A group of researcher at CERN have evaluated Applied Micro X-Gene 1 64-bit ARM XC-1 development board against Intel Xeon E5-2650 and Xeon Phi SE10/7120 systems, and one of them, David Abdurachmanov, presented their findings at ACAT’ 14 conference (Advanced Computing and Analysis Techniques) by listing some of the issues they had to port their software to 64-bit ARM, and performance efficiency of the three systems for data processing of High Energy Physics (HEP) experiments like those at the Large Hadron Collider (LHC), where performance-per-watt is important, as computing systems may scale to several hundred thousands cores. Intel Xeon Phi platform based on Many Integrated Cores (MIC) computer architecture was launched the HPC market, and contrary to the table above features 61 physical cores. Applied X-Gene 1 (40nm process) was used instead of X-Gene 2 built on 28-nm process which was not available at the time. The ARM platform ran […]
Meet Blocks, a Tizen Modular Smartwatch based on Edison Board
If you like Phoneblocks / Project Ara module model concept, you may also be interested in Blocks, a modular smartwatch comprised of blocks connected via 3.5mm jacks. The watch is running Tizen on Edison development board powered by Intel dual-core Atom + Quark SoC, and part of the 10 finalists of Intel’s Make It Wearable challenge. Most smartwatches comes with a dumb” watchband, but with Blocks both the actual watch, and watchband are smart and customizable. You can change from round to square display, and add modules, which are part of the watchband, adding features like GPS, heat rate monitor, motion sensors, extra battery capacity, SIM card, contactless payment, temperature sensors, and so on. Each module also have a removable cover to let you change the color. One of the main drawbacks of current smartwatches is the battery life (1 to 2 days), so if it is possible to connect […]
Intel / Rockchip XMM 6321 Solution for Low Cost 3G Smartphones and Tablets
Back in May, Intel and Rockchip announced a partnership to develop 3G and LTE “Sofia” SoC for mobile devices, a few months later, Rockchip VP posted a picture of dual core development board (6321 solution) on Weibo with Rockchip and Intel technology, and the companies have showcased solutions based on XMM 6321 during the Hong Kong Electronics Fair. Intel XMM 6321 appears to be a two-chip solution comprised of: XG632 SoC with a dual core Intel processor, a GPU, ISP?, VPU and a 2G/3G modem Intel/Infineon AG620 Communication Combo with 2G/3G RF, Wi-Fi/BT, GPS, GLONASS and Audio/PMU. XG632 will be the first processor from Intel and Rockchip collaboration, but it may not be part of “Sofia” family. with quad core 64-bit Sofia 3G-R and Sofia LTE SoCs coming at later date. XG632 is for entry-level smartphones (<$30) and tablets (<$40), whereas the upcoming Sofia SoCs will be seen in mainstream […]
MEEGO-T01 HDMI TV Stick Supports Android, Windows 8.1, and Ubuntu/Linux
ARM based HDMI TV dongles have been available for over two years, mostly running Android, but the community has managed to install Linux desktop operating systems such as Ubuntu or Debian on these tiny gadgets with some limitations. But now that Intel is making low power SoC for tablets, at least one company has decided to make an HDMI TV stick powered by Intel “Bay Trail-T” Z3735F/G quad core processor, which can run Android, Windows 8.1, and Linux based desktop operating systems such as Ubuntu. Meegopad MEEGO-T01 (aka APM-D01?) hardware specifications: SoC – Intel Atom Z3735F / Z3735G “Bay Trail” quad core processor @ 1.33 GHz (Bust freq: 1.83 GHz) with Intel HD graphics (2W TDP) System Memory 1 GB DDR3L-1333 for Z3735G (32-bit up to 5.3 GB/s) 2 GB DDR3L-1333 for Z3735F (64-bit up to 10.6 GB/s) Storage – 16 or 32 GB eMMC + micro SD slot Video […]
$50 Intel Edison Board for Wearables Features an SoC with a Dual Core Atom Processor, and a Quark MCU
Intel announced the Edison board for wearables applications last January at CES 2014. When it first came out, it looked like an SD card, but the board look has now drastically changed. Nevertheless, the important point is that Intel Edison is now available, together with various development kits, and runs Linux (Yocto built), as well as an RTOS. With the official release, we’ve also got the full specifications: SoC – Dual-core, dual-threaded Intel Atom (Silvermont) processor (22nm) processor @ 500 MHz and a 32-bit Intel Quark micro-controller @ 100 MHz. Includes 1GB LPDDR3 PoP memory System Memory – 1 GB LPDDR3 (PoP memory) – 2 channel 32bits @ 800MT/sec Storage – 4 GB eMMC (v4.51 spec) + micro SD card connector Connectivity – Dual band 802.11 a/b/g/n Wi-Fi (Broadcom 43340) with either an on-board antenna or external antenna, and Bluetooth 4.0 USB – 1x micro USB connector I/Os: 2x UART […]
Intel Reference Design Program for Android Promises Devices with Firmware Updates Tracking AOSP for 2 Years
If you’ve ever bought a low cost Chinese smartphone or tablet, you must know you can’t really expect firmware updates, especially with a different Android version. For example, if you’ve purchased an Android 4.1 phone or tablet a couple of years ago, more likely than not, it’s still stuck to the same version. Intel intends to change all that by launching the Intel Reference Design Program for Android. Yes, Intel has provided reference designs in the past, but this program goes further, especially with regards to Android support, and firmware updates. This is the way it all works: Manufacturers can choose a set of pre-qualified components to build their Android device. Intel will provide a single Android image that works with the drivers to support all components. Intel will take care of GMS (Google Mobile Service), and CTS (pre-)certification for their customers. Intel has committed to provide updates within 2 […]
Intel Unveils Broadwell-Y Core M Processors with 4.5W TDP: 5Y70m 5Y10 and 5Y10a
ARM still have an edge in terms of power efficiency, but Intel has historically had an edge when it comes to process technology, and the company has announced their first 14-nm processors with three Broadwell Core M SoCs. The new process will also help with power efficiency, as all processors have 4.5W TDP, and Intel claims a Core M laptop will deliver twice the compute performance, and seven times more graphics processing power compared to a 2010 laptop powered by a 18W Core i5 processor, while doubling the battery life. Compared to more recent 4th generation Intel Core “Haswell” CPU, the new chips are said to offer up to 50 percent faster CPU performance and 40 percent graphics on a performance-per-watt basis. The company reveals three Core-M processors: 5Y70, 5Y10, and 5Y10a, all dual core / quad thread processor with base frequencies between 800 and 1,100 MHz, and turbo frequencies between […]
Embedded Linux Conference Europe 2014 Schedule – IoT, ARM vs x86, Optimization, Power Management, Debugging…
The Embedded Linux Conference Europe (ELC 2014), CloudOpen, and LinuxCon Europe will jointly take place at the Congress Centre Düsseldorf, in Germany on October 13 – 15, 2014. The 3-day events will consists of keynotes, presentations, and tutorials. Each day will open with two or three keynotes by speakers including Jim Zemlin (Executive Director, Linux Foundation), and Jono Bacon (XPRIZE), followed by presentation and tutorials. There will be 45 presentations for ELCE, 58 for LinuxCon, and 47 for CloudOpen, I’ll make a virtual schedule with a few sessions part of the Embedded Linux Conference Europe “track”. Monday, October 13 11:15 – 12:05 – Performance Analysis Using the Perf Suite by Mans Rullgar, Consultant When faced with a performance problem, the initial steps towards a solution include identifying the sections of code responsible and the precise reasons they are time-consuming. To this end, the ‘perf’ profiling tools provide valuable insight into the […]