AsiaRF AWH575-MF1 is a WiFi HaLow industrial IoT controller / remote control kit with RS232, RS485, I2C, SPI, UART, and 12-bit ADC interfaces to connect sensors or actuators and designed for long-range, low-power M2M communication. The board is comprised of an STMicro STM32U5 Cortex-M33 microcontroller to handle I/Os and communicate with an MM6108 WiFi HaLow (802.11ah) module made by AsiaRF. The board takes power from a USB-C port or optionally from a terminal block supporting a wider 9V to 24V DC input. AsiaRF AWH575-MF1 specifications: MCU – STMicro STM32U585CIT6Q CPU – Arm Cortex-M33 core @ 160 MHz Memory – 786 KB SRAM Storage – 2MB Flash Wi-Fi HaLow AsiaRF 802.11ah module based on Morse Micro MM6108 chipset Frequency Range – 902MHz to 928MHz Channel bandwidth – 1/2/4/8MHz Data Rate – Single-stream max data rate of 10 Mbps Transmit Power – 21dBm +/-2dBm @ MCS 0 Modulation – BPSK/QPSK/16 QAM/64 QAM […]
Radxa CM3J industrial-grade Rockchip RK3568J SoM is compatible with Raspberry Pi Compute Module 4
Radxa CM3J is a Raspberry Pi Compute Module 4 compatible SoM powered by a Rockchip RK3568J industrial-grade quad-core Cortex-A55 SoC and equipped with up to 8GB LPDDR4x and up to 256GB eMMC flash. It’s an update to the Radxa CM3 based on the Rockchip RK3566 SoC with an industrial temperature range and only two board-to-board connectors, and can also be viewed as a cost-down version of the Radxa CM3i with RK3568 and four B2B connectors. It competes directly against the industrial-grade Raspberry Pi Compute Module 4 introduced at the beginning of this month. Radxa CM3J specifications compared to the Radxa CM3 and Raspberry Pi CM4: The Radxa CM3J has been tested with the official Raspberry Pi CM4 IO Board, WaveShare CM4‑POE‑UPS‑BASE, WaveShare CM4‑IO‑BASE‑B, and WaveShare CM4‑NANO‑B, but other carrier boards for the Compute Module 4 may also be supported. Like with other such modules, there’s no 100% pin compatibility with […]
Teledyne Tetra 2.5 GbE line scan camera supports up to 8K resolution for machine vision applications
Teledyne DALSA has recently announced the Tetra line scan camera family with 2.5GbE networking, up to 8K resolution, a line rate of up to 150 kHz, and offered in monochrome or color versions. Traditional cameras (aka scan camera) will capture a full frame, but line scan cameras will only capture one line at a time to scan an object or scene as it moves past the camera providing higher resolution image provided the speed of the scan and the motion of the object are syncrhonized, for instance, on a production line. Line scan cameras like the Tetra are typically used for quality control at the factory, document scanning, license plate scanning, and scientific research (e.g. satellite imaging). Teledyne Tetra specifications: Color cameras Tetra 2k Color – TL-GC-02K05T-00 Resolution – 2048 x 3 Pixel size – 14 μm Max line rate – 50 kHz x 3 Tetra 4k Color – […]
$23 ArmSoM Forge1 industrial SBC is powered by Rockchip RK3506J SoC
ArmSoM Forge1 is an industrial SBC (single board computer) powered by the Rockchip RK3506J triple-core Cortex-A7 processor designed for Smart Audio, HMI, and factory automation applications. The Forge1 is equipped with 512MB RAM, 512MB NAND flash, two Fast Ethernet ports, a MIPI DSI display connector, USB Type-A and Type-C ports, an audio jack, a 40-pin GPIO header partially compatible with Raspberry Pi HATs, and a 16-pin header with speaker output, microphone input, RS-485, and CAN Bus. ArmSoM Forge1 specifications: SoC – Rockchip RK3506J CPU 3x Arm Cortex-A7 core up to 1.5 GHz Arm Cortex-M0 real-time core GPU – 2D GPU only No VPU, no NPU System Memory – 512MB DDR3L Storage 512MB SPI NAND flash MicroSD card Video Output – 2-lane MIPI DSI connector up to 1280 x 1280@ 60FPS Audio 3.5mm audio jack Speaker and Mic via expansion header Networking – 2x 100Mbps Ethernet RJ45 ports USB 1x USB […]
SOMDEVICES µSMARC RZ/V2N system-on-module packs Renesas RZ/V2N MPU in a 82x30mm “micro SMARC” form factor
