SolidRun i.MX 8XLite SoM embeds DSRC modem, GPS for V2X automotive applications

SolidRun i.MX 8XLite System-on-Module

The GPU-less NXP i.MX 8XLite Cortex-A35/M4 SoC was just announced earlier this month for V2X and IIoT applications, and now SolidRun unveiled the first module based on the new processor with the “i.MX 8XLite System-on-Module”. Also equipped with a RoadLINK SAF5400 safety modem, SolidRun’s Mini SoM targets vehicle telematics, vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications, road infrastructure connectivity, and industrial equipment. SolidRun i.MX 8XLite specifications: SoC – NXP i.MX 8XLite single or dual-cire Cortex-A35 processor @ 1.2 GHz, with Cortex-M4F real-time core System Memory – 1GB LPDDR4 with inline ECC Storage – 8GB eMMC flash Ethernet – NXP TJA1100 100BASE-T1 Automotive Ethernet transceiver Wireless NXP RoadLink SAF5400 DSRC/802.11p (V2X) single modem dual antenna (u.FL connectors) GNSS module for GPS 2x Hirose DF40 board-to-board connectors with: Storage – SD/MMC card, PCIe SSD Ethernet – 100BASE-T1 Automotive Ethernet USB – 2x USB 2.0 PCIe – 1x PCIe Low-speed interfaces – 2x I2C, […]

GPU-less NXP i.MX 8XLite Cortex-A35/M4 SoC is aimed at IIoT & V2X applications

NXP i.MX 8XLite

NXP i.MX 8XLite SoC is a cost-optimized version of NXP i.MX 8X automotive processor with up to two Cortex-A35 cores, one Cortex-M4F real-time core, and in a GPU-less configuration since it lacks the Vivante GPU found in i.MX 8X family. The headless processor also comes with dedicated Hardware Security Modules (HSM) to enable telematics solutions, vehicle-to-everything (V2X) applications including vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) solutions, road infrastructure connectivity, as well as IIoT applications such as industrial equipment and building automation. NXP i.MX 8XLite key features and specifications: Processor complex 1x or 2x Arm Cortex-A35 cores @ up to 1.2 GHz with 256KB L2 cache with ECC 1x Arm Cortex-M4F core for real-time processing Memory I/F – 16-bit DDR3L-1866 and LPDDR4-2400 with ECC protection Storage I/F 1x FlexSPI for fast boot from SPI NOR flash 2x SD 3.0 card interfaces 1x eMMC5.1/SD3.0 NAND (62-bit ECC support) Networking – 1x Gigabit Ethernet […]

PICMG IoT.1 firmware specification targets IoT sensors and effecters

PICMG IoT.1 firmware specifcation

The PICMG consortium is better known for COM Express and COM HPC standards for x86 industrial computers-on-module, but last year they started catering to the IIoT sector with the introduction of the microSAM System-on-Module (micro Sensor Adapter Modules) standard for microcontrollers and IIoT sensors. The consortium has now ratified the IoT.1 firmware specification defining a communication standard between sensors/effecters and local IoT controllers such as microSAM specified by PICMGs IoT.0 specification. The PICMG IoT.1 standard, developed in collaboration with the Distributed Management Task Force (DMTF), defines a vendor-agnostic firmware interface and low-level data model that builds upon the Platform Level Data Model (PLDM) low-level messaging system, and adds features specific to industrial automation and control use cases. If like me, you’ve never heard about PLDM, PICMG explains: The PLDM is a low-level messaging system that supports topologies, eventing and discovery and runs over a variety of system level buses such […]

UP Xtreme i11 Edge Compute Enabling Kit supports 5G, WiFi 6, Myriad X AI accelerator cards

UP Xtreme i11 Edge Compute Enabling Kit

UP! Bridge the Gap, a brand belonging to AAEON Technology, has started taking pre-orders for the UP Xtreme i11 Edge Compute Enabling Kit, a mini PC based on the UP Xtreme i11 Edge Tiger Lake SBC that was first introduced last year, and formally launched last month. The mini PC is offered with Celeron 6305E up to Intel Core i7-1185GRE processor, optional DDR4 and SSD, M.2 sockets for 5G, WiFi 6, or an AI accelerator card based on Movidius Myriad X VPU., serial ports, as well as a Phoenix terminal connector to access some of the GPIOs. UP Xtreme i11 Edge Compute Enabling Kit specifications: Tiger Lake “E”/”GRE” SoC (one or the other) Intel Core i7-1185G7GRE quad-core/8-thread processor @ up to 4.4 GHz with 96 EU Intel Iris Xe Graphics; up to 28W TDP (cTDP 15W) Intel Core i5-1145G7GRE quad-core/8-thread processor @  up to 4.1 GHz with 80 EU Intel […]

