectivity, which makes it suitable for integration into cost-sensitive home hub, home automation, and smart audio devices featuring voice control, AI, and wireless connectivity. Open-Q 212A system-on- module Open-Q 212A SoM, which should not be confused with the company’s Open-Q 212 SBC released two years ago, features for the following specifications: SoC – Qualcomm Snapdragon 212 processor (APQ8009) quad-core Arm Cortex-A7 @ 1.267GHz with Adreno 304 GPU, Qualcomm QDSP6 DSP System Memory – 1GB LPDDR3 RAM Storage – 4GB eMMC Flash storage Video – 720p@30fps playback; up to 720p playback with H.264 (AVC) and H.265 (HEVC); up to 720p H.264 […]

April 24, 2019 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Intrinsyc Open-Q 855 Snapdragon 855 Development Board Launched for $1,149

When we wrote about Qualcomm Snapdragon 855 Hardware Development Kit last month, and while it was not available at the time, we expected it to eventually be sold through Intrinsyc. And sure enough, the company is now taking orders for the very first Snapdragon 855 development board sold under the “Open-Q 855” name. Price tag: $1,149 for the board only. The expansion board and display pictured below are not included by default and sold separately We already had a pretty good idea of the technical details last month, but Intrinsyc has provided us with the missing bits of information for Snapdragon 855 HDK specifications: SoC – Qualcomm Snapdragon 855 Octa-core processor with 1x Kryo 485 Gold Prime core at up to 2.7+ GHz, 3x Kryo 485 Gold cores at up to 2.4+ GHz, and 4x Kryo 485 Silver low-power cores at up to 1.7 GHz, Adreno 640 GPU, Hexagon 690 […]

December 21, 2018December 21, 2018 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Intrinsyc Qualcomm Flight Pro Development Kit Targets High-end Drones and Robotics

Intrinsyc is known for manufacturing and selling mobile development platforms (MDP) & hardware development kits (HDK) for Qualcomm Snapdragon processors, but this time the company is taking pre-orders for a slightly different Qualcomm development platform: Qualcomm Flight Pro development kit / reference design that targets the development of high-end drones and robotics projects. Qualcomm Flight Pro board specifications: SoC – Qualcomm Snapdragon 820 (APQ8096) with quad core Kryo processor @ up to 2.15GHz, Adreno 530 GPU, and Hexagon 680 DSP System Memory – 4GB LPDDR4 RAM Storage – 32GB UFS Flash storage, microSD card slot Wireless Connectivity – WiFi 5 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.2 via pre-certified QCA6174A module + 2x Wi-Fi/BT antennas Location Technology Integrated GNSS solution based on WGR7640 (not recommended for flight applications) Support for U-blox MAX-M8Q-0-00 external GNSS module with high performance antenna and shielding Sensors – Dual IMU (2x Invensense MPU9250): […]

November 16, 2018November 16, 2018 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

Intrinsyc Open-Q 605 SBC is Powered by Qualcomm QCS605 IoT Processor

Qualcomm QCS603 / QCS605 “Internet of Things” processors were announced last spring as the first “Qualcomm Vision Intelligence Platforms” from the company and designed for artificial intelligence and computer vision applications. Both SoCs are octa-core processor with two performance Kryo 300 Gold cores, and six efficiency Kryo 300 Silver cores, but QCS605’s big cores are clocked at a higher 2.5 GHz frequency, and the processor comes with better 802.11ac Wave2 WiFi, support for up to 32MB camera, and 4K video capture. However so far, there was no development platform publicly available, and this has just changed with Intrinsyc announcing Open-Q 605 single board computer (SBC) and development kit featuring Qualcomm QCS605 vision intelligence platform. Open-Q™ 605 SBC Specifications SoC – Qualcomm QCS605 octa-core processor with 2x high-performance Kryo 300 Gold cores up to 2.5 GHz, 6x low-power Kryo 300 Silver cores up to 1.7 GHz, Hexagon 685 DSP with Hexagon vector […]

November 12, 2018 by Jean-Luc Aufranc (CNXSoft) - No Comments

Intrinsyc Open-Q 670 HDK Development Kit Features Snapdragon 670 Processor

Qualcomm introduced the Snapdragon 670 this August with improved camera capabilities and improved performance, including a near doubling of the performance of the AI Engine over the one in Snapdragon 660. Intrinsyc is normally the first company to launch mobile development platform for Qualcomm processor, and this time is no exception, as the company has just introduced Open-Q 670 HDK Development Kit with Snapdragon 670 Mobile Platform. Open-Q 670 HDK specifications: SoC – Qualcomm Snapdragon SDA670 Octa-core 64-bit Kryo 360 processor with 2x high-performance Gold cores @ 2.016 GHz, 6x low-power Silver cores @ 1.708 GHz, Qualcomm Adreno 615 GPU @ 430 MHz, and Qualcomm Hexagon 685 DSP dedicated for Computer Vision and Video Post Processing System Memory – 6GB LPDDR4x RAM Storage – 64GB eMMC 5.1 Flash Storage (non-PoP memory) + uSD card socket Display MIPI DSI connector with 1x 4-lane DSI port + Touch for included LCD panel […]

June 27, 2018June 27, 2018 by Jean-Luc Aufranc (CNXSoft) - No Comments

Snapdragon Wear 2500 Launched for the 4G LTE Kid Watch Market

Qualcomm has made several announcements at Mobile World Congress Shanghai 2018. We’ve already covered Snapdragon 632, 639, and 629 processors for mid- and high-tier smartphones, but the company has also finally announced a new SoC for wearables succeeding Snapdragon Wear 2100. Meet Snapdragon Wear 2500, specifically targeting 4G children watches. Qualcomm is usually not the best company when it comes to releasing technical details about their processors, but here what Snapdragon Wear 2500 specifications should look like: Processor – 4x Arm Cortex A7 GPU – Adreno-class GPU Connectivity – Fifth generation 4G LTE modem with RF front-end (RFFE), location engine, “Bluetooth streaming architecture”, NXP NFC solution Camera I/F – 5MP Ultra-low power sensor hub working with InvenSense sensors Power – Wearable PMIC reducing Rock Bottom Sleep Current (RBSC) by percent, charger, fuel gauge Compact package Snapdragon Wear 2500 is designed for low power with up to 14 percent longer battery […]