SOMDEVICES µSMARC RZ/V2N is a system-on-module powered by the Renesas RZ/V2N AI MPU and offered in a micro SMARC (µSMARC) form factor that’s quite smaller at 82x30mm than standard 82x50mm SMARC modules. The company told CNX Software it’s still 100% compatible with SMARC 2.1 with a 314-pin MXM 3.0 edge connector. It’s also cost-effective with a compact PCB and can be used in space-constrained applications. The µSMARC features up to 8GB LPDDR4, up to 128GB eMMC flash, two gigabit Ethernet PHY, and an optional WiFi 5 and Bluetooth 5.1 wireless module. µSMARC RZ/V2N specifications: SoC – Renesas RZ/V2N CPU Quad-core Arm Cortex-A55 @ 1.8 GHz Arm Cortex-M33 @ 200 MHz GPU – Arm Mali-G31 3D graphics engine (GE3D) with OpenGL ES 3.2 and Open CL 2.0 FP VPU – Encode & decode H.264 – Up to 1920×1080 @ 60 fps (Renesas specs, but SOMDEVICES also mentions up to 4K @ 30 […]
EDATEC ED-IPC3630 Raspberry Pi CM5-powered industrial PC gets eight DI, eight DO, and two CAN Bus
EDATEC ED-IPC3630 is an industrial PC (IPC) built around the Raspberry Pi Compute Module 5 (CM5) with up to 8GB RAM and designed for industrial automation, IoT, and control applications with features like a wide 9V to 36V DC power input and a DIN-rail mount. The industrial computer also offers dual GbE, optional WiFi 5 and/or 4G LTE cellular connectivity, HDMI video output, a few USB ports, eight digital inputs (DI), eight digital outputs (DO), and two CAN Bus interfaces. ED-IPC3630 Specifications: SoM – Raspberry Pi CM5 SoC – Broadcom BCM2712 quad-core Cortex-A76 processor @ 2.4GHz with VideoCore VII GPU System Memory – 2GB, 4GB, or 8GB LPDDR4-4267 SDRAM (the 16GB model is not offered, maybe due to supply issues) Storage – Options for 16GB, 32GB, or 64GB eMMC flash Wireless – Optional dual-band WiFi 5 and Bluetooth LE 5.0 module Storage M.2 Key-B socket optionally fitted with 128GB, 256GB, […]
M5Stack StamPLC – An ESP32-S3-based PLC with opto-isolated inputs, relay ouputs, RS485, CAN Bus, and more
“M5Stamp PLC Controller with M5StampS3” or just “M5Stack StamPLC” is a programmable logic controller (PLC) based on the StampS3A ESP32-S3 wireless module and offering 8 opto-isolated digital inputs, 4 relay outputs supporting both AC and DC loads, plus RS485 and CAN Bus interfaces. The DIN Rail IoT controller also features a 1.14-inch color display, a RESET/BOOT button, 3 user buttons, and a buzzer or user interaction. The M5Stack StamPLC also integrates an LM75 temperature sensor and an INA226 voltage/current sensor, as well as a microSD card slot for data storage, and it can take a wide voltage input between 6 and 36V DC. M5Stack StamPLC specfications: Control Module – StampS3A (similar to M5Stamp S3) SoC – Espressif Systems ESP32-S3FN8 CPU – Dual-core 32-bit Xtensa LX7 microcontroller with AI vector instructions up to 240MHz, RISC-V ULP co-processor Memory – 512KB SRAM Storage- 8MB flash Wireless – 2.4GHz WiFi 4 (802.11b/g/n), Bluetooth […]
Forlinx FET3506J-S low power system-on-module features Rockchip RK3506J industrial-grade tri-core Cortex-A7 SoC
Forlinx FET3506J-S system-on-module (SoM) is based on a Rockchip RK3506J SoC, the industrial version of the RK3506 tri-core Cortex-A7 SoC, designed for smart industrial applications, and operating at a low power consumption of about 0.7 Watts. The Rockchip RK3506 SoC was first unveiled in 2023 through a product roadmap. However, we only spotted it in a product at the very end of 2024 with the Luckfox Lyra and Luckfox Lyra Plus featuring a MIPI CSI display connector and optional Ethernet. The Forlinkx FET3506J-S CPU module is the first platform with the industrial version (RK3506J), and the company also provides the OK3506 carrier board/development board for evaluation. Forlinx FET3506J-S system-on-module Specifications: SoC – Rockchip RK3506J CPU 3x Arm Cortex-A7 core up to 1.5 GHz or 1.6 GHz (depending on where one looks in the documentation) Arm Cortex-M0 real-time core GPU – 2D GPU only No VPU, no NPU System Memory – […]