SMARC Modules With NXP i.MX 8M Plus Processor (Sponsored)

congatec smarc NXP i.MX8M Plus

Low-power flagship for artificial intelligence – congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with an application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible. That hasn’t always been so easy. Previously, it was usually much more difficult to use the latest processor technology from the Arm environment as a finished system than to implement the x86 environment. This is because, as a result of the historically large range of individually tailored custom designs used in large quantities, the ecosystem of system platforms is not that extensive. However, with the modular approach based on the SMARC computer-on-modules specification, it is now also possible to obtain standard form factors from the x86 box PC range with ARM processors. For example, the embedded computing specialist congatec […]

Vecow unveils Intel Atom x6211E based fanless Box PC & Pico-ITX motherboard

Compact Fanless Embedded Box PC

Vecow EPBC-1000 2.5-inch/Pico-ITX single board computer powered by an Intel Atom x6211E Elkhart Lake processor, and found in the company’s PBC-1000 ultra-compact fanless embedded box PC, is designed for edge applications such as intelligent control, energy management, M2M, In-Vehicle Infotainment (IVI), factory automation, and any AIoT or Industry 4.0 applications. Vecow EPBC-1000 Pico-ITX board and PBC-1000 embedded mini PC specifications: SoC – Intel Atom x6211E dual-core EIkhart Lake processor @ 1.20 GHz / 3.0 GHz (Turbo), with 16 EU Intel UHD graphics @ 350 MHz / 750 MHz, 1.5MB cache; 6W TDP System Memory – 1x DDR4 3200MHz SO-DIMM up to 32GB RAM Storage – 1x SATA III (6Gbps) port Video Output – 1x DisplayPort up to 4096 x 2160 @ 60Hz Audio 1x Mic-in, 1x Line-out Realtek ALC888S-VD, 7.1 Channel HD audio codec Networking 2x Gigabit Ethernet port via Realtek RTL8119I Ethernet Controllers Optional WiFi/Bluetooth or 4G LTE via […]

Qualcomm QCM2290/QCS2290 SoM and Devkit target Industrial IoT applications

Last June, Qualcomm introduced several industrial IoT solutions that we did not cover at the time with Qualcomm QCM2290/QCS2290 IoT chip for camera applications, industrial handhelds, retail and tracking, Qualcomm QCS8250 WiFI 6 & 5G SoC for connected healthcare, digital signage, retail, and video collaboration, Qualcomm QCS6490/QCM6490 WiFI 6E & 5G SoC for connected healthcare, logistics management, retail, transportation, and warehousing, and Qualcomm QCS4290/ QCM4290 designed for cameras, industrial handhelds, and security panels with 4G LTE and WiFi 6 connectivity. Shortly after Qualcomm’s announcement, Thundercomm introduced the TurboX C2290/CM2290 system-on-module respectively based on Qualcomm’s quad-core Cortex-A53 QCS2290 SoC and QCM2290 SoC adding 4G connectivity. The module also offers WiF & Bluetooth, as well as MIPI display & camera interfaces, and the TurboX CM2290/C2290 development kit is also available to get started. TurboX CM2290 and C2290 SoM Specifications: SoC – Qualcomm Snapdragon QCM2290 or QCS2290 quad-core Cortex-A53 processor at up to […]

M5Stack Atom DTU LoRaWAN Kit also supports WiFi, RS485, Modbus communication

ESP32 WiFI, Bluetooth, LoRaWAN, and RS485 kit

M5Stack is known for its ESP32 based building blocks for the IoT with WiFi & Bluetooth wireless connectivity, I/O headers, and block-specific features like a tiny color display, a speaker, a touchscreen display, a camera, and more. The company’s latest product is the M5Stack Atom DTU LoRaWAN Kit based on ESP32 ATOM Lite, as well as ASR Micro ASR6501 LoRa module (SX1302 based) and one RS485 header that allows for industrial communication notably with the Modbus protocol. M5Stack Atom DTU LoRaWAN Kit specifications: Wireless connectivity  M5Stack ATOM Lite with ESP32 WiFi 4 and Bluetooth 4.2/5.x dual-core SoC ASR ASR6501 LoRa chip Operating frequency – 868MHz or 915 MHz Transmit power – Up to +21dBm RX sensitivity – Up to -137dBm (SF=12/BW=125KHz) Serial communication – UART 115200bps (AT command) via ESP32 Antenna – SMA antenna connector Power consumption @ 3.3V (from ASR6501 datasheet) Tx @ +21dBm – 106 mA Rx – […]

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