intel News - Page 9 of 44 - CNX Software

August 19, 2021 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

RealSense end-of-life – Intel is phasing out its RealSense 3D depth cameras

We covered Intel Realsense technology ever since it was unveiled at CES 2014 with a 3D depth camera and Nuance Dragon Assitant voice technology for various AI applications including robotics, digital signage, and 3D scanners. Our last post was in January 2021 about a Rockchip RK3399 based industrial-grade 3D vision camera together with Intel’s announcement of RealSense ID facial authentication. But RealSense is going away according to a report by CRN explaining Intel was phasing out RealSense AI depth cameras. The email from Intel reads in part: We are winding down our RealSense business and transitioning our computer vision talent, technology and products to focus on advancing innovative technologies that better support our core businesses and IDM 2.0 strategy … We will continue to meet our commitments to our current customers and are working with our employees and customers to ensure a smooth transition The transition will be orderly as […]

August 5, 2021December 22, 2021 by Jean-Luc Aufranc (CNXSoft) - 11 Comments

Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

A System-on-Module (SoM), also known as a Computer-on-Module (CoM), is a small board with the key components of a computer such as SoC, memory, and possibly others components such as PMIC (Power Management IC), an Ethernet PHY, as well as one or more connectors used to connect to a baseboard, also called carrier board, which features standard ports such as Ethernet (RJ45), USB ports, SATA, power jack and so on. The advantages of using of baseboard + SoM design compared to a single board are at least twofold: Most of the PCB design complexity is often around the CPU/SoC and high-speed buses connected to the CPU/SoC. So you could buy an SoM, design your own baseboard and get a complete design relatively in a short amount of time, with reduced development resources and costs. The design is modular, so you could easily upgrade from one SoM to another one. For […]

July 29, 2021July 29, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

25-45W Intel Tiger Lake-H Xeon, Core, and Celeron embedded processors coming soon

While doing some research, I noticed an Intel Core i7-11850HE “Tiger Lake-H” processor on the OpenVino Toolkit website. Parts that end with “E” are usually processors designed for the embedded market. I had never heard about the Tiger Lake-H embedded family, so I looked for “i7-11850HE” processor, and it’s not in Intel Ark, or much anywhere else except on a page in Google Cache, about a COM-HPC module “with the 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® processors (formerly Tiger Lake-H) for FuSa application”. There we have a list of Xeon, Core, and Celeron 11th generation processors that I don’t think have ever been announced: Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 45/35W cTDP Intel Core vPRO i5-11500HE processor […]

July 27, 2021 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Intel packaging & process roadmap to 2025 and beyond

Intel has a mixed history with its ability to keep production schedules for new processes, with notably its 10nm process suffering from years of delays before finally being deployed into chips. But the US company has now held an event unveiling the process & package roadmap through 2025 and beyond, which includes 7nm, 4nm, 3nm, and even the switch the angstrom scale (1A = 0.1 nm) with a 20A process expected in 2024/2025. Intel Process roadmap to 2025 and beyond On the process node sides of things, here’s what to expect in the next few years: Intel 7 delivers 10% to 15% performance-per-watt improvements, and will be found in Alder Lake for client in 2021 and Sapphire Rapids for the data center, with the latter expected to be in production in Q1 2022. Intel 4 promises a 20% performance-per-watt increase over Intel 7, and is the first Intel FinFET node […]

July 10, 2021July 10, 2021 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

Intel Alder Lake hybrid mobile processor family to range from 5W to 55W TDP (leak)

Intel Alder Lake Mobile Hybrid Processors

Intel’s first foray into hybrid processors using Foveros 3D stacking technology did not end well with the company just announcing the end of the life for Lakefield hybrid processors. But the company is not giving up on hybrid technology, and a recent leak shows the Intel Alder Lake family comprised of more powerful mobile hybrid processors will be offered for a wide range of applications from tablets with 5-7W M5 processors and up to “muscle laptops” or mobile workstations (MWS) with H55 processor at 45-55W TDP. Alder Lake hybrid processors will be comprised of high-performance CPU “Golden Cove” cores and energy-efficient Atom-based “Gracemont” CPU cores, in a way that’s similar to Arm’s Cortex-A7x big cores and Cortex-A5x LITTLE cores with big.LITTLE or DynamIQ processing with the goal of optimizing power consumption. The Intel Alder Lake Mobile SKU stack includes processors for 6 market segments including three “new” segments/TDP ranges according […]

July 7, 2021 by Jean-Luc Aufranc (CNXSoft) - 10 Comments

End-of-life notice issued for Intel Lakefield hybrid processors

end-of-life intel lakefield hybrid processor

Intel launched Core i3-L13G4 and Core i5-L16G7 penta-core Lakefield Hybrid processors last year with one high-performance Sunny core, and four high-efficiency Atom Tremont cores, in a way that’s similar to what Arm is doing with DynamIQ and before that, big.LITTLE technology. The new processors were found in Lenovo ThinkPad X1 Fold foldable tablet and Samsung Galaxy Book S laptop, both premium products sold for over $2,000. Even some large websites never got hold of a testing sample of those products, and Anandtech has just reported that Intel published a product change notification (PCN) with the title “Select Intel Core Processors with Intel Hybrid Technology, PCN 118334-00, Product Discontinuance, End of Life”. The discontinuance of Lakefield hybrid processors is a shocker considering they were just introduced last year, but I don’t think it will affect many people as I hadn’t heard about any upcoming boards or products based on Intel’s hybrid […]

May 31, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Intel 5G Solution 5000 5G M.2 module developed with MediaTek, Fibocom

Qualcomm very recently unveiled Snapdragon X65 and X62 5G M.2 card reference designs to help OEM’s develop their own 5G modules for integration into PC’s and CPE’s. But as one should have expected, more options are coming, and Intel have now announced their own “5G Solution 5000” 5G M.2 card for laptops at Computex 2021 in collaboration with MediaTek and Fibocom. Fibocom FM350-GL (Intel 5G Solution 5000) specifications: Modem technologies – 5G NR, 4G LTE, 3D WCDMA Frequency bands – Sub 6GHz for global coverage Data throughput 5G NR – Up to 4.7 Gbps downlink; up to 1.25 Gbps uplink 4G LTE – Up to 1.6 Gbps Cat 19downlink; up to 150 Mbps uplink Built-in eSIM Host interface – PCIe Gen 3 Dimensions – 30 x 52 x2.3 mm (M.2 card) Temperature Range – -10 to +55°C The 5G module targets platforms built upon Intel Tiger Lake and Alder Lake […]

May 14, 2021May 14, 2021 by Jean-Luc Aufranc (CNXSoft) - 8 Comments

Framework Laptop upgradable, repairable & modular laptop pre-orders opened for $799 and up

Most laptops are not made to be serviced by the end-users or expanded. In the part of the world where I live, I still have a “warranty void” sticker if I open my laptop to add an M.2 SSD. There are very few laptops with full documentation and whose companies encourage users to update and modify the hardware. Olimex TERES-I and MNT Reform 2 open-source hardware laptops do offer modularity, customization, and repairability, but they are based on low-power Arm processors and cater to a rather niche market. However, a new company called Framework is preparing to launch a modular laptop that is easily upgradeable and repairable with a more powerful set of features. The Framework laptop is offered with a choice of 11th generation Intel Tiger Lake Core processor, up to 64GB RAM, up to 4TB SSD storage, a 13.5-inch display, a Full HD webcam, a 55Wh battery, and […]